Abstract: A laminated coil component includes: an element body having a first surface and a second surface facing each other in a first direction; a coil unit formed by laminating a plurality of coil conductors in a second direction orthogonal to the first direction inside the element body; a first lead-out conductor; and a second lead-out conductor. A first coil conductor adjacent to the first lead-out conductor in the second direction includes a first side portion extending along the first surface, on a first surface side. A second coil conductor adjacent to the second lead-out conductor in the second direction includes a second side portion extending along the second surface, on a second surface side. The first side portion has a larger line width than other side portions of the first coil conductor and the second side portion.

Abstract: A method of manufacturing a heating device includes preparing a substrate having a curved surface; and forming a heating body on the substrate, the heating body generating heat with a supply of electric current. The forming of the heating body includes pressing a screen toward the substrate with an aid of a pressing member while rotating the substrate and moving the screen, and transferring application liquid that is to form the heating body to the substrate through the screen. In the forming of the heating body, the pressing member is in contact with the screen at a position on an upstream side with respect to a transfer position in a direction of movement of the screen.

Abstract: A method of manufacturing a heating device includes preparing a substrate having a curved surface; and forming a heating body on the substrate, the heating body generating heat with a supply of electric current. The forming of the heating body includes pressing a screen toward the substrate with an aid of a pressing member while rotating the substrate and moving the screen, and transferring application liquid that is to form the heating body to the substrate through the screen. In the forming of the heating body, the pressing member is in contact with the screen at a position on an upstream side with respect to a transfer position in a direction of movement of the screen.

Abstract: A semiconductor piece manufacturing method includes: a process of forming a groove on a front surface side including a first groove portion having a first width from a front surface of a substrate and a second groove portion that is positioned in a lower part that communicates with the first groove portion and has a second width larger than the first width; and a process of forming a groove on a rear surface side having a width greater than the first width along the second groove portion from a rear surface of the substrate by a rotating cutting member.

Abstract: A fixing device includes a heating member that includes a substrate having a substantially flat portion and a recess in a surface on one side, a heating body provided on the substantially flat portion of the substrate and that generates heat with a supply of electric current, a resistive element provided in the recess of the substrate and that is connected in series to the heating body, the resistive element having a positive temperature coefficient, and a protective layer provided over the heating body and the resistive element and that protects the heating body and the resistive element; a belt member that is heated by being in contact with the surface, on the one side, of the substrate of the heating member, the belt member being rotatable; and a pressing member that is pressed against the belt member and forms a nip part.

Abstract: A semiconductor piece manufacturing method includes: a process of forming a fine groove on a front surface side including a first groove portion having a width that is gradually narrowed from a front surface of a semiconductor substrate W toward a rear surface thereof; a process of attaching a dicing tape having an adhesive layer on the front surface after the fine groove on the front surface side is formed; a process of forming a groove on a rear surface side having a width greater than the width of the fine groove on the front surface side along the fine groove on the front surface side from a rear surface side of the substrate by a rotating dicing blade; and a process of separating the dicing tape from the front surface after the groove on the rear surface side is formed.

Abstract: A fabrication method of a semiconductor piece includes forming a groove that has a first groove portion, and a second groove portion which is a groove portion formed to communicate with a lower part of the first groove portion and extends toward a lower part at a steeper angle than an angle of the first groove portion, has a shape without an angle portion between the first groove portion and the second groove portion, is positioned on the front side, and is formed by dry etching; affixing a retention member including an adhesive layer to the surface in which the groove on the front side is formed; thinning the substrate from the back side of the substrate in a state in which the retention member is affixed; and removing the retention member from the surface after the thinning.

Abstract: A design method includes a process of preparing plural cutting members having different degrees of taper in a tip portion thereof, a process of preparing plural grooves on a front surface side having the same shape, a process of confirming a breakage status when a groove on a rear surface side is formed by the plural cutting members, and a process of selecting, when it is confirmed that both of a cutting member that causes breakage and a cutting member that does not cause the breakage are included, the degree of taper of the cutting member that does not cause the breakage as a tip shape of a cutting member to be used in a mass production process.

Abstract: A semiconductor piece manufacturing method includes: a process of forming a fine groove on a front surface side including a first groove portion having a width that is gradually narrowed from a front surface of a semiconductor substrate W toward a rear surface thereof; a process of attaching a dicing tape having an adhesive layer on the front surface after the fine groove on the front surface side is formed; a process of forming a groove on a rear surface side having a width greater than the width of the fine groove on the front surface side along the fine groove on the front surface side from a rear surface side of the substrate by a rotating dicing blade; and a process of separating the dicing tape from the front surface after the groove on the rear surface side is formed.

Abstract: A semiconductor piece manufacturing method includes: a process of forming a fine groove on a front surface side including a first groove portion having a width that is gradually narrowed from a front surface of a semiconductor substrate W toward a rear surface thereof; a process of attaching a dicing tape having an adhesive layer on the front surface after the fine groove on the front surface side is formed; a process of forming a groove on a rear surface side having a width greater than the width of the fine groove on the front surface side along the fine groove on the front surface side from a rear surface side of the substrate by a rotating dicing blade; and a process of separating the dicing tape from the front surface after the groove on the rear surface side is formed.

Abstract: A fabrication method of a semiconductor piece includes forming a groove that has a first groove portion, and a second groove portion which is a groove portion formed to communicate with a lower part of the first groove portion and extends toward a lower part at a steeper angle than an angle of the first groove portion, has a shape without an angle portion between the first groove portion and the second groove portion, is positioned on the front side, and is formed by dry etching; affixing a retention member including an adhesive layer to the surface in which the groove on the front side is formed; thinning the substrate from the back side of the substrate in a state in which the retention member is affixed; and removing the retention member from the surface after the thinning.

Abstract: A semiconductor piece manufacturing method includes: a process of forming a groove on a front surface side including a first groove portion having a first width from a front surface of a substrate and a second groove portion that is positioned in a lower part that communicates with the first groove portion and has a second width larger than the first width; and a process of forming a groove on a rear surface side having a width greater than the first width along the second groove portion from a rear surface of the substrate by a rotating cutting member.

Abstract: A design method includes a process of preparing plural cutting members having different degrees of taper in a tip portion thereof, a process of preparing plural grooves on a front surface side having the same shape, a process of confirming a breakage status when a groove on a rear surface side is formed by the plural cutting members, and a process of selecting, when it is confirmed that both of a cutting member that causes breakage and a cutting member that does not cause the breakage are included, the degree of taper of the cutting member that does not cause the breakage as a tip shape of a cutting member to be used in a mass production process.

Abstract: A semiconductor piece manufacturing method includes: a process of forming a fine groove on a front surface side including a first groove portion having a width that is gradually narrowed from a front surface of a semiconductor substrate W toward a rear surface thereof; a process of attaching a dicing tape having an adhesive layer on the front surface after the fine groove on the front surface side is formed; a process of forming a groove on a rear surface side having a width greater than the width of the fine groove on the front surface side along the fine groove on the front surface side from a rear surface side of the substrate by a rotating dicing blade; and a process of separating the dicing tape from the front surface after the groove on the rear surface side is formed.

Abstract: Provided is an exhaust-treatment device for a diesel engine, said device being capable of suppressing engine noise. In a first stage P1 of an exhaust-temperature-raising process, a target engine speed is set to a prescribed first target speed R1 and an intake throttle valve 41 is set to a prescribed first degree of opening O1. In a second stage P2, the target engine speed is maintained at the first target speed R1 and the intake throttle valve 41 is set to a position more closed than the first degree of opening O1. When a set duration T2 for the second stage P2 has come to an end, the intake throttle valve 41 is at a second degree of opening O2, which is maintained in third and subsequent stages P3/P4. In said third and subsequent stages P3/P4, as a set duration T3/T4 for each stage P3/P4 passes, the target engine speed is updated to a target speed R2/R3 higher than the target speed R1/R2 during the immediately prior stage P2/P3, and the temperature of DPF1 upstream exhaust gas 12 is increased.

Abstract: An optical measurement apparatus using an optical fiber to measure the characteristic of an object to be measured arranged along the circumference of a circle includes a first pulley, a second pulley which is turnable on its own axis at a second angular velocity while revolving about the first pulley at a first angular velocity, and the optical fiber which is held by the second pulley and projects detection light on the object to be measured and receives reflected light from the object to be measured. The first angular velocity and the second angular velocity are the same in magnitude and opposite in the direction. Occurrence of a twist in the optical fiber is suppressed, and therefore, the optical measurement apparatus is capable of measuring the characteristics of the object to be measured with high accuracy.

Abstract: The present invention has an object to provide an exhaust-gas processing device for a diesel engine, able to inhibit the deterioration of the fuel-consumption and the output reduction. In order to accomplish the above object, the device is provided with a DPF, a means for presuming the amount of PM to be deposited on the DPF, a DPF-regeneration means, a DPF-regeneration control means, a storing means, a means for sending message to demand an accelerated regeneration, and an operation means for starting the accelerated regeneration. While a normal regeneration processing is being continued (S6) since it has started (S2), the time when a term (T1) for reserving judgment as to the demand for accelerated regeneration has elapsed is taken as the judging time (T3). At this judging time (T3), if the assumed value of the PM deposed amount exceeds a value (J2) for judgment as to the demand for accelerated regeneration, the accelerated regeneration is deemed to be demanded.

Abstract: According to an aspect of the invention, a light-emitting element includes a semiconductor layer, a gold electrode layer, an insulator, a barrier metal layer, and an aluminum wiring layer. The gold electrode layer is formed on a part of the semiconductor layer and is electrically connected to the semiconductor layer. The gold electrode layer being made of metal including gold. The insulator film covers the semiconductor layer and has a contact opening corresponding to the gold electrode layer. The barrier metal layer covers a an upper face of the gold electrode layer and the insulator film in a vicinity of the contact opening. The aluminum wiring layer is formed on the barrier metal layer and electrically connected to the barrier metal layer.

Abstract: Provided is an exhaust-treatment device for a diesel engine, said device being capable of suppressing engine noise. In a first stage P1 of an exhaust-temperature-raising process, a target engine speed is set to a prescribed first target speed R1 and an intake throttle valve 41 is set to a prescribed first degree of opening O1. In a second stage P2, the target engine speed is maintained at the first target speed R1 and the intake throttle valve 41 is set to a position more closed than the first degree of opening O1. When a set duration T2 for the second stage P2 has come to an end, the intake throttle valve 41 is at a second degree of opening O2, which is maintained in third and subsequent stages P3/P4. In said third and subsequent stages P3/P4, as a set duration T3/T4 for each stage P3/P4 passes, the target engine speed is updated to a target speed R2/R3 higher than the target speed R1/R2 during the immediately prior stage P2/P3, and the temperature of DPF1 upstream exhaust gas 12 is increased.

Abstract: An optical measurement apparatus using an optical fiber to measure the characteristic of an object to be measured arranged along the circumference of a circle includes a first pulley, a second pulley which is turnable on its own axis at a second angular velocity while revolving about the first pulley at a first angular velocity, and the optical fiber which is held by the second pulley and projects detection light on the object to be measured and receives reflected light from the object to be measured. The first angular velocity and the second angular velocity are the same in magnitude and opposite in the direction. Occurrence of a twist in the optical fiber is suppressed, and therefore, the optical measurement apparatus is capable of measuring the characteristics of the object to be measured with high accuracy.