Patents by Inventor Shuichi Kita

Shuichi Kita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin-sealed semiconductor device
    Patent number: 5097317
    Abstract: A resin-sealed semiconductor device includes a semiconductor element mounted on a die frame, bonding wires and external wires connected to the bonding wires. The semiconductor element, the bonding wires and portions of the external leads are coated with porous silica gel impregnated with a sealing resin.
    Type: Grant
    Filed: July 13, 1990
    Date of Patent: March 17, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takamitsu Fujimoto, Shuichi Kita, Atsuko Noda, Hiroshi Koezuka