Abstract: An antenna unit and a computing system utilizing the antenna unit are disclosed. The antenna is compact and can be fabricated at low cost and with high accuracy. The antenna unit comprises an antenna and a connection cable. The antenna unit is constructed by forming the antenna and the connection cable integrally on a preferably flexible insulating film using preferably the FPC (Flexible Printed Circuit) technique. The computing system comprises a body having its main operational circuits and a hinged cover having a display. The flexible printed antenna is formed integrally with its module of electric components using the FPC technique and is made to span the body and the cover. The antenna itself and the connection cable can be freely bent or folded, resulting in higher freedom in their positioning within the computer system body and cover.

Abstract: An antenna unit and a computing system utilizing the antenna unit are disclosed. The antenna is compact and can be fabricated at low cost and with high accuracy. The antenna unit comprises an antenna and a connection cable. The antenna unit is constructed by forming the antenna and the connection cable integrally on a preferably flexible insulating film using preferably the FPC (Flexible Printed Circuit) technique. The computing system comprises a body having its main operational circuits and a hinged cover having a display. The flexible printed antenna is formed integrally with its module of electric components using the FPC technique and is made to span the body and the cover. The antenna itself and the connection cable can be freely bent or folded, resulting in higher freedom in their positioning within the computer system body and cover.

Abstract: A thin flexible multi-layered printed circuit cable manufactured by a relatively simple process and having improved electro-magnetic interference and impedance characteristics is described. The cable includes: an insulating substrate layer; a wiring layer formed on the insulated substrate layer; a coating layer laminated on the wiring layer; a first non-woven metal fiber layer laminated on the coating layer; and a second non-woven metal fiber layer laminated on an opposite surface of the substrate layer. Because the cable is coated with a conductive non-woven or woven metal fabric, electromagnetic waves generated during transmission of high speed data are fully shielded. The non-woven or woven fabric having a wide surface area, is soft and can make good surface-to-surface contact.

Abstract: A metal cored printed wiring board and a manufacturing method therefor, in which an organic non-conductive layer will not separate from the metal core even in an environment of high temperature and high humidity since both the metal core and the organic non-conductive layer are firmly adhered. An organic non-conductive layer is formed over the metal core (e.g., of aluminum) with a metal plated layer (e.g., nickel) therebetween for protecting the metal core. A metal oxide layer is also used for enhancing adhesive force. By utilizing such a metal oxide layer, it is possible to more effectively prevent the organic non-conductive layer from separating from the plated layer (and thus the metal core). Further, the protecting metal plated layer can protect the metal core from erosion caused by contact with a strong alkali solution, etc. as may be used in a process of forming the metal oxide layer. Still further, copper plating inside the through hole can be performed easily.

Abstract: A metal cored printed wiring board and a manufacturing method therefor, in which an organic non-conductive layer will not separate from the metal core even in an environment of high temperature and high humidity since both the metal core and the organic non-conductive layer are firmly adhered. An organic non-conductive layer is formed over the metal core (e.g., of aluminum) with a metal plated layer (e.g., nickel) therebetween for protecting the metal core. A metal oxide layer is also used for enhancing adhesive force. By utilizing such a metal oxide layer, it is possible to more effectively prevent the organic non-conductive layer from separating from the plated layer (and thus the metal core). Further, the protecting metal plated layer can protect the metal core from erosion caused by contact with a strong alkali solution, etc. as may be used in a process of forming the metal oxide layer. Still further, copper plating inside the through hole can be performed easily.