Abstract: A driving mechanism including a first rod (103a), a second rod (104a), a first planar motor (106) moving on a plane, a center planar motor (105) moving on the plane and a moving portion (101), in which one end of the first rod is rotatably connected to the moving portion by a first rotation fulcrum (125a), the other end of the first rod is rotatably connected to the first planar motor by a second rotation fulcrum (126a), one end of the second rod is rotatably connected by a third rotation fulcrum (128a) provided on the first rod. The other end of the second rod is rotatably connected to the center planar motor by a fourth rotation fulcrum (127a), and the moving portion is moved so as to recede from the center planar motor when the first planar motor is moved near to the center planar motor.

Abstract: A driving mechanism including a first rod (103a), a second rod (104a), a first planar motor (106) moving on a plane, a center planar motor (105) moving on the plane and a moving portion (101), in which one end of the first rod is rotatably connected to the moving portion by a first rotation fulcrum (125a), the other end of the first rod is rotatably connected to the first planar motor by a second rotation fulcrum (126a), one end of the second rod is rotatably connected by a third rotation fulcrum (128a) provided on the first rod. The other end of the second rod is rotatably connected to the center planar motor by a fourth rotation fulcrum (127a), and the moving portion is moved so as to recede from the center planar motor when the first planar motor is moved near to the center planar motor.

Abstract: A bonding apparatus includes a bonding arm which has a receiving portion facing a center axis of a bonding tool; a pair of capillary holding portions in contact with the bonding tool; a pair of piezoelectric elements configured to generate an ultrasonic vibration in contact with the capillary holding portions; and a pressurizing device which has a pressurizing member arranged to face the receiving portion of the bonding arm and a moving device configured to move the pressurizing member toward the receiving portion of the bonding arm. The pressurizing member is moved in a state in which the pair of piezoelectric elements, the pair of capillary holding portions, and the bonding tool are placed between the receiving portion of the bonding arm to cause the bonding arm to hold the pair of capillary holding portion and the bonding tool.

Abstract: A bonding apparatus includes a bonding arm which has a receiving portion facing a center axis of a bonding tool; a pair of capillary holding portions in contact with the bonding tool; a pair of piezoelectric elements configured to generate an ultrasonic vibration in contact with the capillary holding portions; and a pressurizing device which has a pressurizing member arranged to face the receiving portion of the bonding arm and a moving device configured to move the pressurizing member toward the receiving portion of the bonding arm. The pressurizing member is moved in a state in which the pair of piezoelectric elements, the pair of capillary holding portions, and the bonding tool are placed between the receiving portion of the bonding arm to cause the bonding arm to hold the pair of capillary holding portion and the bonding tool.

Abstract: A method of marking materials, wherein the surface of a marking material and the surface of a material to be marked are matched, a laser beam is applied to the marking material while scanning the beam to form a mark, the material to be marked consisting a transparent body on which a pattern of a character or the like is formed. The method for marking comprises a first step of applying the laser beam to the marking material with the first laser power to evaporate the marking material and make them deposit to a predetermined part of the material to be marked, a second step of applying a laser beam to the deposited matter on the material to be marked with a second laser power to remove or transform the deposited mater. Steel or stainless steel is used as the marking materials.

Abstract: A method of marking materials, wherein the surface of a marking material and the surface of a material to be marked are matched, a laser beam is applied to the marking material while scanning the beam to form a mark, the material to be marked consisting a transparent body on which a pattern of a character or the like is formed. The method for marking comprises a first step of applying the laser beam to the marking material with the first laser power to evaporate the marking material and make them deposit to a predetermined part of the material to be marked, a second step of applying a laser beam to the deposited matter on the material to be marked with a second laser power to remove or transform the deposited mater. Steel or stainless steel is used as the marking materials.

Abstract: An actuator which carries a magnetic head of a disk memory seeks a track on the disk by being actuated by a pair of trapezoidal drive currents, which have no or less power spectrum at the frequency coinciding with the mechanical resonance frequency of the positioning mechanisms. A trapezoidal waveform whose ratio of an upper side to a bottom side is adjusted depending on seek stroke. The mechanical resonance frequency may be within the range of the power spectrum of the trapezoidal drive currents so long as it coincides with the characteristic frequency with a zero power spectrum. A constant velocity region which has no current flowing into the actuator between the first positive trapezoidal current and the second negative trapezoidal current is provided when the seek stroke is long.