Patents by Inventor Shuichi Wakaki

Shuichi Wakaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11183448
    Abstract: A wiring circuit board includes a first insulating layer, a terminal, a second insulating layer disposed at one side in a thickness direction of the terminal, and a wire continuous to the terminal in a direction crossing the thickness direction. The first insulating layer has an opening portion passing through the first insulating layer in the thickness direction and having the opening cross-sectional area increasing as being closer to one side in the thickness direction. The terminal has a peripheral end portion and a solid portion. The peripheral end portion contacts with an inner side surface of the first insulating layer. The inner side surface forms the opening portion. The solid portion integrally disposed with the peripheral end portion at the inner side of the peripheral end portion. The peripheral end portion and the solid portion fill the entire opening portion.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: November 23, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hayato Takakura, Shuichi Wakaki, Shusaku Shibata, Yoshihiro Kawamura, Masaki Ito
  • Publication number: 20210298175
    Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.
    Type: Application
    Filed: June 3, 2021
    Publication date: September 23, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Hayato TAKAKURA, Masaki ITO, Yoshihiro KAWAMURA, Shuichi WAKAKI
  • Patent number: 11122676
    Abstract: A flexible wiring circuit board includes a first insulating layer, a wire disposed at one side in a thickness direction of the first insulating layer, a second insulating layer disposed at one side in the thickness direction of the wire, a shield layer disposed at one side in the thickness direction of the second insulating layer, and a third insulating layer disposed at one side in the thickness direction of the shield layer. The shield layer includes an electrically conductive layer and two barrier layers sandwiching the electrically conductive layer therebetween in the thickness direction. The electrically conductive layer is selected from a metal belonging to a group 11, and the fourth period and the fifth period in the periodic table, and the barrier layer is selected from a metal belonging to groups 4 to 10, and the fourth to the sixth periods in the periodic table.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: September 14, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hayato Takakura, Yoshihiro Kawamura, Shuichi Wakaki, Shusaku Shibata
  • Publication number: 20210243900
    Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle ? satisfies 0<?<1 deg.
    Type: Application
    Filed: April 22, 2021
    Publication date: August 5, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Takahiro TAKANO, Hayato TAKAKURA, Yoshihiro KAWAMURA, Shuichi WAKAKI
  • Patent number: 11081437
    Abstract: An imaging element mounting board for mounting an imaging element has a wire region including a first insulating layer, a metal wire disposed at one side in a thickness direction of the first insulating layer, and a second insulating layer disposed at one side in the thickness direction of the metal wire. An equivalent elastic modulus of the wire region is 5 GPa or more and 55 GPa or less.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: August 3, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Yoshihiro Kawamura, Hayato Takakura, Takahiro Takano, Shuichi Wakaki
  • Patent number: 11058002
    Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: July 6, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Hayato Takakura, Masaki Ito, Yoshihiro Kawamura, Shuichi Wakaki
  • Publication number: 20210204398
    Abstract: A wiring circuit board includes an insulating layer, a wire embedded in the insulating layer, and an alignment mark electrically independent from the wire and disposed in the insulating layer so as to allow a one-side surface in a thickness direction of the alignment mark to be exposed from the insulating layer. A peripheral portion of the alignment mark consists of only the insulating layer and has a thickness of 30 ?m or less.
    Type: Application
    Filed: October 12, 2018
    Publication date: July 1, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Takahiro TAKANO, Hiromoto HARUTA, Shuichi WAKAKI
  • Publication number: 20210195070
    Abstract: An imaging element-mounting board includes a board area having a board disposed and a plurality of reinforcement portions disposed around the board area. The plurality of reinforcement portions are independent from each other.
    Type: Application
    Filed: October 2, 2018
    Publication date: June 24, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Hayato TAKAKURA, Yoshihiro KAWAMURA, Masaki ITO, Shuichi WAKAKI
  • Patent number: 11032913
    Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle ? satisfies 0<?<1 deg.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: June 8, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Takahiro Takano, Hayato Takakura, Yoshihiro Kawamura, Shuichi Wakaki
  • Publication number: 20200344888
    Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle ? satisfies 0<?<1 deg.
    Type: Application
    Filed: November 6, 2017
    Publication date: October 29, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Takahiro TAKANO, Hayato TAKAKURA, Yoshihiro KAWAMURA, Shuichi WAKAKI
  • Patent number: 10813221
    Abstract: A mounted board includes a base insulating layer, a conductive pattern, and a cover insulating layer sequentially toward one side in a thickness direction. The entire lower surface of the base insulating layer is exposed downwardly. A total thickness of the base insulating layer and the cover insulating layer is 16 ?m or less. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of 15×10?6/% RH or less.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: October 20, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Hayato Takakura, Yoshihiro Kawamura, Shuichi Wakaki
  • Publication number: 20200329560
    Abstract: A board assembly sheet includes a plurality of mounting boards each for mounting an electronic component. The mounting boards are defined in the board assembly sheet. The mounting board has a total thickness of 60 ?m or less. The board assembly sheet has a through hole passing through the board assembly sheet in a thickness direction. The through hole is formed to be along an end edge of the mounting board or along a phantom line extending along the end edge.
    Type: Application
    Filed: October 2, 2018
    Publication date: October 15, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Hiromoto HARUTA, Shuichi WAKAKI
  • Publication number: 20200288575
    Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.
    Type: Application
    Filed: September 6, 2018
    Publication date: September 10, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Hayato TAKAKURA, Masaki ITO, Yoshihiro KAWAMURA, Shuichi WAKAKI
  • Publication number: 20200154016
    Abstract: A flexible wiring circuit board includes a first insulating layer, a wire disposed at one side in a thickness direction of the first insulating layer, a second insulating layer disposed at one side in the thickness direction of the wire, a shield layer disposed at one side in the thickness direction of the second insulating layer, and a third insulating layer disposed at one side in the thickness direction of the shield layer. The shield layer includes an electrically conductive layer and two barrier layers sandwiching the electrically conductive layer therebetween in the thickness direction. The electrically conductive layer is selected from a metal belonging to a group 11, and the fourth period and the fifth period in the periodic table, and the barrier layer is selected from a metal belonging to groups 4 to 10, and the fourth to the sixth periods in the periodic table.
    Type: Application
    Filed: April 25, 2018
    Publication date: May 14, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hayato TAKAKURA, Yoshihiro KAWAMURA, Shuichi WAKAKI, Shusaku SHIBATA
  • Publication number: 20200105656
    Abstract: An imaging element mounting board for mounting an imaging element has a wire region including a first insulating layer, a metal wire disposed at one side in a thickness direction of the first insulating layer, and a second insulating layer disposed at one side in the thickness direction of the metal wire. An equivalent elastic modulus of the wire region is 5 GPa or more and 55 GPa or less.
    Type: Application
    Filed: April 4, 2018
    Publication date: April 2, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Yoshihiro KAWAMURA, Hayato TAKAKURA, Takahiro TAKANO, Shuichi WAKAKI
  • Publication number: 20200077520
    Abstract: A mounted board includes a base insulating layer, a conductive pattern, and a cover insulating layer sequentially toward one side in a thickness direction. The entire lower surface of the base insulating layer is exposed downwardly. A total thickness of the base insulating layer and the cover insulating layer is 16 ?m or less. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of 15×10?6/% RH or less.
    Type: Application
    Filed: April 25, 2018
    Publication date: March 5, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Hayato TAKAKURA, Yoshihiro KAWAMURA, Shuichi WAKAKI
  • Publication number: 20200075474
    Abstract: A wiring circuit board includes a first insulating layer, a terminal, a second insulating layer disposed at one side in a thickness direction of the terminal, and a wire continuous to the terminal in a direction crossing the thickness direction. The first insulating layer has an opening portion passing through the first insulating layer in the thickness direction and having the opening cross-sectional area increasing as being closer to one side in the thickness direction. The terminal has a peripheral end portion and a solid portion. The peripheral end portion contacts with an inner side surface of the first insulating layer. The inner side surface forms the opening portion. The solid portion integrally disposed with the peripheral end portion at the inner side of the peripheral end portion. The peripheral end portion and the solid portion fill the entire opening portion.
    Type: Application
    Filed: April 23, 2018
    Publication date: March 5, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hayato TAKAKURA, Shuichi WAKAKI, Shusaku SHIBATA, Yoshihiro KAWAMURA, Masaki ITO
  • Patent number: 8173909
    Abstract: Inspection windows are cut or formed into the tail section of the flexure circuit tail in a hard disk drive Head Gimbal Assembly (HGA), or CIS, to enable visual inspection of the alignment of the CIS to the head preamp circuit, or FPC. The holes are made in the steel backing and base polyimide, and are positioned between adjacent conductive pads. In addition to facilitating visual inspection, the windows also enable rework of solder. Additionally, solder wicking holes may also be provided in the conductive pads and/or the polyimide and steel backing.
    Type: Grant
    Filed: October 19, 2007
    Date of Patent: May 8, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Alex Enriquez Cayaban, Vladimir Aleksic, Shuichi Wakaki
  • Patent number: 7466519
    Abstract: A wired circuit board is provided for controlling characteristic impedance at connection points between the read wire and write wire of a suspension board with circuit and terminal portions of the wired circuit board connected thereto. The invention provides improved signal transmission efficiency for fine pitch wiring or for high frequency signal. A conductive board is adhesively bonded to an insulating base layer of the wired circuit board at one side thereof opposite to the other side on which a suspension-board-side connection terminal portion is formed having a first terminal portion that connects with a read wire of the suspension board and a second terminal portion that connects with a write wire of the suspension board. An opening is provided adjacent to one of the first terminal portion and the second terminal portion and a stiffener board is adhesively bonded to the conductive board via an adhesive layer.
    Type: Grant
    Filed: June 3, 2004
    Date of Patent: December 16, 2008
    Assignee: Nitto Denko Corporation
    Inventors: Shuichi Wakaki, Tadao Ohkawa, Yasuhito Ohwaki
  • Publication number: 20080099236
    Abstract: Inspection windows are cut or formed into the tail section of the flexure circuit tail in a hard disk drive Head Gimbal Assembly (HGA), or CIS, to enable visual inspection of the alignment of the CIS to the head preamp circuit, or FPC. The holes are made in the steel backing and base polyimide, and are positioned between adjacent conductive pads. In addition to facilitating visual inspection, the windows also enable rework of solder. Additionally, solder wicking holes may also be provided in the conductive pads and/or the polyimide and steel backing.
    Type: Application
    Filed: October 19, 2007
    Publication date: May 1, 2008
    Inventors: Alex Enriquez Cayaban, Vladimir Aleksic, Shuichi Wakaki