Abstract: A semiconductor device includes a base member and a semiconductor chip. The base member includes a first surface, a second surface opposite to the first surface, and a protrusion at the second surface side. The semiconductor chip being mounted on the second surface of the base member. The semiconductor chip includes first and second electrodes, a control pad, and a semiconductor part. The first electrode is provided on a back surface of the semiconductor part. The second electrode and the control pad are provided on a front surface of the semiconductor part. The semiconductor chip includes a space between the second electrode and the control pad at the front surface side of the semiconductor part. The semiconductor chip is mounted so that the space between the second electrode and the control pad overlaps the protrusion of the base member.