Abstract: An electronic device includes a first substrate, a first conductive element, a second conductive element and a circuit board. The first substrate has a first surface, a first side surface and a second surface. The first side surface is connected between the first surface and the second surface. The first conductive element is disposed on the first surface of the first substrate. The second conductive element is electrically connected to the first conductive element. The second conductive element includes a first part and a second part. The first part is disposed on the first side surface of the first substrate, the second part is disposed on the second surface of the first substrate, and the first part is connected to the second part. The circuit board is disposed on the second surface of the first substrate and electrically connected to the second part of the second conductive element.

Abstract: An electronic device includes a first substrate including a first surface and a first side-surface adjacent to the first surface, a second substrate including a second surface and a second side-surface adjacent to the second surface, a plurality of first conductive wires disposed on the first surface, a plurality of dam walls disposed on the first surface and located between any adjacent two of the first conductive wires respectively and a plurality of second conductive wires disposed on the first side-surface and the second side-surface. The plurality of first conductive wires are electrically connected to the plurality of second conductive wires respectively.

Abstract: An electronic device includes a first substrate, a second substrate, a first conductive element, a second conductive element and a third conductive element. The first substrate has a top surface and a first side surface. The second substrate is oppositely disposed on the first substrate and has a second side surface parallel to the first side surface. The first conductive element and the third conductive element are disposed on the top surface of the first substrate. The second conductive element is disposed on the first side surface of the first substrate and the second side surface of the second substrate. The third conductive element contacts the first conductive element to define a first contact area, the third conductive element contacts the second conductive element to define a second contact area, and the first contact area is greater than the second contact area.

Abstract: An electronic device includes a first substrate, a second substrate, a first conductive element, a second conductive element and a third conductive element. The first substrate has a top surface and a first side surface. The second substrate is oppositely disposed on the first substrate and has a second side surface parallel to the first side surface. The first conductive element and the third conductive element are disposed on the top surface of the first substrate. The second conductive element is disposed on the first side surface of the first substrate and the second side surface of the second substrate. The third conductive element contacts the first conductive element to define a first contact area, the third conductive element contacts the second conductive element to define a second contact area, and the first contact area is greater than the second contact area.

Abstract: A method of manufacturing an electronic device is provided, wherein the method includes the following steps. A first substrate is provided, wherein the first substrate has a top surface and a side surface. A first wire is formed on the top surface of the first substrate. An auxiliary bonding pad is formed on the top surface of the first substrate, and the auxiliary bonding pad contacts the first wire. A second wire is formed on the side surface of the first substrate, and the second wire contacts the auxiliary bonding pad. The second wire and the auxiliary bonding pad include at least one same material.

Abstract: A method of manufacturing an electronic device is provided, wherein the method includes the following steps. A first substrate is provided, wherein the first substrate has a top surface and a side surface. A first wire is formed on the top surface of the first substrate. An auxiliary bonding pad is formed on the top surface of the first substrate, and the auxiliary bonding pad contacts the first wire. A second wire is formed on the side surface of the first substrate, and the second wire contacts the auxiliary bonding pad. The second wire and the auxiliary bonding pad include at least one same material.

Abstract: An electronic device includes a first substrate including a first surface and a first side-surface adjacent to the first surface, a second substrate including a second surface and a second side-surface adjacent to the second surface, a plurality of first conductive wires disposed on the first surface, a plurality of dam walls disposed on the first surface and located between any adjacent two of the first conductive wires respectively and a plurality of second conductive wires disposed on the first side-surface and the second side-surface. The plurality of first conductive wires are electrically connected to the plurality of second conductive wires respectively.

Abstract: An electronic device includes a substrate having a top surface, a bottom surface and a side surface between the top surface and the bottom surface, and a test circuit disposed on the substrate. The test circuit extends from the top surface to the bottom surface through the side surface of the substrate and has a current terminal for an ammeter and a voltage terminal for a voltmeter, both of which are disposed on the bottom surface.

Abstract: An embodiment of the disclosure provides an electronic device including multiple units. Each unit in the units includes multiple primary bonding regions and at least one reserved bonding region. Each reserved bonding region is connected to the primary bonding regions. The number of the at least one reserved bonding region is less than the number of primary bonding regions.

Abstract: An electronic device includes a substrate having a top surface, a bottom surface and a side surface between the top surface and the bottom surface, and a test circuit disposed on the substrate. The test circuit extends from the top surface to the bottom surface through the side surface of the substrate and has a current terminal for an ammeter and a voltage terminal for a voltmeter, both of which are disposed on the bottom surface.

Abstract: A gas turbine combustor includes a pilot burner disposed on a central portion of a combustion liner; and a plurality of main burners disposed to surround the pilot burner. The pilot burner includes: a pilot nozzle disposed on the central portion of the combustion liner; and a pilot cone including a widened portion widening downstream away from a downstream end of the pilot nozzle, and an annular portion having an annular shape extending outward in a radial direction from a downstream opening end of the widened portion. The annular portion includes a first position in a circumferential direction and a second position different from the first position in the circumferential direction, and the first position and the second position have different widths in the radial direction.

Abstract: The present disclosure includes an electronic device including a wiring structure, the wiring structure includes a first wiring pattern including a plurality of first input wires and a plurality of first output wires, a second wiring pattern including a plurality of second bridge wires, one second bridge wiring crosses at least one of the plurality of first input wires or at least one of the plurality of first output wires, and a first insulating layer disposed between the first wiring pattern and the second wiring pattern, the plurality of first input wires are electrically connected to the first output wires through the second bridge wires.

Abstract: A gas turbine combustor includes a pilot burner disposed on a central portion of a combustion liner; and a plurality of main burners disposed to surround the pilot burner. The pilot burner includes: a pilot nozzle disposed on the central portion of the combustion liner; and a pilot cone including a widened portion widening downstream from a vicinity of a downstream end of the pilot nozzle, and an annular portion having an annular shape extending outward in a radial direction from a downstream opening end of the widened portion. The annular portion includes a first position in a circumferential direction and a second position different from the first position in the circumferential direction, and the first position and the second position have different widths in the radial direction.

Abstract: A thrust control valve equipped with: a valve element, in which a gas injection passage, through which an operating gas is injected, is formed, with a valve-seating surface being formed in the gas injection passage; and a valve stem, which is provided in the interior of the gas injection passage and has a seated surface that makes contact with the valve-seating surface. A guide surface which makes contact with the inner circumferential surface of the gas injection passage of the valve element is formed on the outer circumferential surface of the valve stem. The guide surface is formed downstream from the seated surface in the direction of flow of the operating gas. A V-groove through which the operating gas flows is formed at the tip of the valve stem, downstream from the seated surface in which the guide surface is formed.

Abstract: A thrust control valve equipped with: a valve element, in which a gas injection passage, through which an operating gas is injected, is formed, with a valve-seating surface being formed in the gas injection passage; and a valve stem, which is provided in the interior of the gas injection passage and has a seated surface that makes contact with the valve-seating surface. A guide surface which makes contact with the inner circumferential surface of the gas injection passage of the valve element is formed on the outer circumferential surface of the valve stem. The guide surface is formed downstream from the seated surface in the direction of flow of the operating gas. A V-groove through which the operating gas flows is formed at the tip of the valve stem, downstream from the seated surface in which the guide surface is formed.