Abstract: Disclosed herein is an electric circuit module that includes a circuit board, an electronic component mounted on an upper surface of the circuit board, and a mold member that covers the upper and side surfaces of the circuit board. The lower area of the side surface of the circuit board is exposed so as not to be covered with the mold member.

Abstract: A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.

Abstract: Disclosed herein is an electronic circuit module that includes a circuit board, an electronic component mounted on an upper surface of the circuit board, and a mold member that covers the upper and side surfaces of the circuit board. The lower area of the side surface of the circuit board is exposed so as not to be covered with the mold member.

Abstract: An electronic circuit package disclosed in the present disclosure includes: a package board having an upper surface, a bottom surface positioned on a side opposite to the upper surface, and a side surface connecting the upper and bottom surfaces; an electronic component mounted on the upper surface of the package board; a first protective layer covering the upper surface of the package board so as to embed therein the electronic component; and a second protective layer covering the side surface of the package board. The first and second protective layers contact each other.

Abstract: A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.

Abstract: A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.

Abstract: Disclosed herein is an electronic component that includes a mounting surface having a terminal formation area and a plurality of terminal electrodes arranged in an array in the terminal formation area. The center point of the terminal formation area is offset with respect to the center point of the mounting surface. Thus, at mounting of the electronic component on a mounting substrate, a solder paste is supplied to a land pattern, and then the mounting is performed such that the center point of a mounting area and the center point of the mounting surface coincide with each other, whereby a predetermined displacement occurs between the planar positions of the land pattern and terminal electrode. This allows a void inside the solder to be released outside without involving a layout change of the land pattern.

Abstract: Disclosed herein is an electric circuit module that includes a circuit board, an electronic component mounted on an upper surface of the circuit board, and a mold member that covers the upper and side surfaces of the circuit board. The lower area of the side surface of the circuit board is exposed so as not to be covered with the mold member.

Abstract: A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion 51 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.

Abstract: A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.

Abstract: A circuit module 2 comprises: a wiring structure 4; an electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which the electronic component 6a, 6b is embedded; and a metal layer 10 provided on a side surface S1 of the insulating resin layer 8 and a side surface S2 of the wiring structure 4. The surface roughness of the side surface S1 of the insulating resin layer 8 is expressed as R1. The surface roughness of the side surface S2 of the wiring structure 4 is expressed as R2. R1 and R2 differ from each other.

Abstract: A circuit module 2 comprises: a wiring structure 4; an electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which the electronic component 6a, 6b is embedded; and a metal layer 10 provided on a side surface S1 of the insulating resin layer 8 and a side surface S2 of the wiring structure 4. The surface roughness of the side surface S1 of the insulating resin layer 8 is expressed as R1. The surface roughness of the side surface S2 of the wiring structure 4 is expressed as R2. R1 and R2 differ from each other.

Abstract: A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion 51 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.

Abstract: To reliably detect a communication error status and to resolve the communication error status when reliably recovered from the error status. A count value is changed into one of up and down directions when a communication error is detected by a communication error determination unit, the count value is changed into the other direction of the up and down directions when communication being normal is detected by the communication error determination unit, a communication error status is output when the count value becomes a first threshold value, and the communication error status is resolved when the count value becomes a second threshold value different from the first threshold value.

Abstract: A power storage device includes: power storage units each including at least one battery, the power storage units being connected in series; cell balance units connected in parallel to the respective power storage units via switches; and a control unit that performs control to charge the power storage units with a first constant current value, and, when the power storage unit having the highest voltage among the power storage units reaches a first potential, connect the corresponding one of the cell balance units to the power storage unit having the highest voltage, and switch the charging current to a second constant current value that is smaller than the first constant current value.

Abstract: A battery package including a power storage portion; and a control device, where the control device determines if a first temperature of the power storage portion is higher than a predetermined temperature, and if the first temperature is higher than the predetermined temperature, discharges the power storage portion at a first discharge rate.

Abstract: There is provided a power storage device including a plurality of modules each including secondary batteries, a charging switch that controls charging to the secondary batteries, a discharging switch that controls discharging of the secondary batteries, and a voltage measuring unit that measures a voltage of the module, and a switch control unit that controls one or both of the charging switch and the discharging switch. The modules are connected in parallel. The switch control unit maintains an on state of the discharging switch for at least one of the modules for a predetermined period, and controls the charging switch of the module in which a maximum module charging current estimated based on the voltage of the module is a predetermined value or less, to be in an on state.

Abstract: An electronic module is provided with a circuit board 2, a chip component 3 surface-mounted on the circuit board 2 and a mold member 4 that seals the chip component 3. The circuit board 2 includes a land 7 and a resist pattern 8A that partially covers the land 7. The chip component 3 has a bottom electrode 6b and a side electrode 6c. The resist pattern 8A has an overlapped portion overlapped with the bottom electrode 6b of the chip component 3 in a planar view. A portion of the mold member 4 is filled at least in a first gap D1 between the resist pattern 8A and the first solder portion 10a.

Abstract: A power storage device includes: power storage units each including at least one battery, the power storage units being connected in series; cell balance units connected in parallel to the respective power storage units via switches; and a control unit that performs control to charge the power storage units with a first constant current value, and, when the power storage unit having the highest voltage among the power storage units reaches a first potential, connect the corresponding one of the cell balance units to the power storage unit having the highest voltage, and switch the charging current to a second constant current value that is smaller than the first constant current value.

Abstract: There is provided a power storage device including a plurality of modules each including secondary batteries, a charging switch that controls charging to the secondary batteries, a discharging switch that controls discharging of the secondary batteries, and a voltage measuring unit that measures a voltage of the module, and a switch control unit that controls one or both of the charging switch and the discharging switch. The modules are connected in parallel. The switch control unit maintains an on state of the discharging switch for at least one of the modules for a predetermined period, and controls the charging switch of the module in which a maximum module charging current estimated based on the voltage of the module is a predetermined value or less, to be in an on state.