Patents by Inventor Shuhei Ueda
Shuhei Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240072203Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicants: SemiLEDs Corporation, SHIN-ETSU CHEMICAL CO., LTD.Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
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Publication number: 20240063339Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.Type: ApplicationFiled: October 26, 2023Publication date: February 22, 2024Applicants: SamiLEDs Corporation, SHIN-ETSU CHEMICAL. CO., LTD.Inventors: Chen-Fu Chu, SHIH-KAI CHAN, YI-FENG SHIH, DAVID TRUNG DOAN, TRUNG TRI DOAN, YOSHINORI OGAWA, KOHEI OTAKE, KAZUNORI KONDO, KEIJI OHORI, TAICHI KITAGAWA, NOBUAKI MATSUMOTO, TOSHIYUKI oZAI, SHUHEI UEDA
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Patent number: 11862754Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.Type: GrantFiled: May 10, 2022Date of Patent: January 2, 2024Assignees: SemiLEDs Corporation, Shin-Etsu Chemical Co., Ltd.Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
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Patent number: 11862755Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.Type: GrantFiled: July 20, 2022Date of Patent: January 2, 2024Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
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Publication number: 20230018855Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate [30], and forming a plurality of die sized semiconductor structures [32] on the substrate [30]. The method also includes the steps of providing a receiving plate [42] having an elastomeric polymer layer [44], placing the substrate [30] and the receiving plate [42] in close proximity with a gap [101] therebetween, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate [30] to the semiconductor layer [50] at an interface with the substrate [30] to lift off the semiconductor structures [32] through the gap [101] onto the elastomeric polymer layer [44]. During the laser lift-off (LLO) process the elastomeric polymer layer [44] functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures [32] in place on the receiving plate [42].Type: ApplicationFiled: August 3, 2022Publication date: January 19, 2023Applicants: SemiLEDs Corporation, SHIN-ETSU CHEMICAL CO., LTD.Inventors: CHEN-FU CHU, SHIH-KAI CHAN, YI-FENG SHIH, DAVID TRUNG DOAN, TRUNG TRI DOAN, YOSHINORI OGAWA, KOHEI OTAKE, KAZUNORI KONDO, KEIJI OHORI, TAICHI KITAGAWA, NOBUAKI MATSUMOTO, TOSHIYUKI OZAI, SHUHEI UEDA, JUNYA ISHIZAKI
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Publication number: 20220359785Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.Type: ApplicationFiled: July 20, 2022Publication date: November 10, 2022Applicants: SemiLEDS Corporation, Shin-Etsu Chemical Co., Ltd.Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
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Publication number: 20220339449Abstract: An electrical stimulation therapeutic device includes a pair of application electrodes which are disposed at the back of a sacral bone of a person to be treated and supplies an electrical stimulation signal from the back of the sacral bone, a detection electrode which is disposed on a surface of a toe of the person to be treated and detects a myoelectric signal of the toe, a display portion which determines whether the myoelectric signal of the toe is generated in response to the stimulation signal, and a myoelectric signal processing portion which processes the myoelectric signal detected by the detection electrode to display it visually on the display portion, in which the myoelectric signal processing portion does not detect the myoelectric signal of the toe during a predetermined detection stop period of time from output of the stimulation signal, and the detection stop period of time is set on the basis of a quotient (x/v) obtained when a distance (x) from a sacral bone of a human body to a surface of aType: ApplicationFiled: December 26, 2019Publication date: October 27, 2022Applicants: OTSUKA TECHNO CORPORATION, ITO CO., LTD.Inventors: Takashi HISAMOTO, Yoichi MUKAI, Tetsuya MASUDA, Hiroki KAKUYAMA, Koji MAEDA, Shuhei UEDA
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Publication number: 20220315418Abstract: A method for transferring microstructures, comprising at least the steps of: (i) bonding a plurality of microstructures formed on one surface of a supplier substrate to a silicone-based rubber layer formed on a donor substrate; (ii) separating some or all of the plurality of microstructures from the supplier substrate and transferring the some or all of the plurality of microstructures to the donor substrate through the silicone-based rubber layer to produce the donor substrate having the to plurality of microstructures temporality fixed thereon; (iii) washing or neutralizing the donor substrate having the plurality of microstructures temporality fixed thereon; (iv) drying the washed or neutralized donor substrate having the plurality of microstructures temporality fixed thereon; and (v) transferring the dried donor substrate having the plurality of microstructures temporality fixed thereof so that the donor substrate can be subjected to a subsequent step.Type: ApplicationFiled: July 6, 2020Publication date: October 6, 2022Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Yoshinori OGAWA, Keiji OHORI, Shuhei UEDA, Kazunori KONDO, Toshiyuki OZAI, Nobuaki MATSUMOTO, Taichi KITAGAWA, Kohei OTAKE, Minoru KAWAHARA
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Publication number: 20220271198Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.Type: ApplicationFiled: May 10, 2022Publication date: August 25, 2022Applicants: SemiLEDs Corporation, SHIN-ETSU CHEMICAL CO., LTD.Inventors: Chen-Fu Chu, SHIH-KAI CHAN, YI-FENG SHIH, DAVID TRUNG DOAN, TRUNG TRI DOAN, YOSHINORI OGAWA, KOHEl OTAKE, KAZUNORI KONDO, KEIJI OHORI, TAICHI KITAGAWA, NOBUAKI MATSUMOTO, TOSHIYUKI OZAi, SHUHEI UEDA
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Patent number: 11417799Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.Type: GrantFiled: August 7, 2020Date of Patent: August 16, 2022Assignees: SemiLEDs Corporation, Shin-Etsu Chemical Co., Ltd.Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
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Publication number: 20220124949Abstract: A stamp head unit including: a stamp component including at least a silicone-based rubber film on a quartz glass substrate; a stamp-component-holding component including a surface having a hole for vacuum suction of a surface of the quartz glass substrate of the stamp component; and a tubular component having an evacuation suction hole connected to communicate with the hole for vacuum suction so as to maintain a vacuum, and being coupled and fixed with the stamp-component-holding component. This provides: a stamp component that can be fixed stably by a simple and convenient vacuum chuck system; a stamp head unit with which the stamp component can be replaced in a short time; and a microstructure-transfer apparatus provided with the stamp component and the stamp head unit.Type: ApplicationFiled: December 10, 2019Publication date: April 21, 2022Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Hideo NAKAGAWA, Yoshinori OGAWA, Nobuaki MATSUMOTO, Shuhei UEDA, Keiji OHORI, Kohei OTAKE
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Publication number: 20210355025Abstract: Provided is a substrate for transferring microstructures such as a micro LED including an engraved mark. The substrate for transferring microstructures is less likely to cause a recognizing error of the engraved mark to occur in a reading device, and makes it possible to stably and continuously read the engraved mark. A substrate for transferring microstructures includes a synthetic quartz glass substrate and a silicone pressure-sensitive adhesive agent layer provided on a front surface of the synthetic quartz glass substrate. The substrate includes an engraved mark provided in the from surface.Type: ApplicationFiled: May 6, 2021Publication date: November 18, 2021Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Shuhei UEDA, Masaki TAKEUCHI, Hiroyuki YAMAZAKI, Kento TSUKADA
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Publication number: 20210066541Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.Type: ApplicationFiled: August 7, 2020Publication date: March 4, 2021Applicants: SemiLEDs Corporation, SHIN-ETSU CHEMICAL CO., LTD.Inventors: Chen-Fu Chu, Shih-Kai CHAN, Yi-Feng SHIH, David Trung DOAN, Trung Tri DOAN, Yoshinori OGAWA, Kohei OTAKE, Kazunori KONDO, Keiji OHORI, Taichi KITAGAWA, Nobuaki MATSUMOTO, Toshiyuki OZAI, Shuhei UEDA
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Patent number: 10680139Abstract: An optical device package comprising a receptacle, an optical device received therein, and a window member disposed forward of the receptacle in a light emitting direction of the optical device. The window member is a member of synthetic quartz glass having front and back surfaces, at least one of the front and back surfaces being a rough surface.Type: GrantFiled: August 2, 2017Date of Patent: June 9, 2020Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Shuhei Ueda, Masaki Takeuchi, Harunobu Matsui
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Patent number: 10281612Abstract: A synthetic quartz glass substrate having front and back surfaces is worked by lapping, etching, mirror polishing, and cleaning steps for thereby polishing the front surface of the substrate to a mirror-like surface. The etching step is carried out using a hydrofluoric acid solution at pH 4-7.Type: GrantFiled: January 18, 2017Date of Patent: May 7, 2019Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Shuhei Ueda, Masaki Takeuchi
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Patent number: 10065285Abstract: A substrate is prepared by polishing a surface of the substrate using a polishing pad while feeding a slurry. The polishing pad has a porous nap layer which comes in contact with the substrate surface and is made of a base resin comprising at least three resins, typically an ether resin, ester resin, and polycarbonate resin. The polished substrate has a highly flat surface with a minimal number of defects.Type: GrantFiled: November 13, 2012Date of Patent: September 4, 2018Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Harunobu Matsui, Daijitsu Harada, Atsushi Watabe, Shuhei Ueda, Masaki Takeuchi
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Patent number: 9919962Abstract: Disclosed is a polishing agent for synthetic quartz glass substrates, which is characterized by containing a colloidal solution of a colloidal silica or the like having a colloid concentration of 20-50% by mass, and a polycarboxylic acid polymer, an acidic amino acid, a phenol or a glycosaminoglycan.Type: GrantFiled: October 9, 2014Date of Patent: March 20, 2018Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Daijitsu Harada, Masaki Takeuchi, Yukio Shibano, Shuhei Ueda, Atsushi Watabe
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Publication number: 20180040778Abstract: An optical device package comprising a receptacle, an optical device received therein, and a window member disposed forward of the receptacle in a light emitting direction of the optical device. The window member is a member of synthetic quartz glass having front and back surfaces, at least one of the front and back surfaces being a rough surface.Type: ApplicationFiled: August 2, 2017Publication date: February 8, 2018Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Shuhei UEDA, Masaki TAKEUCHI, Harunobu MATSUI
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Publication number: 20170123102Abstract: A synthetic quartz glass substrate having front and back surfaces is worked by lapping, etching, mirror polishing, and cleaning steps for thereby polishing the front surface of the substrate to a mirror-like surface. The etching step is carried out using a hydrofluoric acid solution at pH 4-7.Type: ApplicationFiled: January 18, 2017Publication date: May 4, 2017Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Shuhei Ueda, Masaki Takeuchi
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Patent number: D948553Type: GrantFiled: March 6, 2020Date of Patent: April 12, 2022Assignees: OTSUKA TECHNO CORPORATION, ITO CO., LTD.Inventors: Takashi Hisamoto, Yoichi Mukai, Tetsuya Masuda, Hiroki Kakuyama, Shuhei Ueda, Shinji Matsumoto, Koji Tsuji