Patents by Inventor Shuichi Nishimura
Shuichi Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11961765Abstract: The present invention relates to a method for manufacturing a semiconductor substrate, including: (a) preparing an epitaxial substrate having a nitride semiconductor layer formed on a first main surface of a growth substrate and preparing a first support substrate, forming a resin adhesive layer between the first main surface of the growth substrate and a first main surface of the first support substrate, and bonding the epitaxial substrate to the first support substrate; (b) thinning a second main surface of the growth substrate; (c) forming a first protective thin film layer on the thinned growth substrate; (d) forming a second protective thin film layer on the first support substrate; (e) removing the thinned growth substrate; (f) bonding a second support substrate onto the nitride semiconductor layer; and (g) removing the first support substrate and the resin adhesive layer.Type: GrantFiled: May 23, 2019Date of Patent: April 16, 2024Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Shuichi Hiza, Kunihiko Nishimura, Masahiro Fujikawa, Yuki Takiguchi, Eiji Yagyu
-
Publication number: 20240096968Abstract: It is an object of the present disclosure to impart desired high frequency characteristics to a nitride semiconductor device including diamond as a substrate at a low cost. In the nitride semiconductor device according to the present disclosure, a via hole extends from a first main surface of a diamond layer through the diamond layer, an intermediate layer, and a nitride semiconductor layer to an electrode. The via hole has a multi-step structure including a large-diameter via hole being in contact with the first main surface of the diamond layer and a small-diameter via hole facing the electrode, having a smaller diameter than the large-diameter via hole, and being tapered.Type: ApplicationFiled: February 17, 2021Publication date: March 21, 2024Applicant: Mitsubishi Electric CorporationInventors: Ken IMAMURA, Shuichi HIZA, Kunihiko NISHIMURA
-
Publication number: 20220293550Abstract: A semiconductor device includes a semiconductor chip mounted on an upper surface of a base substrate and having an output pad, a first capacitive component mounted on the upper surface of the base substrate and having one end electrically connected to the base substrate, a frame provided on the base substrate and made of a dielectric surrounding the semiconductor chip and the first capacitive component, an output terminal provided on the frame, a wiring pattern provided on an upper surface of the frame, a first bonding wire electrically connecting the output pad to the output terminal, a second bonding wire electrically connecting another end of the first capacitive component to a first region in the wiring pattern, and a third bonding wire electrically connecting the output pad to a second region different from the first region in the wiring pattern.Type: ApplicationFiled: March 8, 2022Publication date: September 15, 2022Applicant: Sumitomo Electric Industries, Ltd.Inventor: Shuichi NISHIMURA
-
Patent number: 10759263Abstract: A vibration damping device including: an inner member; an outer bracket including a tubular part having an inner hole, and an end wall covering an opening of the tubular part; an intermediate member having a bent part, and first and second attachments provided at opposite sides of the bent part, while being inserted in the inner hole such that the first attachment is superposed on an inner face of the tubular part while the second attachment is axially superposed on the end wall; a main rubber elastic body elastically connecting the tubular part and an end portion of the inner member inserted in the inner hole, and elastically connecting the inner member and the attachments of the intermediate member that are bonded thereto; first and second fixtures fixing the first and second attachments to the outer bracket, respectively.Type: GrantFiled: December 14, 2018Date of Patent: September 1, 2020Assignee: SUMITOMO RIKO COMPANY LIMITEDInventors: Kenichi Kato, Shuichi Nishimura, Yorishige Shimizu
-
Publication number: 20190255931Abstract: A vibration damping device including: an inner member; an outer bracket including a tubular part having an inner hole, and an end wall covering an opening of the tubular part; an intermediate member having a bent part, and first and second attachments provided at opposite sides of the bent part, while being inserted in the inner hole such that the first attachment is superposed on an inner face of the tubular part while the second attachment is axially superposed on the end wall; a main rubber elastic body elastically connecting the tubular part and an end portion of the inner member inserted in the inner hole, and elastically connecting the inner member and the attachments of the intermediate member that are bonded thereto; first and second fixtures fixing the first and second attachments to the outer bracket, respectively.Type: ApplicationFiled: December 14, 2018Publication date: August 22, 2019Applicant: SUMITOMO RIKO COMPANY LIMITEDInventors: Kenichi KATO, Shuichi NISHIMURA, Yorishige SHIMIZU
-
Publication number: 20010037333Abstract: In each customer database, different kinds of asset information are registered so as to be retrieved using the different customer managing number as retrieval data. In an integrated identification information database, the customer managing number of the customer database is registered to constitute the integrated identification information under the association with the integrated ID as an identifier unique to each customer. A database integrating and managing section and the like integrates and manages the customer database based on the customer managing number associated with the integrated ID of the integrated identification information database. This arrangement makes it possible to easily integrate and manage a plurality of kinds of the asset information respectively registered in the different databases.Type: ApplicationFiled: April 13, 2001Publication date: November 1, 2001Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventor: Shuichi Nishimura
-
Patent number: 5450824Abstract: An internal combustion engine has an intake valve and an exhaust valve. When the engine operates at low speed with low and medium load, the intake valve is operated to close at a relatively advanced timing for increased volumetric effeciency and increased real compression ratio. When the engine operates at low speeds with high load, the exhaust valve is operated to close at a relatively retarded timing with the intake valve being operated to close at the relatively advanced timing, whereby the volumetric efficiency is subject to a drop to prevent occurrence of knocking.Type: GrantFiled: January 24, 1994Date of Patent: September 19, 1995Assignee: Nissan Motor Co., Ltd.Inventors: Michihiro Yamane, Akinobu Yoshibe, Shuichi Nishimura
-
Patent number: 4838215Abstract: In order to minimize the supercharging effect from the cylinder to cylinder and to maximize the efficiency of the inertia supercharging effect over essentially the whole engine speed range, first and second elongate collectors which communicate with separate banks of cylinders are interconnected at essentially their mid points by a connection tube having a selected length and cross-sectional area. An engine speed responsive valve disposed in the tube or pipe selectively induces the situation wherein quasi separate induction systems are defined for each bank of cylinders or a single enlarged system is established.Type: GrantFiled: April 21, 1988Date of Patent: June 13, 1989Assignees: Nissan Motor Co., Ltd., Aichi Machine Industry Co., Ltd.Inventors: Makoto Yasuda, Syousabu Ura, Shuichi Nishimura, Isaya Matsuo, Masami Kato, Munehiro Sagata
-
Patent number: 4741294Abstract: In order to minimize the supercharging effect from the cylinder to cylinder and to maximize the efficiency of the inertia supercharging effect over essentially the whole engine speed range, first and second elongate collectors which communicate with separate banks of cylinders are interconnected at essentially their mid points by a connection tube having a selected length and cross-sectional area. An engine speed responsive valve disposed in the tube or pipe selectively induces the situation wherein quasi separate induction systems are defined for each bank of cylinders or a single enlarged system is established.Type: GrantFiled: December 19, 1985Date of Patent: May 3, 1988Assignees: Nissan Motor Co., Ltd., Aichi Machine Industry Co., Ltd.Inventors: Makoto Yasuda, Syousabu Ura, Shuichi Nishimura, Isaya Matsuo, Masami Kato, Munehiro Sagata
-
Patent number: 4715329Abstract: In an induction system for an internal combustion engine having two groups of cylinders of which firing orders are respectively discontinuous, a groove is formed in a joining end face of a collector unit to be joined with a joining end face of an intake manifold in such a manner as to have a straight main groove section disposed between first and second groups of outlet ports so as to be equidistant from the outlet ports and a plurality of outlet groove sections branching off from the main groove section to fluidly connect the main groove section to each outlet ports. When the joining end faces of the collector unit and the intake manifold are joined together, a fluid recirculation passage such as a blow-by gas recirculation passage, an exhaust gas recirculation passage or the like is defined therebetween.Type: GrantFiled: April 8, 1986Date of Patent: December 29, 1987Assignee: Nissan Motor Co., Ltd.Inventors: Makoto Yasuda, Shuichi Nishimura, Syouzabu Ura
-
Patent number: 4545331Abstract: In a V-type internal combustion engine, an auxiliary air supply apparatus includes an auxiliary air distribution pipe which communicates directly to two or more mutually independent chambers in the intake system of the engine. This auxiliary air distribution pipe is connected and communicates to an auxiliary air channel so as to bypass an intake throttle valve. In this auxiliary air channel an auxiliary air control valve is installed to control the volume of auxiliary air flowing through the channel, according to the operating condition of the engine. Because of this, the auxiliary air controlled by the control valve is directly distributed to two or more chambers through the auxiliary air distribution pipes.Type: GrantFiled: June 11, 1984Date of Patent: October 8, 1985Assignee: Nissan Motor Co., Ltd.Inventors: Masafumi Ito, Shuichi Nishimura, Yoichi Hara