Patents by Inventor Shuichl Okabe

Shuichl Okabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer circuit board and method of manufacturing the same
    Patent number: 7605075
    Abstract: A multilayer circuit board is provided that includes at least two insulating layers each sandwiched by circuit layers, thus having at least one internal circuit layer sandwiched by the at least two insulating layers. Via holes are formed in one or more of the insulating layers at the same pitch as bump electrodes of an integrated circuit chip, which permit insertion of the bump electrodes of an integrated circuit chip into the via holes of the multilayer circuit board. Metal films formed within the via holes are electrically connected to at least one of the circuit layers. An internal capacitor may be formed in a predetermined area of an insulating layer and predetermined areas of circuit layers which sandwich the predetermined area of the insulating layer and are opposed to each other. An internal resistor may be formed in an inner circuit layer.
    Type: Grant
    Filed: December 6, 2005
    Date of Patent: October 20, 2009
    Assignee: International Business Machines Corporation
    Inventors: Shuichl Okabe, Yasumitsu Orii, Mitsuya M. Ishida
  • MULTILAYER CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20060226537
    Abstract: A multilayer circuit board is provided that includes at least two insulating layers each sandwiched by circuit layers, thus having at least one internal circuit layer sandwiched by the at least two insulating layers. Via holes are formed in one or more of the insulating layers at the same pitch as bump electrodes of an integrated circuit chip, which permit insertion of the bump electrodes of an integrated circuit chip into the via holes of the multilayer circuit board. Metal films formed within the via holes are electrically connected to at least one of the circuit layers. An internal capacitor may be formed in a predetermined area of an insulating layer and predetermined areas of circuit layers which sandwich the predetermined area of the insulating layer and are opposed to each other. An internal resistor may be formed in an inner circuit layer.
    Type: Application
    Filed: December 6, 2005
    Publication date: October 12, 2006
    Applicant: International Business Machines Corporation
    Inventors: Shuichl Okabe, Yasumitsu Orii, Mitsuya Ishida