Abstract: A method of connecting a wire with a terminal including a plurality of conductors is provided. The method includes: positioning the terminal by holding a part of the terminal between an upper side jig and a lower side jig; and connecting the wire and one of a plurality of conductors, which is exposed on a surface of the positioned terminal. The terminal includes a laminate structure that includes an insulator interposed between a first conductor and a second conductor. The part of the terminal held in the positioning of the terminal includes a pressure receiving area, where a contact area between the upper side jig and an upper surface of the terminal and a contact area between the lower side jig and a lower surface of the terminal overlap. The laminate structure exists outside of the pressure receiving area, and does not exist in the pressure receiving area.

Abstract: A method of connecting a wire with a terminal including a plurality of conductors is provided. The method includes: positioning the terminal by holding a part of the terminal between an upper side jig and a lower side jig; and connecting the wire and one of a plurality of conductors, which is exposed on a surface of the positioned terminal. The terminal includes a laminate structure that includes an insulator interposed between a first conductor and a second conductor. The part of the terminal held in the positioning of the terminal includes a pressure receiving area, where a contact area between the upper side jig and an upper surface of the terminal and a contact area between the lower side jig and a lower surface of the terminal overlap. The laminate structure exists outside of the pressure receiving area, and does not exist in the pressure receiving area.

Abstract: A method of connecting a wire with a terminal including a plurality of conductors is provided. The method includes: positioning the terminal by holding a part of the terminal between an upper side jig and a lower side jig; and connecting the wire and one of a plurality of conductors, which is exposed on a surface of the positioned terminal. The terminal includes a laminate structure that includes an insulator interposed between a first conductor and a second conductor. The part of the terminal held in the positioning of the terminal includes a pressure receiving area, where a contact area between the upper side jig and an upper surface of the terminal and a contact area between the lower side jig and a lower surface of the terminal overlap. The laminate structure exists outside of the pressure receiving area, and does not exist in the pressure receiving area.

Abstract: Power electronics devices having thermal stress reduction elements are disclosed. A power electronics device includes a heat source having a heat source perimeter, a first conduction member coupled to the heat source, and a substrate coupled to the first conduction member. The first conduction member includes a support portion that extends to at least the heat source perimeter and a plurality of finger portions extending from the support portion and separated from one another by web regions, where the plurality of finger portions have a finger thickness that is greater than a web thickness of the web regions.

Abstract: Power electronics modules having solder layers with reduced thermal-stress are disclosed. In one embodiment, a power electronics module includes a power electronics device having a first surface, a second surface, a first edge, and a second edge opposite the first edge. The power electronics device has a device length measured from the first edge to the second edge. A first solder layer is adjacent to the first surface of the power electronics device, and a second solder layer is adjacent to the second surface. The first solder layer and the second solder layer have a maximum thickness T along a length that is less than the device length of the power electronics device. A first thermally conductive layer is adjacent to the first solder layer, and a second thermally conductive layer is adjacent to the second solder layer. In some embodiments, the first and second solder layers have tapered portions.

Abstract: Power electronics modules having solder layers with reduced thermal-stress are disclosed. In one embodiment, a power electronics module includes a power electronics device having a first surface, a second surface, a first edge, and a second edge opposite the first edge. The power electronics device has a device length measured from the first edge to the second edge. A first solder layer is adjacent to the first surface of the power electronics device, and a second solder layer is adjacent to the second surface. The first solder layer and the second solder layer have a maximum thickness T along a length that is less than the device length of the power electronics device. A first thermally conductive layer is adjacent to the first solder layer, and a second thermally conductive layer is adjacent to the second solder layer. In some embodiments, the first and second solder layers have tapered portions.