Abstract: An automatic circuit element mounting apparatus includes a lead wire detection mechanism for detecting lead wires of a circuit element held on a mounting head by suction and a substrate mark detection mechanism for detecting a mounting reference mark of a printed circuit board on which the circuit element is mounted by means of the mounting head, so that the amount of movement of the mounting head may be corrected depending on a result of detection by each of the detection mechanisms to precisely mount the circuit element on the printed circuit board. Also, a method for mounting a circuit element on a printed circuit board is disclosed.

Abstract: Apparatus for mounting chip type circuit elements on printed circuit boards in one-by-one fashion with increased speed and precision includes a supply unit adapted to supply chip type circuit elements, a plurality of pallets conveyed in an intermittent fashion, a first shifting member adapted to shift the chip type circuit elements from the supply unit onto the pallet, an X-Y table adapted to support a printed circuit board, a mounting mechanism having mounting heads associated therewith for mounting the chip type circuit elements on the printed circuit board supported by the X-Y table and a second shifting member adapted to shift the chip type circuit elements from the pallet to the mounting heads where they are received and positively gripped for subsequent mounting onto the printed circuit board.

Abstract: Apparatus for mounting chip type circuit elements on a printed circuit board include a supply unit for supplying chip type circuit elements, a plurality of pallets adapted to be conveyed intermittently in a longitudinal direction, a sequence head adapted to shift the circuit elements onto the pallets, an X-Y table adapted to receive and support a printed circuit board, a mounting mechanism having mounting heads adapted to mount the chip type circuit elements on the printed circuit board carried by the X-Y table, and a shifting head for shifting the chip type circuit elements from the pallets to the mounting head of the mounting mechanism. The mounting mechanism constitutes a rotatably indexing disc on which a plurality of mounting heads are radially situated, the sequence heads, shifting head and mounting heads each utilizing suction pins to which the chip type circuit elements are fixed during their movement from the supply unit to the printed circuit board.

Abstract: Apparatus for mounting chip type circuit elements on a printed circuit board include a supply unit for supplying chip type circuit elements, a plurality of pallets adapted to be connected intermittently in a longitudinal direction, a sequence head adapted to shift the circuit elements onto the pallets, an X-Y table adapted to receive and support a printed circuit board, a mounting mechanism having mounting heads adapted to mount the chip type circuit elements on the printed circuit board carried by the X-Y table, and a shifting head for shifting the chip type circuit elements from the pallets to the mounting head of the mounting mechanism. The mounting mechanism constitutes a rotatably indexing disc on which a plurality of mounting heads are radially situated, the sequence heads, shifting head and mounting heads each utilizing suction pins to which the chip type circuit elements are fixed during their movement from the supply unit to the printed circuit board.

Abstract: Magazine for storing and supplying chip type circuit elements includes a tube having a bore formed therethrough in which the circuit elements are situated in stacked relationship for feeding toward an open supply end and wherein an elastic member is provided on the tube in the region of the supply end having a surface facing inwardly into the bore and wherein a keeper pawl extends inwardly from the free end of the elastic member into the bore at the supply end region, preferably slightly below the supply end, adapted to hold the leading circuit element under pressure prior to the same being supplied in one-by-one fashion and to prevent simultaneous supply of more than one circuit element from the supply end of the magazine and, additionally, to precisely locate each circuit element at the supply end. In one embodiment, longitudinally extending ribs protruding inwardly into the bore are formed on the bore defining surface of the tube which maintain the chip elements in precise mutual alignment.

Abstract: A method whereby chip type circuit elements are mounted at predetermined locations on a printed circuit board by a suction means and apparatus for performing the method are disclosed. The suction means picks up each circuit element from a respective stack supported in a vertical magazine and transfers and positions them above the predetermined locations on the printed circuit board which can have a predetermined pattern of laminar conductors on the upper surface thereof. The circuit elements are then released by termination of the applied suction and adhered to the board by a thermoplastic adhesive setting operation.