Abstract: Method of manufacturing a cigarette having equivalent aroma and flavor even with a reduced amount of burley leaves. The method does not require special processing treatment due to the absence of necessity of an installation space and costs for the treatment. Also, method of manufacturing a cigarette containing the same, and a cigarette. The invention separates raw material for sheet tobacco into fiber and solution, adds a primary casing flavor to the solution, mixes the solution added with the primary casing flavor and the fiber to produce a mixture, and dries the mixture. Burley leaf tobacco is thereafter mixed with the sheet tobacco. The casing flavor is previously added at the time of the molding of sheet tobacco in the sheet-tobacco manufacturing process, which makes enables production of sheet tobacco having the aroma and flavor equivalent of when burley leaf tobacco is used, even without special processing treatment.

Abstract: A method of manufacturing sheet tobacco for producing a cigarette that has equivalent aroma and flavor even if the amount of burley leaves is reduced, and does not require a special processing treatment due to the absence of necessity of an installation space and costs for the treatment, a method of manufacturing a cigarette containing the same, and a cigarette. The invention separates raw material for sheet tobacco into fiber and solution, adds a casing flavor to the solution, mixes the solution added with the casing flavor and the fiber to produce a mixture, and dries the mixture. The casing flavor is previously added at the time of the molding of sheet tobacco in the sheet-tobacco manufacturing process, which makes it possible to produce sheet tobacco having the aroma and flavor equivalent of when burley leaf tobacco is used, even without applying the special processing treatment.

Abstract: A connector for mounting an LGA device on a circuit board comprises a film contact having electrode bumps on inner ends of respective conductive paths at predetermined spaced apart locations corresponding to respective locations of the individual electrode lands on the LGA device and is clamped extending across a central cavity defined between housing base and frame members. A flat elastomeric biassing pad having a series of upstanding, closely spaced resilient projections is retained by the base member in the cavity with the projections supporting spaced apart locations of one surface of the film contact while a cover member retains the device in the cavity in the frame member with the respective lands thereof pressed against respective electrode bumps, compressing the biassing pad to assure sufficient contact pressure. The cover member has a camming detent which progressively engages the device during closing, moving the device across the film contact with a wiping action.

Abstract: A chip carrier socket for surface mount applications has a one-piece housing with an outer frame and an inner, central, rectangular chip supporting base plate formed with contact locating recesses on undersides of respective edges. Strip-form metal contacts have downwardly looped, board connecting soldering portions formed between anchoring portions and free, locating ends which engage in the recesses during insertion of the anchoring portions into mounting engagement with the frame, limiting further movement of the locating ends in the insertion direction and thereby accurately locating the soldering portions in coplanar relation for even engagement with reflow solder pads on the board.