Abstract: Provided is a photosensitive dielectric paste capable of being burned at a low temperature in a short time and forming a dielectric film (insulator film) having favorable properties, such as sintering properties or temperature characteristics of dielectric constant, and an electronic part having favorable properties having a dielectric film formed using the same. The photosensitive dielectric paste of the invention contains (a) an inorganic ingredient containing 10 to 30% by volume of dielectric powder containing a Ba—Nd—Ti complex oxide powder, 50 to 80% by volume of supporting glass powder, and 1 to 20% by volume of sintering aid glass powder containing Bi in a proportion of 50 to 90% by weight in terms of Bi2O3; and (b) a photosensitive organic ingredient, in which the Ba—Nd—Ti complex oxide powder reacts with the sintering aid glass powder upon burning to thereby produce a Bi—Nd—Ti complex oxide.

Abstract: Provided is a photosensitive dielectric paste capable of being burned at a low temperature in a short time and forming a dielectric film (insulator film) having favorable properties, such as sintering properties or temperature characteristics of dielectric constant, and an electronic part having favorable properties having a dielectric film formed using the same. The photosensitive dielectric paste of the invention contains (a) an inorganic ingredient containing 10 to 30% by volume of dielectric powder containing a Ba—Nd—Ti complex oxide powder, 50 to 80% by volume of supporting glass powder, and 1 to 20% by volume of sintering aid glass powder containing Bi in a proportion of 50 to 90% by weight in terms of Bi2O3; and (b) a photosensitive organic ingredient, in which the Ba—Nd—Ti complex oxide powder reacts with the sintering aid glass powder upon burning to thereby produce a Bi—Nd—Ti complex oxide.

Abstract: A method for forming a thick film pattern is provided which can easily perform pattern formation even when a photosensitive paste containing a powdered conductor at a high content and having a low optical transmittance is used and which can form a thick film pattern having a rectangular cross-section and superior high-frequency transmission characteristics. In addition, a photosensitive paste used therefor is also provided. The thick film pattern having a predetermined shape can be formed by the steps of determining the photocurable depth d of a photosensitive paste; coating with the photosensitive paste in consideration of the photocurable depth d so as to form a photosensitive paste film having a predetermined thickness t; exposing the photosensitive paste film; and developing the exposed photosensitive paste film.

Abstract: A method for forming a thick film pattern is provided which can easily perform pattern formation even when a photosensitive paste containing a powdered conductor at a high content and having a low optical transmittance is used and which can form a thick film pattern having a rectangular cross-section and superior high-frequency transmission characteristics. In addition, a photosensitive paste used therefor is also provided. The thick film pattern having a predetermined shape can be formed by the steps of determining the photocurable depth d of a photosensitive paste; coating with the photosensitive paste in consideration of the photocurable depth d so as to form a photosensitive paste film having a predetermined thickness t; exposing the photosensitive paste film; and developing the exposed photosensitive paste film.