Abstract: A high frequency module that has a structure in which a frame-shaped shield case 3 is attached to a circuit substrate 2, wherein an extending segment 331 that extends in an inward direction of the case is formed on a case side plate 31 of the shield case 3, a protruding segment 332 is formed by providing a tip end portion of the extending segment 331 so as to stand perpendicularly, and an engaging portion 332a is formed by swelling out an approximate midpoint of the protruding segment 332 in an inward direction of the case by a drawing process. Furthermore, an inserting hole 21 is formed in the circuit substrate 2 at a location that corresponds to the protruding segment 332. Then, the shield case 3 is attached to the circuit substrate 2 by inserting the protruding segment 332 into the inserting hole 21 of the circuit substrate 2 so that the engaging portion 332a is passed over.

Abstract: A high frequency module that has a structure in which a frame-shaped shield case 3 is attached to a circuit substrate 2, wherein an extending segment 331 that extends in an inward direction of the case is formed on a case side plate 31 of the shield case 3, a protruding segment 332 is formed by providing a tip end portion of the extending segment 331 so as to stand perpendicularly, and an engaging portion 332a is formed by swelling out an approximate midpoint of the protruding segment 332 in an inward direction of the case by a drawing process. Furthermore, an inserting hole 21 is formed in the circuit substrate 2 at a location that corresponds to the protruding segment 332. Then, the shield case 3 is attached to the circuit substrate 2 by inserting the protruding segment 332 into the inserting hole 21 of the circuit substrate 2 so that the engaging portion 332a is passed over.