Patents by Inventor Shuichi Kawano

Shuichi Kawano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190072580
    Abstract: In a physical quantity sensor, wirings provided on a projection and a bonding pad form a silicide layer and are electrically connected. The wirings are multilayered films. A noble metal layer covers the projection and contacts the bonding pad to form the silicide layer. A metal layer extends between the noble metal layer and a base substrate. The metal layer, the noble metal layer, an adhesion layer, and an insulating layer are stacked in this order from the base substrate in all areas except for atop the projection.
    Type: Application
    Filed: August 31, 2018
    Publication date: March 7, 2019
    Inventor: Shuichi KAWANO
  • Publication number: 20180095105
    Abstract: An electronic device includes a base body, a functional element disposed on the base body, a wiring disposed on the base body and electrically connected to the functional element, and a terminal disposed on the base body and electrically connected to the wiring, wherein the terminal includes a non-overlapping region which does not overlap with the wiring. Further, the terminal includes an overlapping region which overlaps with the wiring.
    Type: Application
    Filed: September 21, 2017
    Publication date: April 5, 2018
    Inventor: Shuichi KAWANO
  • Patent number: 9678100
    Abstract: A functional device according to an embodiment of the invention includes: an insulating substrate; a movable section; movable electrode fingers provided in the movable section; and fixed electrode fingers provided on the insulating substrate and arranged to be opposed to the movable electrode fingers. The fixed electrode fingers include: first fixed electrode fingers arranged on one side of the movable electrode fingers; and second fixed electrode fingers arranged on the other side of the movable electrode fingers. The first fixed electrode fingers and the second fixed electrode fingers are arranged to be spaced apart from each other.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: June 13, 2017
    Assignee: Seiko Epson Corporation
    Inventors: Mitsuhiro Yoda, Shuichi Kawano, Shigekazu Takagi, Seiji Yamazaki
  • Publication number: 20160229083
    Abstract: In a method of producing a die for extrusion molding, a treated surface is provided on an inner wall surface of a second through hole. The die includes a raw material supply section having a first through hole that extends from a first face toward a second face. The die includes a molding section having the second through hole that extends from the second face toward the first face. In providing the treated surface, a material for the die is machined to form the material into a die shape and to provide a machining-affected layer on the inner wall surface of the second through hole in the molding section, an oxidized layer is provided by heating the machining-affected layer to oxidize the machining-affected layer so as to convert the machining-affected layer into the oxidized layer, and the oxidized layer is removed.
    Type: Application
    Filed: April 20, 2016
    Publication date: August 11, 2016
    Applicant: IBIDEN CO., LTD.
    Inventors: Makoto ASAI, Shuichi KAWANO
  • Publication number: 20150276791
    Abstract: A functional device according to an embodiment of the invention includes: an insulating substrate; a movable section; movable electrode fingers provided in the movable section; and fixed electrode fingers provided on the insulating substrate and arranged to be opposed to the movable electrode fingers. The fixed electrode fingers include: first fixed electrode fingers arranged on one side of the movable electrode fingers; and second fixed electrode fingers arranged on the other side of the movable electrode fingers. The first fixed electrode fingers and the second fixed electrode fingers are arranged to be spaced apart from each other.
    Type: Application
    Filed: June 16, 2015
    Publication date: October 1, 2015
    Inventors: Mitsuhiro YODA, Shuichi KAWANO, Shigekazu TAKAGI, Seiji YAMAZAKI
  • Patent number: 9086428
    Abstract: A functional device according to an embodiment of the invention includes: an insulating substrate; a movable section; movable electrode fingers provided in the movable section; and fixed electrode fingers provided on the insulating substrate and arranged to be opposed to the movable electrode fingers. The fixed electrode fingers include: first fixed electrode fingers arranged on one side of the movable electrode fingers; and second fixed electrode fingers arranged on the other side of the movable electrode fingers. The first fixed electrode fingers and the second fixed electrode fingers are arranged to be spaced apart from each other.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: July 21, 2015
    Assignee: Seiko Epson Corporation
    Inventors: Mitsuhiro Yoda, Shuichi Kawano, Shigekazu Takagi, Seiji Yamazaki
  • Patent number: 9068835
    Abstract: A functional element including a substrate having a principal surface, a groove portion (a first groove portion, a second groove portion) disposed on the principal surface, and a fixed electrode section (a first fixed electrode finger, a second fixed electrode finger) laid across the groove portion on the substrate, wherein, in the groove portion, a raised portion formed by using at least one of the substrate and the fixed electrode section is provided in a position overlapping with the fixed electrode section in a plan view, the raised portion has a bonded surface (an end face), a wiring line (a first wiring line, a second wiring line) is disposed on the bonded surface, and the substrate and the fixed electrode section are connected with the wiring line sandwiched between the substrate and the fixed electrode section.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: June 30, 2015
    Assignee: Seiko Epson Corporation
    Inventors: Mitsuhiro Yoda, Shuichi Kawano, Shigekazu Takagi, Seiji Yamazaki
  • Patent number: 8997344
    Abstract: A method for manufacturing an interposer including forming a first insulating layer comprising an inorganic material on a supporting substrate, forming a first wire in the first insulating layer, forming a second insulating layer on a first side of the first insulating layer, forming a second wire with a longer wire length and a greater thickness than the first wire on the second insulating layer, and removing the supporting substrate.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: April 7, 2015
    Assignee: Ibiden Co., Ltd.
    Inventors: Hajime Sakamoto, Shuichi Kawano, Daiki Komatsu, Hiroshi Segawa
  • Publication number: 20150017343
    Abstract: A die for extrusion molding includes a first face, a second face, a raw material supply section, and a molding section. The second face is provided opposite the first face. The raw material supply section includes a first through hole that extends from the first face toward the second face. The molding section includes a second through hole and a nitride layer. The second through hole extends from the second face toward the first face so as to communicate with the first through hole. The nitride layer is provided on an inner wall surface of the second through hole.
    Type: Application
    Filed: September 29, 2014
    Publication date: January 15, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Kiyotaka ANDO, Shuichi KAWANO
  • Publication number: 20150014903
    Abstract: A die for extrusion molding includes a first face, a second face, a raw material supply section, a molding section, and a treated surface. The second face is provided opposite the first face. The molding section has a second through hole that extends from the second face toward the first face so as to communicate with a first through hole. The treated surface is provided on an inner wall surface of the second through hole to have a structure such that a material for the die is machined to form the material into a die shape and to provide a machining-affected layer on the inner wall surface of the second through hole in the molding section, an oxidized layer is provided by heating the machining-affected layer to oxidize the machining-affected layer so as to convert the machining-affected layer into the oxidized layer, and the oxidized layer is removed.
    Type: Application
    Filed: September 29, 2014
    Publication date: January 15, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Makoto ASAI, Shuichi KAWANO
  • Publication number: 20150014902
    Abstract: A die for extrusion molding includes a first face, a second face, a raw material supply section, a molding section, and a structure. The molding section has a second through hole that extends from the second face toward the first face so as to communicate with a first through hole. The structure is such that a material for the die is machined to form the material into a predetermined shape and to provide a machining-affected layer on an inner wall surface of the second through hole in the molding section, an oxidized layer is provided by heating the machining-affected layer to oxidize the machining-affected layer so as to convert the machining-affected layer into the oxidized layer, the oxidized layer is removed so that a treated surface is provided, and the treated surface is nitrided by ion implantation to provide a nitride layer.
    Type: Application
    Filed: September 29, 2014
    Publication date: January 15, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Kiyotaka ANDO, Shuichi KAWANO, Makoto ASAI
  • Patent number: 8674790
    Abstract: A surface acoustic wave device includes: a sapphire substrate having a C-plane main surface; comb-like electrodes which excite surface acoustic waves formed on the main surface of the sapphire substrate; an aluminum nitride film which covers the comb-like electrodes and the main surface; and a silicon dioxide film which is formed on the surface of the aluminum nitride film.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: March 18, 2014
    Assignee: Seiko Epson Corporation
    Inventors: Shuichi Kawano, Masashi Fujioka
  • Patent number: 8624690
    Abstract: A surface acoustic wave device includes: a sapphire substrate having a C-plane main surface; an aluminum nitride film which is formed on the main surface of the sapphire substrate; comb-like electrodes which are formed on the surface of the aluminum nitride film to excite surface acoustic waves; and a silicon dioxide film which covers the comb-like electrodes and the surface of the aluminum nitride film.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: January 7, 2014
    Assignee: Seiko Epson Corporation
    Inventors: Shuichi Kawano, Masashi Fujioka
  • Patent number: 8455766
    Abstract: A substrate for mounting an IC chip including a printed substrate including a first build-up layer. The first build-up layer including (i) a first conductor layer having first conductor circuits and (ii) a resin insulating layer. The first conductor circuits and the resin insulating layer alternating along a length of the first build-up layer. A low-elasticity resin layer formed on the first build-up layer. A low-thermal-expansion substrate formed of ceramics or silicon, and provided on the low-elasticity resin layer. Through-hole conductors provided through the low-thermal-expansion substrate and the low-elasticity resin layer; and second conductor circuits formed on the low-thermal-expansion substrate. The through-hole conductors electrically connect the first conductor layer and the second conductor circuits provided on the low-thermal-expansion substrate.
    Type: Grant
    Filed: April 21, 2008
    Date of Patent: June 4, 2013
    Assignee: IBIDEN Co., Ltd.
    Inventors: Hironori Tanaka, Shuichi Kawano
  • Patent number: 8436252
    Abstract: A printed wiring board includes a first insulation layer, a first conductive circuit formed on the first insulation layer, a second insulation layer formed on the first insulation layer and the first conductive circuit and having an opening portion reaching the first conductive circuit, a second conductive circuit formed on the second insulation layer, and a via conductor formed in the opening portion and connecting the first conductive circuit and the second conductive circuit. The via conductor is formed an inner-wall surface of the opening portion and has a seed layer including a nitride compound and/or a carbide compound containing Ti, Zr, Hf, V, Nb, Ta or Si and a plated-metal film formed in the opening portion, and the plated-metal film and the first conductive circuit have at least portions making direct contact.
    Type: Grant
    Filed: June 17, 2010
    Date of Patent: May 7, 2013
    Assignee: Ibiden Co., Ltd.
    Inventors: Shuichi Kawano, Koichi Tsunoda
  • Publication number: 20120267150
    Abstract: A functional element including a substrate having a principal surface, a groove portion (a first groove portion, a second groove portion) disposed on the principal surface, and a fixed electrode section (a first fixed electrode finger, a second fixed electrode finger) laid across the groove portion on the substrate, wherein, in the groove portion, a raised portion formed by using at least one of the substrate and the fixed electrode section is provided in a position overlapping with the fixed electrode section in a plan view, the raised portion has a bonded surface (an end face), a wiring line (a first wiring line, a second wiring line) is disposed on the bonded surface, and the substrate and the fixed electrode section are connected with the wiring line sandwiched between the substrate and the fixed electrode section.
    Type: Application
    Filed: April 18, 2012
    Publication date: October 25, 2012
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Mitsuhiro YODA, Shuichi KAWANO, Shigekazu TAKAGI, Seiji YAMAZAKI
  • Patent number: 8247289
    Abstract: A capacitor having a high quality and a manufacturing method of the same are provided. A capacitor has a lower electrode formed on an oxide film, a dielectric layer formed on the lower electrode, an upper electrode formed so as to face the lower electrode with the dielectric layer between, and an upper electrode formed so as to cover the upper electrode, an opening portion of the upper electrode and an opening portion of the dielectric layer. By forming the upper electrode on the dielectric layer, it is possible to pattern the dielectric layer by using the upper electrode as a mask, and provide a capacitor having a high-quality dielectric layer by preventing impurity diffusion into the dielectric layer. By forming the upper electrode on the dielectric layer, it is possible to prevent the dielectric layer from being exposed to etching liquid, liquid developer, etc.
    Type: Grant
    Filed: August 23, 2006
    Date of Patent: August 21, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Yoshiki Yamanishi, Muneo Harada, Takahiro Kitano, Tatsuzo Kawaguchi, Yoshihiro Hirota, Kinji Yamada, Tomotaka Shinoda, Katsuya Okumura, Shuichi Kawano
  • Patent number: 8188378
    Abstract: An interposer having a support substrate, a first insulation layer made of an inorganic material and formed over the support substrate, and a second insulation layer formed over the first insulation layer. The first insulation layer has a first land, a second land and a first wiring electrically connecting the first land and the second land. The second insulation layer has a first pad positioned to load a first electronic component, a second pad positioned to load a second electronic component, a second wiring electrically connected to the second pad, a first via conductor electrically connecting the first land and the first pad, and a second via conductor electrically connecting the second land and the second wiring. The first wiring and second wiring electrically connect the first pad and the second pad, and the second wiring has a lower wiring resistance per unit length than the first wiring.
    Type: Grant
    Filed: December 29, 2008
    Date of Patent: May 29, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Hajime Sakamoto, Shuichi Kawano, Daiki Komatsu, Toshiki Furutani, Hiroshi Segawa
  • Patent number: 8178790
    Abstract: An interposer and a method of manufacturing the same are provided. The interposer includes a substrate and a conductor portion formed inside the substrate. At least one insulating layer is formed on the substrate and on the conductor portion. A signal wiring portion is formed inside the insulating layer or on the insulating layer. A first pad is configured to receive an electronic part, and is formed on an outermost insulating layer of the at least one insulating layer. A connection conductor is formed in the at least one insulating layer so as to electrically connect the conductor portion to the first pad.
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: May 15, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Toshiki Furutani, Atsushi Sakai, Kiyohisa Hasegawa, Hiroshi Segawa, Shuichi Kawano, Hajime Sakamoto
  • Publication number: 20120111615
    Abstract: A functional device according to an embodiment of the invention includes: an insulating substrate; a movable section; movable electrode fingers provided in the movable section; and fixed electrode fingers provided on the insulating substrate and arranged to be opposed to the movable electrode fingers. The fixed electrode fingers include: first fixed electrode fingers arranged on one side of the movable electrode fingers; and second fixed electrode fingers arranged on the other side of the movable electrode fingers. The first fixed electrode fingers and the second fixed electrode fingers are arranged to be spaced apart from each other.
    Type: Application
    Filed: October 20, 2011
    Publication date: May 10, 2012
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Mitsuhiro YODA, Shuichi KAWANO, Shigekazu TAKAGI, Seiji YAMAZAKI