Abstract: A rotary cutting tool includes a tool body and a cutting edge tip provided at the tool body. At least one first groove is provided in a rake face of the cutting edge tip, the first groove has a portion inclined with respect to a rotation axis, and a front end of the first groove is provided at a front cutting edge. A rear end of the first groove is provided on an inner side with respect to an outer peripheral cutting edge, and an irregularity of the outer peripheral cutting edge is 30 ?m or less.

Abstract: An acoustic wave filter includes a surface acoustic wave resonator and a bulk acoustic wave resonator. The SAW resonator includes a piezoelectric substrate and an interdigital transducer electrode on the substrate. The IDT electrode includes a pair of comb-shaped electrodes interdigitated with each other. Each comb-shaped electrode includes electrode fingers extending in parallel or substantially in parallel in a direction crossing the SAW propagation direction and a busbar electrode connecting the electrode fingers to each other at one end of each of the electrode fingers. The BAW resonator includes a lower electrode defined by a portion of a busbar electrode, a piezoelectric film on the busbar electrode, and an upper electrode on the piezoelectric film.

Abstract: In a physical quantity sensor, wirings provided on a projection and a bonding pad form a silicide layer and are electrically connected. The wirings are multilayered films. A noble metal layer covers the projection and contacts the bonding pad to form the silicide layer. A metal layer extends between the noble metal layer and a base substrate. The metal layer, the noble metal layer, an adhesion layer, and an insulating layer are stacked in this order from the base substrate in all areas except for atop the projection.

Abstract: An electronic device includes a base body, a functional element disposed on the base body, a wiring disposed on the base body and electrically connected to the functional element, and a terminal disposed on the base body and electrically connected to the wiring, wherein the terminal includes a non-overlapping region which does not overlap with the wiring. Further, the terminal includes an overlapping region which overlaps with the wiring.

Abstract: In a physical quantity sensor, wirings provided on a projection and a bonding pad form a silicide layer and are electrically connected. The wirings are multilayered films. A noble metal layer covers the projection and contacts the bonding pad to form the silicide layer. A metal layer extends between the noble metal layer and a base substrate. The metal layer, the noble metal layer, an adhesion layer, and an insulating layer are stacked in this order from the base substrate in all areas except for atop the projection.

Abstract: An electronic device includes a base body, a functional element disposed on the base body, a wiring disposed on the base body and electrically connected to the functional element, and a terminal disposed on the base body and electrically connected to the wiring, wherein the terminal includes a non-overlapping region which does not overlap with the wiring. Further, the terminal includes an overlapping region which overlaps with the wiring.

Abstract: A functional device according to an embodiment of the invention includes: an insulating substrate; a movable section; movable electrode fingers provided in the movable section; and fixed electrode fingers provided on the insulating substrate and arranged to be opposed to the movable electrode fingers. The fixed electrode fingers include: first fixed electrode fingers arranged on one side of the movable electrode fingers; and second fixed electrode fingers arranged on the other side of the movable electrode fingers. The first fixed electrode fingers and the second fixed electrode fingers are arranged to be spaced apart from each other.

Abstract: In a method of producing a die for extrusion molding, a treated surface is provided on an inner wall surface of a second through hole. The die includes a raw material supply section having a first through hole that extends from a first face toward a second face. The die includes a molding section having the second through hole that extends from the second face toward the first face. In providing the treated surface, a material for the die is machined to form the material into a die shape and to provide a machining-affected layer on the inner wall surface of the second through hole in the molding section, an oxidized layer is provided by heating the machining-affected layer to oxidize the machining-affected layer so as to convert the machining-affected layer into the oxidized layer, and the oxidized layer is removed.

Abstract: A functional device according to an embodiment of the invention includes: an insulating substrate; a movable section; movable electrode fingers provided in the movable section; and fixed electrode fingers provided on the insulating substrate and arranged to be opposed to the movable electrode fingers. The fixed electrode fingers include: first fixed electrode fingers arranged on one side of the movable electrode fingers; and second fixed electrode fingers arranged on the other side of the movable electrode fingers. The first fixed electrode fingers and the second fixed electrode fingers are arranged to be spaced apart from each other.

Abstract: A functional device according to an embodiment of the invention includes: an insulating substrate; a movable section; movable electrode fingers provided in the movable section; and fixed electrode fingers provided on the insulating substrate and arranged to be opposed to the movable electrode fingers. The fixed electrode fingers include: first fixed electrode fingers arranged on one side of the movable electrode fingers; and second fixed electrode fingers arranged on the other side of the movable electrode fingers. The first fixed electrode fingers and the second fixed electrode fingers are arranged to be spaced apart from each other.

Abstract: A functional element including a substrate having a principal surface, a groove portion (a first groove portion, a second groove portion) disposed on the principal surface, and a fixed electrode section (a first fixed electrode finger, a second fixed electrode finger) laid across the groove portion on the substrate, wherein, in the groove portion, a raised portion formed by using at least one of the substrate and the fixed electrode section is provided in a position overlapping with the fixed electrode section in a plan view, the raised portion has a bonded surface (an end face), a wiring line (a first wiring line, a second wiring line) is disposed on the bonded surface, and the substrate and the fixed electrode section are connected with the wiring line sandwiched between the substrate and the fixed electrode section.

Abstract: A method for manufacturing an interposer including forming a first insulating layer comprising an inorganic material on a supporting substrate, forming a first wire in the first insulating layer, forming a second insulating layer on a first side of the first insulating layer, forming a second wire with a longer wire length and a greater thickness than the first wire on the second insulating layer, and removing the supporting substrate.

Abstract: A die for extrusion molding includes a first face, a second face, a raw material supply section, a molding section, and a structure. The molding section has a second through hole that extends from the second face toward the first face so as to communicate with a first through hole. The structure is such that a material for the die is machined to form the material into a predetermined shape and to provide a machining-affected layer on an inner wall surface of the second through hole in the molding section, an oxidized layer is provided by heating the machining-affected layer to oxidize the machining-affected layer so as to convert the machining-affected layer into the oxidized layer, the oxidized layer is removed so that a treated surface is provided, and the treated surface is nitrided by ion implantation to provide a nitride layer.

Abstract: A die for extrusion molding includes a first face, a second face, a raw material supply section, and a molding section. The second face is provided opposite the first face. The raw material supply section includes a first through hole that extends from the first face toward the second face. The molding section includes a second through hole and a nitride layer. The second through hole extends from the second face toward the first face so as to communicate with the first through hole. The nitride layer is provided on an inner wall surface of the second through hole.

Abstract: A die for extrusion molding includes a first face, a second face, a raw material supply section, a molding section, and a treated surface. The second face is provided opposite the first face. The molding section has a second through hole that extends from the second face toward the first face so as to communicate with a first through hole. The treated surface is provided on an inner wall surface of the second through hole to have a structure such that a material for the die is machined to form the material into a die shape and to provide a machining-affected layer on the inner wall surface of the second through hole in the molding section, an oxidized layer is provided by heating the machining-affected layer to oxidize the machining-affected layer so as to convert the machining-affected layer into the oxidized layer, and the oxidized layer is removed.

Abstract: A surface acoustic wave device includes: a sapphire substrate having a C-plane main surface; comb-like electrodes which excite surface acoustic waves formed on the main surface of the sapphire substrate; an aluminum nitride film which covers the comb-like electrodes and the main surface; and a silicon dioxide film which is formed on the surface of the aluminum nitride film.

Abstract: A surface acoustic wave device includes: a sapphire substrate having a C-plane main surface; an aluminum nitride film which is formed on the main surface of the sapphire substrate; comb-like electrodes which are formed on the surface of the aluminum nitride film to excite surface acoustic waves; and a silicon dioxide film which covers the comb-like electrodes and the surface of the aluminum nitride film.

Abstract: A substrate for mounting an IC chip including a printed substrate including a first build-up layer. The first build-up layer including (i) a first conductor layer having first conductor circuits and (ii) a resin insulating layer. The first conductor circuits and the resin insulating layer alternating along a length of the first build-up layer. A low-elasticity resin layer formed on the first build-up layer. A low-thermal-expansion substrate formed of ceramics or silicon, and provided on the low-elasticity resin layer. Through-hole conductors provided through the low-thermal-expansion substrate and the low-elasticity resin layer; and second conductor circuits formed on the low-thermal-expansion substrate. The through-hole conductors electrically connect the first conductor layer and the second conductor circuits provided on the low-thermal-expansion substrate.

Abstract: A printed wiring board includes a first insulation layer, a first conductive circuit formed on the first insulation layer, a second insulation layer formed on the first insulation layer and the first conductive circuit and having an opening portion reaching the first conductive circuit, a second conductive circuit formed on the second insulation layer, and a via conductor formed in the opening portion and connecting the first conductive circuit and the second conductive circuit. The via conductor is formed an inner-wall surface of the opening portion and has a seed layer including a nitride compound and/or a carbide compound containing Ti, Zr, Hf, V, Nb, Ta or Si and a plated-metal film formed in the opening portion, and the plated-metal film and the first conductive circuit have at least portions making direct contact.

Abstract: A functional element including a substrate having a principal surface, a groove portion (a first groove portion, a second groove portion) disposed on the principal surface, and a fixed electrode section (a first fixed electrode finger, a second fixed electrode finger) laid across the groove portion on the substrate, wherein, in the groove portion, a raised portion formed by using at least one of the substrate and the fixed electrode section is provided in a position overlapping with the fixed electrode section in a plan view, the raised portion has a bonded surface (an end face), a wiring line (a first wiring line, a second wiring line) is disposed on the bonded surface, and the substrate and the fixed electrode section are connected with the wiring line sandwiched between the substrate and the fixed electrode section.