Patents by Inventor Shuhei Kuzume

Shuhei Kuzume has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230407454
    Abstract: The present disclosure relates to a multilayer structure including: a laminate including a base (X) and at least two layers (Y), the layers (Y) being provided on both faces of the base (X); and layers (Z) containing a thermoplastic resin.
    Type: Application
    Filed: November 2, 2021
    Publication date: December 21, 2023
    Applicant: Kuraray Co., Ltd.
    Inventors: Shuhei Kuzume, Tatsuya Oshita
  • Publication number: 20230025201
    Abstract: The present disclosure provides packaging materials and products including such as a multilayer structure comprising a base (X), a layer (Y), and a layer (Z), in which the layer (Y) and the layer (Z) are adjacently stacked in at least one pair of the layer (Y) and the layer (Z).
    Type: Application
    Filed: December 9, 2020
    Publication date: January 26, 2023
    Applicant: KURARAY CO., LTD.
    Inventors: Shuhei Kuzume, Tatsuya Oshita
  • Publication number: 20230017050
    Abstract: The present invention provides a multilayer structure that has excellent gas barrier properties and an excellent peel strength between a base and a gas barrier layer after retorting, and that can retain a good appearance with no delamination even after retorting under stress. The present invention also provides packaging materials and products including such a multilayer structure. The present invention relates to a multilayer structure comprising a base (X), a layer (Z) stacked on the base (X), and a layer (Y) stacked on the layer (Z), the layer (Y) containing a reaction product (D) of an aluminum-containing metal oxide (A) and an inorganic phosphorus compound (BI), the layer (Z) containing a polyvinyl alcohol resin (C) and a polyester resin (L).
    Type: Application
    Filed: December 4, 2020
    Publication date: January 19, 2023
    Applicant: KURARAY CO., LTD.
    Inventors: Shuhei Kuzume, Ryoichi Sasaki, Yasushi Morihara