Patents by Inventor Shuichi Arima

Shuichi Arima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring board, semiconductor package and semiconductor device
    Patent number: 6479758
    Abstract: In a wiring board having a plurality of wiring layers, a plurality of signal wiring terminals and a plurality of power supply terminals are arranged on the principal plane of the wiring board, the signal wiring terminals or the power supply terminals being connected to any one of inner layers of the wiring layers, and signal wiring terminals, which are connected to wirings formed on the same layer, among the plurality of signal wiring terminals are arranged so that at least one side of the inside and outside of a region, in which the signal wiring terminals connected to the wirings formed on the same layer are formed, is surrounded by the power supply terminals. Thus, even if the signal wirings are closely arranged, it is possible to prevent crosstalk from occurring and it is possible to prevent the size from increasing.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: November 12, 2002
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Shuichi Arima, Osamu Shimada