Patents by Inventor Shuhei Gotanda

Shuhei Gotanda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11852126
    Abstract: A cryopump system includes a plurality of cryopumps, each cryopump including a rough valve connecting the cryopump to a common rough pump and a pressure sensor measuring a pressure in the cryopump, and a controller that controls, for each cryopump, the rough valve based on a measured pressure from the pressure sensor such that the cryopump is decompressed to a first reference pressure by the common rough pump and thereafter a vacuum is maintained in the cryopump, and the cryopump is further decompressed to a second reference pressure lower than the first reference pressure by the common rough pump. The controller is configured to, based on the measured pressure from the pressure sensor of a first cryopump, open the rough valve of a second cryopump such that the second cryopump is decompressed to the first reference pressure while the vacuum is maintained in the first cryopump.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: December 26, 2023
    Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
    Inventors: Shuhei Gotanda, Kakeru Takahashi
  • Publication number: 20230392831
    Abstract: A cryopump includes: a cryopump container including a container body defining a cryopump intake port and extending axially and tubularly from the cryopump intake port, and a cryocooler accommodation cylinder connected to a side portion of the container body and extending transversely; a cryocooler fixed to the cryocooler accommodation cylinder and extending transversely within the cryopump container; a plurality of cryopanels thermally coupled to the second cooling stage of the cryocooler, capable of adsorbing a non-condensable gas, and axially arranged between the cryopump intake port and a bottom portion of the container body; and a purge gas inlet installed in the container body below the cryocooler accommodation cylinder to blow a purge gas to a distal portion of at least one of the cryopanels.
    Type: Application
    Filed: August 17, 2023
    Publication date: December 7, 2023
    Inventors: Shuhei Gotanda, Takahiro Nakanishi
  • Patent number: 11828521
    Abstract: A cryopump includes: a cryocooler which includes a high-temperature cooling stage and a low-temperature cooling stage; a radiation shield which surrounds the low-temperature cooling stage, extends in an axial direction, and is thermally coupled to the high-temperature cooling stage; a plurality of adsorption cryopanels which are disposed between a cryopump intake port and the low-temperature cooling stage in the axial direction and are thermally coupled to the low-temperature cooling stage; and a condensation cryopanel which is disposed between the radiation shield and the plurality of adsorption cryopanels in a radial direction, is thermally coupled to the low-temperature cooling stage, and has a tubular shape extending in the axial direction and being open at both ends.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: November 28, 2023
    Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
    Inventor: Shuhei Gotanda
  • Publication number: 20200400365
    Abstract: A cryopump includes: a cryocooler which includes a high-temperature cooling stage and a low-temperature cooling stage; a radiation shield which surrounds the low-temperature cooling stage, extends in an axial direction, and is thermally coupled to the high-temperature cooling stage; a plurality of adsorption cryopanels which are disposed between a cryopump intake port and the low-temperature cooling stage in the axial direction and are thermally coupled to the low-temperature cooling stage; and a condensation cryopanel which is disposed between the radiation shield and the plurality of adsorption cryopanels in a radial direction, is thermally coupled to the low-temperature cooling stage, and has a tubular shape extending in the axial direction and being open at both ends.
    Type: Application
    Filed: September 2, 2020
    Publication date: December 24, 2020
    Inventor: Shuhei Gotanda