Patents by Inventor Shu-Hua Chen

Shu-Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240087974
    Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Sheng Lin, Chin-Hua Wang, Shu-Shen Yeh, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng
  • Publication number: 20230076941
    Abstract: A chip matching system and a corresponding method are provided. The method defines a plurality of first electronic components in a first wafer as various grades of chips and defines a plurality of second electronic components in a second wafer as various grades of chips, and then grades of the first electronic components and the second electronic components are matched to generate target information, and finally the first and second electronic components are integrated in the same position according to the target information. Therefore, the highest-grade chips can be arranged in a multi-chip module to optimize the quality of the multi-chip module.
    Type: Application
    Filed: November 16, 2022
    Publication date: March 9, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wu-Hung Yen, Yi-Hsien Huang, Chun-Tang Lin, Shu-Hua Chen, Shou-Qi Chang
  • Patent number: 11532495
    Abstract: A chip matching system and a corresponding method are provided. The method defines a plurality of first electronic components in a first wafer as various grades of chips and defines a plurality of second electronic components in a second wafer as various grades of chips, and then grades of the first electronic components and the second electronic components are matched to generate target information, and finally the first and second electronic components are integrated in the same position according to the target information. Therefore, the highest-grade chips can be arranged in a multi-chip module to optimize the quality of the multi-chip module.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: December 20, 2022
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wu-Hung Yen, Yi-Hsien Huang, Chun-Tang Lin, Shu-Hua Chen, Shou-Qi Chang
  • Publication number: 20220068680
    Abstract: A chip matching system and a corresponding method are provided. The method defines a plurality of first electronic components in a first wafer as various grades of chips and defines a plurality of second electronic components in a second wafer as various grades of chips, and then grades of the first electronic components and the second electronic components are matched to generate target information, and finally the first and second electronic components are integrated in the same position according to the target information. Therefore, the highest-grade chips can be arranged in a multi-chip module to optimize the quality of the multi-chip module.
    Type: Application
    Filed: October 19, 2020
    Publication date: March 3, 2022
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wu-Hung Yen, Yi-Hsien Huang, Chun-Tang Lin, Shu-Hua Chen, Shou-Qi Chang
  • Patent number: 8440111
    Abstract: A lead-free conductive paste composition includes silumin powder, lead-free glass frits, an organic binder, stearic acid zinc, and aluminum powder.
    Type: Grant
    Filed: May 17, 2011
    Date of Patent: May 14, 2013
    Assignee: China Steel Corporation
    Inventors: Rong-Zhi Chen, Hung-Shuo Chung, Chin-Lin Huang, Jye-Long Lee, Shu-Hua Chen, Jui-Tung Chang
  • Patent number: 8354234
    Abstract: The present invention provides methods, compositions, and systems for mass spectrometric analysis of magnetic nanoparticles displaying ligands on their surface. For example, the present invention provides methods of screening a sample for the presence of at least one analyte using ligand conjugated magnetic nanoparticles, magnetic separation, and mass spectrometric analysis. The present invention also relates to MALDI matrix compositions comprising ligand conjugated magnetic nanoparticles.
    Type: Grant
    Filed: July 17, 2006
    Date of Patent: January 15, 2013
    Assignee: Academia Sinica
    Inventors: Yu-Ju Chen, Po-Chiao Lin, Chun-Cheng Lin, Shu-Hua Chen, Po-Hung Chou, Hsin-Kai Liao
  • Publication number: 20120168689
    Abstract: A lead-free conductive paste composition includes silumin powder, lead-free glass frits, an organic binder, stearic acid zinc, and aluminum powder.
    Type: Application
    Filed: May 17, 2011
    Publication date: July 5, 2012
    Applicant: CHINA STEEL CORPORATION
    Inventors: Rong-Zhi CHEN, Hung-Shuo CHUNG, Chin-Lin HUANG, Jye-Long LEE, Shu-Hua CHEN, Jui-Tung CHANG
  • Patent number: 8153387
    Abstract: A method for immobilizing glycoprotein is disclosed. A surface is provided. Next, a boronic acid is contacted to the surface. The boronic acid is represented as Y—R—B—(OH)2 and includes a boronic acid group (B—(OH)2), a linker R, and a functional group Y, in which the boronic acid is bonded to the surface via the functional group Y. A glycoprotein is contacted to the boronic acid, wherein two spatially adjacent hydroxyl groups of a carbohydrate chain form a boronate ester with the boronic acid group of the boronic acid to immobilize the glycoprotein. The goal of site-specific and covalent protein immobilization without interfering the binding affinity of an antibody to antigen may be thus achieved with the reaction of boronic acid and the carbohydrate chain of Fc region.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: April 10, 2012
    Assignee: National Tsing Hua University
    Inventors: Chun-Cheng Lin, Mu-Lin Chen, Po-Chiao Lin, Yu-Ju Chen, Shu-Hua Chen
  • Publication number: 20100190966
    Abstract: A method for immobilizing glycoprotein is disclosed. A surface is provided. Next, a boronic acid is contacted to the surface. The boronic acid is represented as Y—R—B—(OH)2 and includes a boronic acid group(B—(OH)2), a linker R, and a functional group Y, in which the boronic acid is bonded to the surface via the functional group Y. A glycoprotein is contacted to the boronic acid, wherein two spatially adjacent hydroxyl groups of a carbohydrate chain form a boronate ester with the boronic acid group of the boronic acid to immobilize the glycoprotein. The goal of site-specific and covalent protein immobilization without interfering the binding affinity of an antibody to antigen may be thus achieved with the reaction of boronic acid and the carbohydrate chain of Fc region.
    Type: Application
    Filed: June 24, 2009
    Publication date: July 29, 2010
    Inventors: Chun-Cheng LIN, Mu-Lin CHEN, Po-Chiao LIN, Yu-Ju CHEN, Shu-Hua CHEN
  • Publication number: 20080122472
    Abstract: A testing jig of electronic signal is disclosed. The testing jig of electronic signal capable of providing electrical connection between a plurality of contact pads of the circuit board and a plurality of ball-shaped leads of the ball-grid-array packaging device in order to perform testing with respect to the ball-grid-array packaging device includes a connecting interface and at least a conducting gel. The connecting interface has a plurality of guiding connecting devices, each of them is one-to-one correspondent to the plurality of contact pads wherein each of the guiding connecting devices is aligned with and electrically connected to the contact pad. The conducting gel has a first side surface and a second side surface. The first side surface being bonded to the connecting interface is connected to the other end of the guiding connecting devices while the second side surface is bonded and connected to the plurality of ball-shaped leads.
    Type: Application
    Filed: September 18, 2006
    Publication date: May 29, 2008
    Inventor: Shu-Hua Chen
  • Publication number: 20070054407
    Abstract: The present invention provides methods, compositions, and systems for mass spectrometric analysis of magnetic nanoparticles displaying ligands on their surface. For example, the present invention provides methods of screening a sample for the presence of at least one analyte using ligand conjugated magnetic nanoparticles, magnetic separation, and mass spectrometric analysis. The present invention also relates to MALDI matrix compositions comprising ligand conjugated magnetic nanoparticles.
    Type: Application
    Filed: July 17, 2006
    Publication date: March 8, 2007
    Inventors: Yu-Ju Chen, Po-Chiao Lin, Chun-Cheng Lin, Shu-Hua Chen, Po-Hung Chou, Hsin Liao