Patents by Inventor Shuichi KEZUKA

Shuichi KEZUKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230100141
    Abstract: A transmission line includes an element body and a signal conductor layer in the element body and having a linear shape. The transmission line includes a first, second, and third impedance sections, an impedance conversion section, and a reflection section. The second impedance section, the reflection section, the first impedance section, the impedance conversion section, and the third impedance section are positioned in this order along the signal conductor layer. Characteristic impedance of the first impedance section is lower than characteristic impedance in the second impedance section and characteristic impedance in the third impedance section. A change amount of characteristic impedance per unit length in the reflection section is larger than a change amount of characteristic impedance per unit length in the impedance conversion section.
    Type: Application
    Filed: November 30, 2022
    Publication date: March 30, 2023
    Inventors: Ryutatsu MIZUKAMI, Shuichi KEZUKA, Kuniaki YOSUI, Tomohiro NAGAI
  • Patent number: 11469027
    Abstract: In a built-in coil substrate, coil conductor patterns are provided on insulating base materials. Coil interlayer connection conductors, which provide interlayer connection between the coil conductor patterns, are provided on the insulating base materials and made of conductive paste. First and second external electrodes are provided on a first principal surface of a multilayer body. One of the coil conductor patterns is connected to the first external electrode by first-external-electrode connection conductors made of the conductive paste. Another one of the coil conductor patterns is connected to the second external electrode by a second-external-electrode connection conductor. The second-external-electrode connection conductor is a metal film provided in a through hole that extends through the multilayer body in a stacking direction in which the insulating base materials are stacked.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: October 11, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shuichi Kezuka, Kuniaki Yosui
  • Patent number: 10813209
    Abstract: A multilayer substrate includes a base including insulating layers stacked on one another, a first principal surface, and a second principal surface, a heat transfer member extending through a first insulating layer nearest to the first principal surface, a second coefficient of thermal conductivity of a material of the heat transfer member is higher than a first coefficient of thermal conductivity of a material of the insulating layers, a first metal film adhered to the first principal surface, the first metal film overlapping the heat transfer member when viewed from the layer stacking direction, and a first joining member disposed between the heat transfer member and the first metal film and being made of a material with a coefficient of thermal conductivity which is higher than the first coefficient of thermal conductivity of the material of the insulating layers.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: October 20, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shuichi Kezuka, Kuniaki Yosui
  • Patent number: 10741303
    Abstract: A transmission line includes, in a stacked insulator in which insulator layers are stacked, a first transmission line portion including a first ground conductor pattern, a second ground conductor pattern, and a first signal conductor pattern, and a second transmission line portion including a third ground conductor pattern, a fourth ground conductor pattern, and a second signal conductor pattern. The first signal conductor pattern extends along the second signal conductor pattern. The first ground conductor pattern and the third ground conductor pattern are provided on different insulator layers and at least partially overlap each other in a plan view.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: August 11, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kuniaki Yosui, Shingo Ito, Shuichi Kezuka, Takahiro Baba
  • Publication number: 20190198195
    Abstract: A transmission line includes, in a stacked insulator in which insulator layers are stacked, a first transmission line portion including a first ground conductor pattern, a second ground conductor pattern, and a first signal conductor pattern, and a second transmission line portion including a third ground conductor pattern, a fourth ground conductor pattern, and a second signal conductor pattern. The first signal conductor pattern extends along the second signal conductor pattern. The first ground conductor pattern and the third ground conductor pattern are provided on different insulator layers and at least partially overlap each other in a plan view.
    Type: Application
    Filed: March 6, 2019
    Publication date: June 27, 2019
    Inventors: Kuniaki YOSUI, Shingo ITO, Shuichi KEZUKA, Takahiro BABA
  • Patent number: 10269469
    Abstract: A transmission line includes, in a stacked insulator in which insulator layers are stacked, a first transmission line portion including a first ground conductor pattern, a second ground conductor pattern, and a first signal conductor pattern, and a second transmission line portion including a third ground conductor pattern, a fourth ground conductor pattern, and a second signal conductor pattern. The first signal conductor pattern extends along the second signal conductor pattern. The first ground conductor pattern and the third ground conductor pattern are provided on different insulator layers and at least partially overlap each other in a plan view.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: April 23, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kuniaki Yosui, Shingo Ito, Shuichi Kezuka, Takahiro Baba
  • Publication number: 20180302977
    Abstract: A multilayer substrate includes a base including insulating layers stacked on one another, a first principal surface, and a second principal surface, a heat transfer member extending through a first insulating layer nearest to the first principal surface, a second coefficient of thermal conductivity of a material of the heat transfer member is higher than a first coefficient of thermal conductivity of a material of the insulating layers, a first metal film adhered to the first principal surface, the first metal film overlapping the heat transfer member when viewed from the layer stacking direction, and a first joining member disposed between the heat transfer member and the first metal film and being made of a material with a coefficient of thermal conductivity which is higher than the first coefficient of thermal conductivity of the material of the insulating layers.
    Type: Application
    Filed: June 19, 2018
    Publication date: October 18, 2018
    Inventors: Shuichi KEZUKA, Kuniaki YOSUI
  • Publication number: 20170294258
    Abstract: In a built-in coil substrate, coil conductor patterns are provided on insulating base materials. Coil interlayer connection conductors, which provide interlayer connection between the coil conductor patterns, are provided on the insulating base materials and made of conductive paste. First and second external electrodes are provided on a first principal surface of a multilayer body. One of the coil conductor patterns is connected to the first external electrode by first-external-electrode connection conductors made of the conductive paste. Another one of the coil conductor patterns is connected to the second external electrode by a second-external-electrode connection conductor. The second-external-electrode connection conductor is a metal film provided in a through hole that extends through the multilayer body in a stacking direction in which the insulating base materials are stacked.
    Type: Application
    Filed: June 26, 2017
    Publication date: October 12, 2017
    Inventors: Shuichi KEZUKA, Kuniaki YOSUI
  • Publication number: 20170194076
    Abstract: A transmission line includes, in a stacked insulator in which insulator layers are stacked, a first transmission line portion including a first ground conductor pattern, a second ground conductor pattern, and a first signal conductor pattern, and a second transmission line portion including a third ground conductor pattern, a fourth ground conductor pattern, and a second signal conductor pattern. The first signal conductor pattern extends along the second signal conductor pattern. The first ground conductor pattern and the third ground conductor pattern are provided on different insulator layers and at least partially overlap each other in a plan view.
    Type: Application
    Filed: March 22, 2017
    Publication date: July 6, 2017
    Inventors: Kuniaki YOSUI, Shingo ITO, Shuichi KEZUKA, Takahiro BABA