Abstract: A method for manufacturing a semiconductor substrate, including: applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a resist underlayer film directly or indirectly on the substrate; forming a resist pattern directly or indirectly on the resist underlayer film; and performing etching using the resist pattern as a mask. The composition for forming a resist underlayer film contains: a polymer having a repeating unit represented by formula (1) and a solvent. Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a monovalent group including an aromatic ring having 5 to 40 ring atoms and includes at least one group selected from the group consisting of groups represented by formula (2-1) and groups represented by formula (2-2).

Abstract: Disclosed is an additive for a plastic, comprising fine particles obtained by calcination and slaking of a dolomite which exhibits two endothermic peaks in the differential thermal analysis, said fine particles containing calcium carbonate, magnesium carbonate, magnesium oxide, calcium hydroxide and magnesium hydroxide as main chemical components and also containing an ignition loss component in an amount of 10 to 40% by weight based on the weight of said fine particles. A plastic hating hydrogen chloride scavenging properties and antimicrobial properties imparted by incorporating the additive for a plastic is also disclosed.

Abstract: A method of operating a heat pump having at least one circuit for circulation of a refrigerant comprising a compressor, a once-through path, complete counterflow type condenser as a high-temperature heat output means, an expansion valve and a low-temperature heat output means (evaporator or a segregated low-stage circuit for circulation of a lower-boiling-point refrigerant), which comprises choosing a supercool degree, which is equal to the difference between a saturation temperature and an outlet temperature of the refrigerant, to satisfy the conditions that a temperature effectiveness of refrigerant liquid as defined by the formula: ##EQU1## is at least 40% and the temperature difference of the denominator is at least 35.degree. C. As a result, boiling water of ca. 100.degree. C. or other high-temperature fluids can be discharged with a large temperature difference.