Abstract: A ceramic heater includes a ceramic plate having a surface that serves as a wafer placement surface, resistance heating elements that are embedded in the ceramic plate, a tubular shaft that supports the ceramic plate from a rear surface of the ceramic plate, a recess that is formed in a within-shaft region of the rear surface of the ceramic plate, the within-shaft region being surrounded by the tubular shaft, and terminals that are disposed to be exposed at a side surface of the recess and that supply electric power to the resistance heating element.

Abstract: A ceramic heater includes a ceramic plate having a wafer placement surface, a tubular shaft having one end that is bonded to a rear surface of the ceramic plate on an opposite side to the wafer placement surface, a within-shaft region of the rear surface of the ceramic plate, an elongate hole extending from a start point in an outer peripheral portion of the within-shaft region to a terminal end position in the outer peripheral portion of the ceramic plate, and a thermocouple guide that guides a tip end of an outer-peripheral-side thermocouple to come into the start point of the elongate hole. A portion of the thermocouple guide, the portion extending from the other end (lower end) of the tubular shaft to the start point of the elongate hole, is formed in a shape following an inner wall of the tubular shaft.

Abstract: A wafer placement table includes: a ceramic member having a wafer placement surface; a mesh electrode buried in the ceramic member; a conductive connection member in contact with the mesh electrode and exposed to outside from a surface of the ceramic member on the opposite side of the wafer placement surface; and an external current-carrying member joined to a surface of the connection member exposed to outside. The mesh electrode has a mesh opening in a region that faces the connection member, and the mesh opening is filled with a sintered conductor being a sintered body of a mixture containing a conductive powder and a ceramic raw material.

Abstract: A ceramic heater includes a ceramic substrate including, on an upper surface, a wafer mount surface that receives a wafer, and a heater electrode embedded in an inside of the ceramic substrate. The ceramic substrate includes a core portion and a surface layer portion disposed on a surface of the core portion. The surface layer portion has volume resistivity higher than volume resistivity of the core portion. The core portion has thermal conductivity higher than thermal conductivity of the surface layer portion. The surface layer portion is disposed over an area of at least one of a side surface of the core portion and an upper surface of the core portion, the area being not covered with the wafer.

Abstract: A ceramic heater includes: a ceramic plate which is provided with a wafer placement surface on an upper surface and in which a heating resistor is internally embedded; a ceramic tubular shaft with an upper end bonded to a lower surface of the plate; and power feeding members which penetrate a peripheral wall part of the tubular shaft in a vertical direction, and are electrically connected to the heating resistor. The power feeding members are embedded in the peripheral wall part of the tubular shaft, and are in tight contact with a ceramic material of the tubular shaft.

Abstract: A ceramic heater includes a ceramic plate having a surface that serves as a wafer placement surface, resistance heating elements that are embedded in the ceramic plate, a tubular shaft that supports the ceramic plate from a rear surface of the ceramic plate, a recess that is formed in a within-shaft region of the rear surface of the ceramic plate, the within-shaft region being surrounded by the tubular shaft, and terminals that are disposed to be exposed at a side surface of the recess and that supply electric power to the resistance heating element.

Abstract: A ceramic heater includes a ceramic plate having a wafer placement surface, a tubular shaft having one end that is bonded to a rear surface of the ceramic plate on an opposite side to the wafer placement surface, a within-shaft region of the rear surface of the ceramic plate, an elongate hole extending from a start point in an outer peripheral portion of the within-shaft region to a terminal end position in the outer peripheral portion of the ceramic plate, and a thermocouple guide that guides a tip end of an outer-peripheral-side thermocouple to come into the start point of the elongate hole. A portion of the thermocouple guide, the portion extending from the other end (lower end) of the tubular shaft to the start point of the elongate hole, is formed in a shape following an inner wall of the tubular shaft.

Abstract: A ceramic heater includes a ceramic plate having a surface that serves as a wafer placement surface, resistance heating elements and that are embedded in the ceramic plate, a tubular shaft that supports the ceramic plate from a rear surface of the ceramic plate, a recess that is formed in a within-shaft region of the rear surface of the ceramic plate, the within-shaft region being surrounded by the tubular shaft, and that has a size equal to a size of the within-shaft region, an elongate hole that extends from an opening formed in a side surface of the recess up to a predetermined terminal end position in an outer peripheral portion of the ceramic plate, and associated parts (such as terminals) that are disposed in the within-shaft region of the rear surface of the ceramic plate.

Abstract: A ceramic heater includes a ceramic plate having a front surface that serves as a wafer placement surface, resistance heating elements that are embedded in the ceramic plate, a tubular shaft that supports the ceramic plate from a rear surface of the ceramic plate, and a thermocouple passage that extends from a start point in a within-shaft region of the rear surface of the ceramic plate, the within-shaft region being surrounded by the tubular shaft, to a terminal end position in an outer peripheral portion of the ceramic plate. The thermocouple passage includes a curved portion between the start point and the terminal end position.

Abstract: A ceramic heater includes a ceramic plate, a main resistance heating element, and sub resistance heating elements. The main resistance heating element is a heating element that is disposed on a first plane parallel with a wafer placement surface in the ceramic plate and that has a coil shape. The sub resistance heating elements are heating elements that are disposed on a second plane parallel with the first plane in the ceramic plate between the first plane and the wafer placement surface, that complement heating with the main resistance heating element, and that have a two-dimensional shape.

Abstract: A ceramic heater includes a ceramic plate. The ceramic plate has a wafer placement surface and has an inner-peripheral-side zone that has a circular shape and an outer-peripheral-side zone that has an annular shape. An inner-peripheral-side resistance heating element that has a two-dimensional shape is disposed in the inner-peripheral-side zone. An outer-peripheral-side is resistance heating element that has a coil shape is disposed in the outer-peripheral-side zone. A terminal of inner-peripheral-side resistance heating element and a terminal of the outer-peripheral-side resistance heating element are disposed in the inner-peripheral-side.

Abstract: A ceramic heater includes a ceramic plate, a main resistance heating element, and a sub resistance heating element. The main resistance heating element is a coil that is disposed in the ceramic plate, that is wired from one of a pair of main terminals in a one-stroke pattern, and that reaches the other of the pair of the main terminals. The sub resistance heating element is a heating element that is disposed in the ceramic plate, that complements heating with the main resistance heating element, and that has a two-dimensional shape.

Abstract: A ceramic heater includes a ceramic plate. The ceramic plate has a wafer placement surface, and is divided into an inner-peripheral zone having a circular shape and an outer-peripheral zone having an annular shape. An inner-peripheral resistance heating element that is composed of high-melting-point metal is disposed in the inner-peripheral zone. An outer-peripheral resistance heating element that has at least a surface composed of metal carbide is disposed in the outer-peripheral zone.

Abstract: A wafer placement table includes: a ceramic member having a wafer placement surface; a mesh electrode buried in the ceramic member; a conductive connection member in contact with the mesh electrode and exposed to outside from a surface of the ceramic member on the opposite side of the wafer placement surface; and an external current-carrying member joined to a surface of the connection member exposed to outside. The mesh electrode has a mesh opening in a region that faces the connection member, and the mesh opening is filled with a sintered conductor being a sintered body of a mixture containing a conductive powder and a ceramic raw material.

Abstract: A ceramic heater includes a ceramic substrate including, on an upper surface, a wafer mount surface that receives a wafer, and a heater electrode embedded in an inside of the ceramic substrate. The ceramic substrate includes a core portion and a surface layer portion disposed on a surface of the core portion. The surface layer portion has volume resistivity higher than volume resistivity of the core portion. The core portion has thermal conductivity higher than thermal conductivity of the surface layer portion. The surface layer portion is disposed over an area of at least one of a side surface of the core portion and an upper surface of the core portion, the area being not covered with the wafer.

Abstract: A superconducting fault current limiter composed of an induction coil wound around a core made of a soft magnetic material such as soft iron, ferrite or the like, a cylindrical superconductive body arranged in surrounding relationship with the induction coil and a cooling container formed to contain only the superconductive body therein and filled with cooling liquid such as liquid nitrogen or helium to immerse therein the superconductive body.