Patents by Inventor Shuichi Ogata
Shuichi Ogata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8193091Abstract: The present invention includes a die pad; signal leads, ground connection leads connected to the die pad; a semiconductor chip including electrode pads for grounding; metal thin wires, and an encapsulating resin for encapsulating the die pad and the semiconductor chip and encapsulating the signal leads and the ground connection lead such that lower portions of the signal leads and the ground connection lead are exposed as external terminals. The ground connection lead is connected to the electrode pad for grounding, so that the resin-encapsulated semiconductor device is electrically stabilized. Furthermore, interference between high frequency signals passing through the signal leads can be suppressed by the die pad and the ground connection leads.Type: GrantFiled: June 19, 2002Date of Patent: June 5, 2012Assignee: Panasonic CorporationInventors: Fumihiko Kawai, Toshiyuki Fukuda, Masanori Minamio, Noboru Takeuchi, Shuichi Ogata, Katsushi Tara, Tadayoshi Nakatsuka
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Patent number: 8077105Abstract: Disclosed is a directional bar-type antenna which comprising a plurality of bar-shaped antenna elements including a core and a coil wound around the core. The first bar-shaped antenna element is disposed at a position of a mirror image of the second bar-shaped antenna element with respect to the core of the third bar-shaped antenna element. The first and second bar-shaped antenna elements is positioned such that one end of each of the first and second bar-shaped antenna elements is close to the third bar-shaped antenna element, and the other end is far from the third bar-shaped antenna element. In the present invention, a winding direction of the coil of the first bar-shaped antenna element is preferably identical to that of the coil of the second bar-shaped antenna element, and is opposite to that of the coil of the third bar-shaped antenna element.Type: GrantFiled: April 3, 2009Date of Patent: December 13, 2011Assignee: Toko Inc.Inventors: Masayuki Takahashi, Shuichi Ogata, Masanori Eiri, Kinya Kishita, Satoru Kimura
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Patent number: 7952177Abstract: A resin-sealed semiconductor device with built-in heat sink prevents internal bulging and cracking caused by exfoliation of a semiconductor element from the heat sink when the vapor pressure of moisture absorbed into a gap between the semiconductor element and the heat sink rises during mounting of the semiconductor device to a printed circuit board using lead-free solder. By providing a plurality of separated die pads (502) in a mounting area for a semiconductor element (301) and adhering the semiconductor element (301) to the heat sink (105) via the die pads (502), space is opened up between the semiconductor element (301) and the heat sink (105) for sealing resin (304) to run into.Type: GrantFiled: September 11, 2008Date of Patent: May 31, 2011Assignee: Panasonic CorporationInventors: Tomoki Kawasaki, Yuichiro Yamada, Toshiyuki Fukuda, Shuichi Ogata
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Publication number: 20090251376Abstract: Disclosed is a directional bar-type antenna which comprising a plurality of bar-shaped antenna elements including a core and a coil wound around the core. The first bar-shaped antenna element is disposed at a position of a mirror image of the second bar-shaped antenna element with respect to the core of the third bar-shaped antenna element. The first and second bar-shaped antenna elements is positioned such that one end of each of the first and second bar-shaped antenna elements is close to the third bar-shaped antenna element, and the other end is far from the third bar-shaped antenna element. In the present invention, a winding direction of the coil of the first bar-shaped antenna element is preferably identical to that of the coil of the second bar-shaped antenna element, and is opposite to that of the coil of the third bar-shaped antenna element.Type: ApplicationFiled: April 3, 2009Publication date: October 8, 2009Applicant: Toko, Inc.Inventors: Masayuki TAKAHASHI, Shuichi OGATA, Masanori EIRI, Kinya KISHITA, Satoru KIMURA
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Patent number: 7508055Abstract: A semiconductor device includes a die pad of a conductive material, a quadrilateral semiconductor element mounted on the die pad, a plurality of suspension members of the conductive material extending outward from the die pad, a plurality of leads of the conductive material provided between adjacent two of the suspension members and each having a lead end opposed to the semiconductor element, a plurality of thin conductive wires through which the semiconductor element is connected to the leads, respectively, an encapsulant for encapsulating the die pad, the semiconductor element, the suspension members, parts of the leads and the thin conductive wires, and a grounding lead of the conductive material extending from at least one of the suspension members and provided, in part, between one and another of the leads.Type: GrantFiled: January 14, 2005Date of Patent: March 24, 2009Assignee: Panasonic CorporationInventors: Yutaka Katou, Akira Oga, Shuichi Ogata, Hideki Sakoda
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Publication number: 20090008754Abstract: A resin-sealed semiconductor device with built-in heat sink prevents internal bulging and cracking caused by exfoliation of a semiconductor element from the heat sink when the vapor pressure of moisture absorbed into a gap between the semiconductor element and the heat sink rises during mounting of the semiconductor device to a printed circuit board using lead-free solder. By providing a plurality of separated die pads (502) in a mounting area for a semiconductor element (301) and adhering the semiconductor element (301) to the heat sink (105) via the die pads (502), space is opened up between the semiconductor element (301) and the heat sink (105) for sealing resin (304) to run into.Type: ApplicationFiled: September 11, 2008Publication date: January 8, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Tomoki KAWASAKI, Yuichiro Yamada, Toshiyuki Fukuda, Shuichi Ogata
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Publication number: 20060097371Abstract: A resin-sealed semiconductor device with built-in heat sink prevents internal bulging and cracking caused by exfoliation of a semiconductor element from the heat sink when the vapor pressure of moisture absorbed into a gap between the semiconductor element and the heat sink rises during mounting of the semiconductor device to a printed circuit board using lead-free solder. By providing a plurality of separated die pads (502) in a mounting area for a semiconductor element (301) and adhering the semiconductor element (301) to the heat sink (105) via the die pads (502), space is opened up between the semiconductor element (301) and the heat sink (105) for sealing resin (304) to run into.Type: ApplicationFiled: August 2, 2005Publication date: May 11, 2006Inventors: Tomoki Kawasaki, Yuichiro Yamada, Toshiyuki Fukuda, Shuichi Ogata
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Publication number: 20050253280Abstract: A semiconductor device includes a die pad of a conductive material, a quadrilateral semiconductor element mounted on the die pad, a plurality of suspension members of the conductive material extending outward from the die pad, a plurality of leads of the conductive material provided between adjacent two of the suspension members and each having a lead end opposed to the semiconductor element, a plurality of thin conductive wires through which the semiconductor element is connected to the leads, respectively, an encapsulant for encapsulating the die pad, the semiconductor element, the suspension members, parts of the leads and the thin conductive wires, and a grounding lead of the conductive material extending from at least one of the suspension members and provided, in part, between one and another of the leads.Type: ApplicationFiled: January 14, 2005Publication date: November 17, 2005Inventors: Yutaka Katou, Akira Oga, Shuichi Ogata, Hideki Sakoda
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Patent number: 6633077Abstract: On a surface of a pair of support leads formed in one piece with a die pad on which a semiconductor chip is mounted, a protrusion is formed on the side that the semiconductor chip is mounted. During a resin-sealing, a lower surface of the die pad is brought into contact with an internal wall surface of a lower die, while a top of the protrusion is brought into contact with an internal wall surface of an upper die. This makes it possible to prevent the displacement of the die pad during sealing, thus causing no residual distortion of the semiconductor chip. As a result, a semiconductor device with a stable quality can be obtained.Type: GrantFiled: December 14, 2000Date of Patent: October 14, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shuichi Ogata, Kenichi Itoh
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Publication number: 20030127711Abstract: The present invention includes a die pad; signal leads, ground connection leads connected to the die pad; a semiconductor chip including electrode pads for grounding; metal thin wires, and an encapsulating resin for encapsulating the die pad and the semiconductor chip and encapsulating the signal leads and the ground connection lead such that lower portions of the signal leads and the ground connection lead are exposed as external terminals. The ground connection lead is connected to the electrode pad for grounding, so that the resin-encapsulated semiconductor device is electrically stabilized. Furthermore, interference between high frequency signals passing through the signal leads can be suppressed by the die pad and the ground connection leads.Type: ApplicationFiled: June 19, 2002Publication date: July 10, 2003Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Fumihiko Kawai, Toshiyuki Fukuda, Masanori Minamio, Noboru Takeuchi, Shuichi Ogata, Katsushi Tara, Tadayoshi Nakatsuka
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Publication number: 20010015482Abstract: On a surface of a pair of support leads formed in one piece with a die pad on which a semiconductor chip is mounted, a protrusion is formed on the side that the semiconductor chip is mounted. During a resin-sealing, a lower surface of the die pad is brought into contact with an internal wall surface of a lower die, while a top of the protrusion is brought into contact with an internal wall surface of an upper die. This makes it possible to prevent the displacement of the die pad during sealing, thus causing no residual distortion of the semiconductor chip. As a result, a semiconductor device with a stable quality can be obtained.Type: ApplicationFiled: March 26, 2001Publication date: August 23, 2001Inventors: Shuichi Ogata, Kenichi Itoh
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Patent number: D600219Type: GrantFiled: October 24, 2006Date of Patent: September 15, 2009Assignee: Panasonic CorporationInventors: Akira Oga, Shuichi Ogata