Patents by Inventor Shuhei Iwade

Shuhei Iwade has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device including a resilient bonding resin
    Patent number: 4903118
    Abstract: A semiconductor device comprising a semiconductor chip attached to a substrate by two kinds of bonding agents, one of which is rigid and disposed at the central region of the semiconductor chip, the other of which is disposed around the rigid bonding agent and which is sufficiently resilient to accommodate thermal expansion differences between the semiconductor chip and the substrate.
    Type: Grant
    Filed: March 30, 1988
    Date of Patent: February 20, 1990
    Assignee: Director General, Agency of Industrial Science and Technology
    Inventor: Shuhei Iwade