Patents by Inventor Shuhei Tsuda

Shuhei Tsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for bonding substrates
    Patent number: 6620285
    Abstract: A method for bonding substrates to tightly bond two overlaid substrates comprises the steps of: aligning the substrates, freely falling a second substrate onto a first substrate to overlay the first and second substrates; interposing an air layer between the joining surfaces of the first and second substrates, aligning the first and second substrates and holding the aligned first and second substrates; and pressing one point of the aligned two substrates. Thus, the bonded substrates which can be aligned accurately and free from occurrence of voids or the like can be obtained.
    Type: Grant
    Filed: October 10, 2001
    Date of Patent: September 16, 2003
    Assignee: Sumitomo Metal Industries
    Inventors: Shinichi Tomita, Shuhei Tsuda, Yasunobu Ikeda
  • Method for bonding substrates
    Publication number: 20020040754
    Abstract: A method for bonding substrates to tightly bond two overlaid substrates comprises the steps of: aligning the substrates, freely falling a second substrate onto a first substrate to overlay the first and second substrates; interposing an air layer between the joining surfaces of the first and second substrates, aligning the first and second substrates and holding the aligned first and second substrates; and pressing one point of the aligned two substrates. Thus, the bonded substrates which can be aligned accurately and free from occurrence of voids or the like can be obtained.
    Type: Application
    Filed: October 10, 2001
    Publication date: April 11, 2002
    Inventors: Shinichi Tomita, Shuhei Tsuda, Yasunobu Ikeda