Abstract: Semiconductor packages which are prepared by forming circuit substrates, mounting IC chips on the circuit substrates, encapsulating the IC chips on the circuit substrates with resin, and forming electrodes, are attached to a standard member. After this attaching step, the semiconductor packages are subjected to a cutting step where the semiconductor packages are diced into a plurality of circuit substrates.

Abstract: An organic resin film 27 having an opening on an electrode pad is formed on a main surface of an IC chip 10, and a protruding electrode 12 formed on the electrode pad is formed of a low melting point eutectic solder. As a result, the protruding electrode 12 is formed without melting the organic resin film while preventing a crack from being generated by a stress applied between the electrode pad and the IC chip. Thus, the reliability of a semiconductor package can be enhanced.

Abstract: A videoconference device connected to a general commercially available facsimile unit and having a function of sending/receiving a facsimile signal during communication.

Abstract: A composition for a vibration damper, which comprises:100 parts by weight of a resin-forming component comprising (a) a compound containing an epoxy group, and (b) a curing component comprising (i) a polyhydric phenol as a first curing compound and (ii) a second curing compound selected from the group consisting of an acid hydrazide, a urea derivative and an imidazole;50 to 500 parts by weight of a scaly filler;200 parts by weight or less of powdery filler; and100 parts by weight or less of a fibrous filler. A process for the manufacture of the composition, and a vibration damper, also are disclosed.

Abstract: According to the present invention, a coat is formed by applying a coating composition comprising an epoxy resin obtained by a bisphenol represented by the formula: ##STR1## wherein R.sub.1 and R.sub.2 represent a hydrogen atom or an alkyl group containing from 1 to 3 carbon atoms and a curing agent, to a substrate; and thereafter contactings the resulting coat with a liquid such as warm water or hot water in a one stage or multistage process. The thus formed coat is excellent in properties such as heat resistance, particularly erosion resistance adhesive properties and resistance to leaching of organic constituents contained in the coat exposed to hot water.