Patents by Inventor Shuichi Satoh

Shuichi Satoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9567763
    Abstract: A robust vibration damping device not suffering from destruction even when an earthquake force is increased. A vibration damping wall structure includes a structural frame comprising a foundation, a beam, and vertical members. One set of vibration damping devices are attached to a first vertical member, and another set of vibration damping devices are attached at positions respectively opposing the one set of vibration damping devices to a second vertical member. Each of the vibration damping devices is connected with the vertical member by way of a brace. The vibration damping devices in the one set and opposing vibration damping devices in another set are connected each other in a lateral direction by lateral connection members between each of the sets. Further, the vibration damping devices of each of the sets are connected each other in a vertical direction by the vertical connection members respectively in each of the sets.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: February 14, 2017
    Assignees: SATOH CO., LTD., DOMUS ARCHITECT OFFICE CO., LTD.
    Inventors: Kenji Miyazawa, Shuichi Satoh, Isao Okawa
  • Publication number: 20160244966
    Abstract: A robust vibration damping device not suffering from destruction even when an earthquake force is increased. A vibration damping wall structure includes a structural frame comprising a foundation, a beam, and vertical members. One set of vibration damping devices are attached to a first vertical member, and another set of vibration damping devices are attached at positions respectively opposing the one set of vibration damping devices to a second vertical member. Each of the vibration damping devices is connected with the vertical member by way of a brace. The vibration damping devices in the one set and opposing vibration damping devices in another set are connected each other in a lateral direction by lateral connection members between each of the sets. Further, the vibration damping devices of each of the sets are connected each other in a vertical direction by the vertical connection members respectively in each of the sets.
    Type: Application
    Filed: April 6, 2015
    Publication date: August 25, 2016
    Applicants: SATOH CO., LTD., DOMUS ARCHITECT OFFICE CO., LTD.
    Inventors: Kenji MIYAZAWA, Shuichi SATOH, Isao OKAWA
  • Patent number: 9145701
    Abstract: An earthquake resistant reinforcement apparatus of a structure that can be attached simply and conveniently even to an aged building and imposes no substantial burden on inhabitants. The structure has an anti-seismic device for absorbing a seismic energy, an attaching member for attaching the anti-seismic device to the outside of a building, and a horizontal supporting member for supporting the anti-seismic device substantially horizontally. A plurality of attaching members are provided spot-wise to the girder or the beam of an existent building and the horizontal supporting member is a horizontal connection beam for connecting the attaching member horizontally.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: September 29, 2015
    Assignees: SATOH CO., LTD., DOMUS ARCHITECT OFFICE CO., LTD.
    Inventors: Shuichi Satoh, Isao Okawa
  • Publication number: 20150033641
    Abstract: An earthquake resistant reinforcement apparatus of a structure that can be attached simply and conveniently even to an aged building and imposes no substantial burden on inhabitants. The structure has an anti-seismic device for absorbing a seismic energy, an attaching member for attaching the anti-seismic device to the outside of a building, and a horizontal supporting member for supporting the anti-seismic device substantially horizontally. A plurality of attaching members are provided spot-wise to the girder or the beam of an existent building and the horizontal supporting member is a horizontal connection beam for connecting the attaching member horizontally.
    Type: Application
    Filed: May 5, 2014
    Publication date: February 5, 2015
    Applicants: SATOH CO., LTD., DOMUS ARCHITECT OFFICE CO., LTD.
    Inventors: Shuichi SATOH, Isao OKAWA
  • Patent number: 6782614
    Abstract: A contact pin assembly for a socket for electrical parts comprises a plurality of contact pins provided for a socket body of a socket for electrical parts and a connection member, formed separately, connecting all the contact pins with a predetermined distance between adjacent ones. The predetermined distance is made substantially equal to a distance between adjacent ones of terminals provided for an electrical part which is held in the socket body.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: August 31, 2004
    Assignee: Enplas Corporation
    Inventors: Shuichi Satoh, Masami Fukunaga
  • Patent number: 6720783
    Abstract: An IC socket with good durability that permits electrical tests on the IC to be performed accurately over a long period of time is provided. An elastically deformable metal plate 12 is fixed within a spring accommodating portion 9 of a support board 2. The metal plate 12 is such that a plurality of spiral cantilevers 19 are formed so as to correspond to bumps 21 of the IC 10, and the flat tip 19a of the spiral cantilever supports an insulative resin film 3. When the IC 10 is pressed by an IC pressing part 54 and the bump 21 of the IC 10 flexibly deforms the spring part S via the insulative resin film 3, a contact pressure due to the elastic force of the spring part S occurs in the contact area between the bump 21 and contact pad 11.
    Type: Grant
    Filed: November 29, 2002
    Date of Patent: April 13, 2004
    Assignee: Enplas Corporation
    Inventors: Shuichi Satoh, Tomoyoshi Yamaguchi
  • Publication number: 20030132771
    Abstract: An IC socket with good durability that permits electrical tests on the IC to be performed accurately over a long period of time is provided. An elastically deformable metal plate 12 is fixed within a spring accommodating portion 9 of a support board 2. The metal plate 12 is such that a plurality of spiral cantilevers 19 are formed so as to correspond to bumps 21 of the IC 10, and the flat tip 19a of the spiral cantilever supports an insulative resin film 3. When the IC 10 is pressed by an IC pressing means 54 and the bump 21 of the IC 10 flexibly deforms the spring means S via the insulative resin film 3, a contact pressure due to the elastic force of the spring means S occurs in the contact area between the bump 21 and contact pad 11.
    Type: Application
    Filed: November 29, 2002
    Publication date: July 17, 2003
    Inventors: Shuichi Satoh, Tomoyoshi Yamaguchi
  • Patent number: 6575767
    Abstract: A contact pin assembly for a socket for electrical parts comprises a plurality of contact pins provided for a socket body of a socket for electrical parts and a connection member, formed separately, connecting all the contact pins with a predetermined distance between adjacent ones. The predetermined distance is made substantially equal to a distance between adjacent ones of terminals provided for an electrical part which is held in the socket body.
    Type: Grant
    Filed: May 16, 2001
    Date of Patent: June 10, 2003
    Assignee: Enplas Corporation
    Inventors: Shuichi Satoh, Masami Fukunaga
  • Patent number: 6512388
    Abstract: An IC socket with good durability that permits electrical tests on IC to be performed accurately over a long period of time is provided. An elastically deformable metal plate 12 is fixed within a spring accommodating portion 9 of a support board 2. The metal plate 12 is such that a plurality of spiral cantilevers 19 are formed so as to correspond to bumps 21 of the IC 10, and the flat tip 19a of the spiral cantilever supports an insulative resin film 3. When the IC 10 is pressed by an IC pressing part 54 and the bump 21 of the IC 10 flexibly deforms the spring part S via the insulative resin film 3, a contact pressure due to the elastic force of the spring part S occurs in the contact area between the bump 21 and contact pad 11.
    Type: Grant
    Filed: June 20, 2000
    Date of Patent: January 28, 2003
    Assignee: Enplas Corporation
    Inventors: Shuichi Satoh, Tomoyoshi Yamaguchi
  • Publication number: 20030003782
    Abstract: A contact pin assembly for a socket for electrical parts comprises a plurality of contact pins provided for a socket body of a socket for electrical parts and a connection member, formed separately, connecting all the contact pins with a predetermined distance between adjacent ones. The predetermined distance is made substantially equal to a distance between adjacent ones of terminals provided for an electrical part which is held in the socket body.
    Type: Application
    Filed: September 6, 2002
    Publication date: January 2, 2003
    Applicant: ENPLAS CORPORATION
    Inventors: Shuichi Satoh, Masami Fukunaga
  • Publication number: 20010044226
    Abstract: A contact pin assembly for a socket for electrical parts comprises a plurality of contact pins provided for a socket body of a socket for electrical parts and a connection member, formed separately, connecting all the contact pins with a predetermined distance between adjacent ones. The predetermined distance is made substantially equal to a distance between adjacent ones of terminals provided for an electrical part which is held in the socket body.
    Type: Application
    Filed: May 16, 2001
    Publication date: November 22, 2001
    Inventors: Shuichi Satoh, Masami Fukunaga
  • Patent number: 6129900
    Abstract: A colorless and transparent, substantially inclusion-free diamond crystal which can be applied to decorative uses and optical parts is synthesized by a process using a temperature gradient method in an ultra-high pressure apparatus. This process comprises using, as a solvent for the growth of the crystal, at least one metal selected from the group consisting of Fe, Co, Ni, Mn and Cr (at least two metals in the case of containing Fe) and as a nitrogen getter for the removal of nitrogen in the solvent, at least one metal selected from the group consisting of Al, Ti, Zr, Hf, V, Nb and Ta in a proportion of 0.5 to 7% by weight (at most 2% by weight when using only Al) to the solvent metal.
    Type: Grant
    Filed: September 16, 1994
    Date of Patent: October 10, 2000
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Shuichi Satoh, Hitoshi Sumiya, Kazuwo Tsuji, Yasushi Gouda
  • Patent number: 6030595
    Abstract: A high purity synthetic diamond with less impurities, crystals defects, strains, etc. can be provided, in which the nitrogen content is at most 10 ppm, preferably at most 0.1 ppm and the boron content is at most 1 ppm, preferably at most 0.1 ppm or in which nitrogen atoms and boron atoms are contained in the crystal and the difference between the number of the nitrogen atoms and that of the boron atoms is at most 1.times.10.sup.17 atoms/cm.sup.3. The strain-free synthetic diamond can be produced by a process for the production of a strain-free synthetic diamond by the temperature gradient method, which comprises using a carbon source having a boron content of at most 10 ppm and a solvent metal having a boron content of at most 1 ppm and adding a nitrogen getter to the solvent metal, thereby synthesizing the diamond.
    Type: Grant
    Filed: July 22, 1996
    Date of Patent: February 29, 2000
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Hitoshi Sumiya, Shuichi Satoh, Yoshiki Nishibayashi
  • Patent number: 6007916
    Abstract: A synthetic single crystal diamond for wire drawing die; the process of manufacturing it and a wire drawing die to utilize it are disclosed. At least one plane of the diamond for wire drawing die is a cleavage plane of (111) faces, and the drawing hole of wire drawing die lies vertical to the cleavage plane.The diamond for the wire drawing die is produced by providing a synthetic single crystal having 20-400 ppm nitrogen of Ib type diamond. A groove is made on the diamond surface parallel to (111) faces employing energy beams such as a laser beam, an ion beam and an electron beam. A wedge is struck into the groove to cleave the diamond, and a plate is obtained. Furthermore, the plate is divided into polyhedrons, employing either an energy beam or a blade. The cleavage plane of the polyhedron is almost parallel to the (111) faces of crystal, therefore the cleavage plane is used as the standard plane to build the drawing hole.
    Type: Grant
    Filed: May 23, 1994
    Date of Patent: December 28, 1999
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Shuichi Satoh, Kazuwo Tsuji, Akito Yoshida, Nobuo Urakawa
  • Patent number: 5912217
    Abstract: An improved diamond sintered body having an excellent breakage resistance, corrosion resistance, heat resistance and wear resistance and capable of being sintered at a relatively low pressure and low temperature can be provided. The feature thereof consists in a diamond sintered body comprising 50 to 99.9 volume % of diamond and the balance of a binder phase consisting of a single or mixed phase of a compound (C) or composite (C') of at least one element (A) selected from the group consisting of rare earth elements, Group 3B, 4A, 4B and 6B elements of Periodic Table, iron group, Mn, V, alkali metals and alkaline earth metals with a phosphorus compound (B), or of the above described compound (C) or composite (C') with an oxide of (A).
    Type: Grant
    Filed: September 15, 1995
    Date of Patent: June 15, 1999
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Hitoshi Sumiya, Shuichi Satoh, Takeru Nakashima, Yasuyuki Kanada
  • Patent number: 5908503
    Abstract: A colorless, transparent low defect density, synthetic type IIa diamond single crystal, in which the etch pits due to needle-shaped defects are at most 3.times.10.sup.5 pieces/cm.sup.2, and which can be applied to uses needing high crystallinity of diamond, for example, monochromators, semiconductor substrates, spectroscopic crystals in X-ray range, electronic materials, etc., is provided by a process for the production of the colorless, transparent low defect density, synthetic diamond single crystal by growing new diamond crystal on a seed crystal of diamond by the temperature gradient method which comprises using a crystal defect-free diamond single crystal, as a seed crystal of diamond, and optionally subjecting to a heat treatment in a non-oxidizing atmosphere at a low pressure and a temperature of 1100 to 1600.degree. C.
    Type: Grant
    Filed: December 5, 1995
    Date of Patent: June 1, 1999
    Assignee: Sumitomo Electric Industries. Ltd.
    Inventors: Hitoshi Sumiya, Naohiro Toda, Shuichi Satoh
  • Patent number: 5769176
    Abstract: The present invention provides a diamond sintered compact having a higher strength as well as more excellent heat resistance, breakage resistance and corrosion resistance, as compared with those of the prior art, which thus can effectively be applied to tool materials for cutting or polishing of non-ferrous metals or ceramics, and edge materials of drill bits for excavating petroleum. The feature of the diamond sintered compact contains 0.1 to 30 volume % of at least one compound containing at least one element selected from the group consisting of silicon and titanium, and oxygen and the balance of diamond, for example, a titanate of a metal selected from the group consisting of iron, cobalt, nickel and manganese.
    Type: Grant
    Filed: July 5, 1996
    Date of Patent: June 23, 1998
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Hitoshi Sumiya, Shuichi Satoh
  • Patent number: 5560241
    Abstract: A synthetic single crystal diamond for wire drawing die; the process of manufacturing it and a wire drawing die to utilize it are disclosed. At least one plane of the diamond for wire drawing die is a cleavage plane of (111) faces, and the drawing hole of wire drawing die lies vertical to the cleavage plane. The diamond for the wire drawing die is produced by providing a synthetic single crystal having 20-400 ppm nitrogen of Ib type diamond. A groove is made on the diamond surface parallel to (111) faces employing energy beams such as a laser beam, an ion beam and an electron beam. A wedge is struck into the groove to cleave the diamond, and a plate is obtained. Furthermore, the plate is divided into polyhedrons, employing either an energy beam or a blade. The cleavage plane of the polyhedron is almost parallel to the (111) faces of crystal, therefore the cleavage plane is used as the standard plane to build the drawing hole.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: October 1, 1996
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Shuichi Satoh, Kazuwo Tsuji, Akito Yoshida, Nobuo Urakawa
  • Patent number: 5245189
    Abstract: An infrared optical part comprised of a synthetic diamond single crystal, and a method of making the same. The infrared optical part is comprised of a synthetic diamond having a nitrogen content of not more than 5 ppm and a boron content of not more than 3 ppm, wherein the parallelism between its light incident and reflecting surfaces is not more than one minute. The infrared optical part is used as a window member in infrared spectral analysis. It is also used in the form of a pair of anvils for holding a sample therebetween in connection with the measurement of transmitted light that has passed through the sample after the sample is compressed. The part is also used in the form of an infrared ATR prism.
    Type: Grant
    Filed: March 13, 1992
    Date of Patent: September 14, 1993
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Shuichi Satoh, Yasushi Goda, Kazuwo Tsuji
  • Patent number: 5144539
    Abstract: An illumination device having a reflecting plate, at least one linear light source arranged on a first side of the reflecting plate, a diffusing plate arranged on a second side of the reflecting plate, and a light quantity adjusting member formed integrally with the reflecting plate.
    Type: Grant
    Filed: May 28, 1991
    Date of Patent: September 1, 1992
    Assignee: Dai-Ichi Seiko Co., Ltd.
    Inventors: Hideaki Katoh, Nobuhisa Noguchi, Yutaka Kikuchi, Isamu Kaneko, Toshiaki Sugimoto, Seiki Kitahara, Teruo Hoshi, Minoru Suzuki, Shuichi Satoh