Abstract: A substrate cleaning device includes a rotation mechanism that rotates the substrate, a first cleaning solution supply nozzle that discharges a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate, and a swing mechanism that swings the first cleaning solution supply nozzle from a vicinity of a rotation center of the substrate toward an outer peripheral edge of the substrate in a range narrower than a half-surface of the substrate.

Abstract: A substrate holding and rotation mechanism includes: a substrate holding roller that holds a peripheral portion of the substrate and rotates the substrate, the substrate holding roller including, a lower portion of the roller facing the lower surface of the peripheral portion of the substrate, an upper portion of the roller facing the upper surface of the peripheral portion of the substrate, and a clamping groove which is provided between the lower portion of the roller and the upper portion of the roller and into which the peripheral portion of the substrate is inserted; and a roller washing nozzle that injects a fluid from diagonally above the substrate holding roller to an area including the clamp groove and an upper surface of the upper portion of the roller.

Abstract: The disclosure provides a jig for attaching and detaching a cleaning member, which facilitates attaching and detaching the cleaning member to and from a rotation device without holding the cleaning member directly by hand, even when there is no sufficient spacing around the cleaning member. The jig 100 for attaching and detaching a cleaning member 60 includes a pair of jig bodies 110 capable of clamping two ends 63 of a holder 62 of the cleaning member 60, and a connecting mechanism 120 that interlocks the movements of the pair of jig bodies 110 between a clamped state in which two ends 63 of the holder 62 are clamped and a non-clamped state in which the clamped state is released.

Abstract: A substrate cleaning device includes a rotation mechanism that rotates the substrate, a first cleaning solution supply nozzle that discharges a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate, and a swing mechanism that swings the first cleaning solution supply nozzle from a vicinity of a rotation center of the substrate toward an outer peripheral edge of the substrate in a range narrower than a half-surface of the substrate.

Abstract: A substrate holding and rotation mechanism includes: a substrate holding roller that holds a peripheral portion of the substrate and rotates the substrate, the substrate holding roller including, a lower portion of the roller facing the lower surface of the peripheral portion of the substrate, an upper portion of the roller facing the upper surface of the peripheral portion of the substrate, and a clamping groove which is provided between the lower portion of the roller and the upper portion of the roller and into which the peripheral portion of the substrate is inserted; and a roller washing nozzle that injects a fluid from diagonally above the substrate holding roller to an area including the clamp groove and an upper surface of the upper portion of the roller.

Abstract: A break-in apparatus 100 has a supply unit 20 for supplying a cleaning liquid, a substrate support unit 30 for holding a dummy substrate W1 and a cleaning member holding unit 40 for performing a break-in processing on the cleaning member 200 by rotating the cleaning member 200 and bringing the cleaning member 200 into contact with the dummy substrate W1.

Abstract: The disclosure provides a jig for attaching and detaching a cleaning member, which facilitates attaching and detaching the cleaning member to and from a rotation device without holding the cleaning member directly by hand, even when there is no sufficient spacing around the cleaning member. The jig 100 for attaching and detaching a cleaning member 60 includes a pair of jig bodies 110 capable of clamping two ends 63 of a holder 62 of the cleaning member 60, and a connecting mechanism 120 that interlocks the movements of the pair of jig bodies 110 between a clamped state in which two ends 63 of the holder 62 are clamped and a non-clamped state in which the clamped state is released.

Abstract: A self-cleaning device of the present disclosure includes: a cleaning member configured to clean a cleaning tool that cleans a substrate; and an injection unit configured to inject a liquid toward the cleaning member or the cleaning tool. The cleaning member has a cleaning surface that cleans the cleaning tool when the cleaning tool is pressed thereagainst, and the cleaning surface is inclined with respect to a horizontal plane.

Abstract: A break-in apparatus 100 has a supply unit 20 for supplying a cleaning liquid, a substrate support unit 30 for holding a dummy substrate W1 and a cleaning member holding unit 40 for performing a break-in processing on the cleaning member 200 by rotating the cleaning member 200 and bringing the cleaning member 200 into contact with the dummy substrate W1.

Abstract: A self-cleaning device of the present disclosure includes: a cleaning member configured to clean a cleaning tool that cleans a substrate; and an injection unit configured to inject a liquid toward the cleaning member or the cleaning tool. The cleaning member has a cleaning surface that cleans the cleaning tool when the cleaning tool is pressed thereagainst, and the cleaning surface is inclined with respect to a horizontal plane.

Abstract: An apparatus for replacing a polishing table, which is used in a polishing apparatus for polishing a substrate such as wafer, is disclosed. The polishing table replacement apparatus (10) is used for removing a polishing table (3) from a polishing apparatus (1). This polishing table replacement apparatus (10) includes a crane (10) configured to move the polishing table (3) vertically and horizontally, a table stage (14) on which the polishing table (3) can be placed, and a table-stage tilting mechanism (15) configured to tilt the table stage (14).

Abstract: An apparatus for replacing a polishing table, which is used in a polishing apparatus for polishing a substrate such as wafer, is disclosed. The polishing table replacement apparatus (10) is used for removing a polishing table (3) from a polishing apparatus (1). This polishing table replacement apparatus (10) includes a crane (10) configured to move the polishing table (3) vertically and horizontally, a table stage (14) on which the polishing table (3) can be placed, and a table-stage tilting mechanism (15) configured to tilt the table stage (14).