Patents by Inventor Shui Ming Tse

Shui Ming Tse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiple leadframe laminated IC package
    Patent number: 7449771
    Abstract: A method of fabricating an integrated circuit package. The method includes providing a first leadframe and a second leadframe, laminating the second leadframe to a portion of the first leadframe in order to create a multi-layer laminated leadframe, and mounting a semiconductor die on another portion of the first leadframe.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: November 11, 2008
    Assignee: ASAT Ltd.
    Inventors: Chun Ho Fan, Tsui Yee Lin, Kin Pui Kwan, Shui Ming Tse, Wing Him Lau, Shuk Man Wong
  • Process for fabricating an integrated circuit package
    Patent number: 7247526
    Abstract: A process for fabricating an integrated circuit package. At least a first side of a leadframe strip is selectively etched to define portions of a die attach pad and at least one row of contacts adjacent the die attach pad. A carrier strip is laminated to the first side of the leadframe strip and a second side of the leadframe strip is selectively etched to thereby define a remainder of the die attach pad and the at least one row of contacts. A semiconductor die is mounted to the die attach pad, on the second side of the leadframe strip and the semiconductor die is wire bonded to ones of the contacts. The second side of the leadframe strip is encapsulating, including the semiconductor die and wire bonds, in a molding material. The carrier strip is removed from the leadframe strip and the integrated circuit package is singulated from a remainder of the leadframe strip.
    Type: Grant
    Filed: May 25, 2005
    Date of Patent: July 24, 2007
    Assignee: ASAT Ltd.
    Inventors: Chun Ho Fan, Neil McLellan, Wing Him Lau, Emily Shui Ming Tse
  • Multiple leadframe laminated IC package
    Patent number: 6734044
    Abstract: A method of fabricating an integrated circuit package. The method includes providing a first leadframe and a second leadframe, laminating the second leadframe to a portion of the first leadframe in order to create a multi-layer laminated leadframe, and mounting a semiconductor die on another portion of the first leadframe.
    Type: Grant
    Filed: June 10, 2002
    Date of Patent: May 11, 2004
    Assignee: ASAT Ltd.
    Inventors: Chun Ho Fan, Tsui Yee Lin, Kin Pui Kwan, Shui Ming Tse, Wing Him Lau, Shuk Man Wong