Patents by Inventor Shuhei OSHIDA

Shuhei OSHIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laser machining device and control method therefor
    Patent number: 11260470
    Abstract: A laser machining device which condenses a laser light inside a wafer and forms modified regions in a plurality of layers in the wafer, includes an infrared imaging optical system configured to face one surface of the wafer. In a case where a modified region positioned on a side of another surface opposite to the one surface of the wafer is defined as a first modified region and another modified region is defined as a second modified region, among the modified regions in the plurality of layers, the infrared imaging optical system has a focusing range that includes the first modified region and the another surface, and simultaneously images the first modified region and the another surface, and the second modified region is positioned outside the focusing range.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: March 1, 2022
    Assignee: TOKYO SEIMITSU CO., LTD.
    Inventors: Takashi Shimanuki, Masanobu Koyata, Shuhei Oshida
  • LASER MACHINING DEVICE AND CONTROL METHOD THEREFOR
    Publication number: 20210276121
    Abstract: A laser machining device which condenses a laser light inside a wafer and forms modified regions in a plurality of layers in the wafer, includes an infrared imaging optical system configured to face one surface of the wafer. In a case where a modified region positioned on a side of another surface opposite to the one surface of the wafer is defined as a first modified region and another modified region is defined as a second modified region, among the modified regions in the plurality of layers, the infrared imaging optical system has a focusing range that includes the first modified region and the another surface, and simultaneously images the first modified region and the another surface, and the second modified region is positioned outside the focusing range.
    Type: Application
    Filed: May 6, 2021
    Publication date: September 9, 2021
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Takashi SHIMANUKI, Masanobu KOYATA, Shuhei OSHIDA