Patents by Inventor Shuji Hirano

Shuji Hirano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180267404
    Abstract: Provided are a pattern forming method for obtaining a pattern which is excellent in etching resistance and in which occurrence of pattern collapse can be suppressed, and a method for manufacturing an electronic device including the pattern forming method. The pattern forming method includes a step of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition that contains a resin A having a repeating unit represented by General Formula (I) and a repeating unit represented by General Formula (BII), a step of exposing the film, and a step of developing the exposed film using a developer containing an organic solvent, to form a pattern.
    Type: Application
    Filed: May 23, 2018
    Publication date: September 20, 2018
    Applicant: FUJIFILM Corporation
    Inventors: Akihiro KANEKO, Tomotaka TSUCHIMURA, Shuji HIRANO, Hideaki TSUBAKI, Wataru NIHASHI
  • Publication number: 20180217499
    Abstract: An object of the present invention is to provide a treatment liquid for patterning a resist film and a pattern forming method, each of which can simultaneously suppress the occurrence of pattern collapse in a resist L/S pattern and the occurrence of omission failure in a resist C/H pattern. The treatment liquid of the present invention is a treatment liquid for patterning a resist film, which is used for subjecting a resist film obtained from an actinic ray-sensitive or radiation-sensitive resin composition to at least one of development or washing, and contains an organic solvent, in which the treatment liquid contains a first organic solvent having a relative dielectric constant of 4.0 or less and a second organic solvent having a relative dielectric constant of 6.0 or more.
    Type: Application
    Filed: March 28, 2018
    Publication date: August 2, 2018
    Applicant: FUJIFILM Corporation
    Inventors: Shuji HIRANO, Hideaki TSUBAKI, Toru TSUCHIHASHI, Wataru NIHASHI, Kei YAMAMOTO
  • Publication number: 20180210339
    Abstract: Provided are a resist composition capable of forming a pattern having excellent pattern collapse performance, particularly in the formation of an ultrafine pattern (for example, a pattern with a line width 50 nm or less) using the resist composition containing a resin (A) having a repeating unit (a) having an aromatic ring group and a repeating unit (b) having a silicon atom in a side chain, as well as a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the resist composition.
    Type: Application
    Filed: March 20, 2018
    Publication date: July 26, 2018
    Applicant: FUJIFILM Corporation
    Inventors: Akira Takada, Shuji HIRANO, Naoya SHIMOJU, Toshiya TAKAHASHI, Hidehiro MOCHIZUKI
  • Patent number: 10031419
    Abstract: There is provided a pattern forming method comprising (i) forming a film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition which contains (A) a resin which decomposes due to an action of an acid to change its solubility with respect to a developer and (C) a specific resin, (ii) forming a top coat layer using a top coat composition which contains a resin (T) on the film, (iii) exposing the film which has the top coat layer to actinic rays or radiation, and (iv) forming a pattern by developing the film which has the top coat layer after the exposing.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: July 24, 2018
    Assignee: FUJIFILM Corporation
    Inventors: Hiroo Takizawa, Shuji Hirano
  • Publication number: 20180120701
    Abstract: According to the present invention, an actinic ray-sensitive or radiation-sensitive resin composition including a compound (A) whose dissolution rate in an alkali developer decreases by the action of an acid, a hydrophobic resin (B), and a resin (C) having an aromatic ring, as well as a film, a mask blank, a pattern forming method, and a method for manufacturing an electronic device, each using the composition, are provided.
    Type: Application
    Filed: December 28, 2017
    Publication date: May 3, 2018
    Applicant: FUJIFILM Corporation
    Inventor: Shuji HIRANO
  • Publication number: 20180017865
    Abstract: A pattern forming method including a step of coating a substrate with an actinic ray-sensitive or radiation-sensitive resin composition and forming an actinic ray-sensitive or radiation-sensitive film; a step of simultaneously irradiating the actinic ray-sensitive or radiation-sensitive film with a plurality of electron beams; and a step of developing the actinic ray-sensitive or radiation-sensitive film after the irradiation with electron beams is provided. The composition contains a resin (A), a photoacid generator (B), and an acid diffusion control agent (C) and a molar ratio (Qp) between the photoacid generator (B) and the acid diffusion control agent (C), which is represented by Equation (1) is 0.3 or greater.
    Type: Application
    Filed: September 28, 2017
    Publication date: January 18, 2018
    Applicant: FUJIFILM Corporation
    Inventors: Hidehiro MOCHIZUKI, Shuji HIRANO, Akira TAKADA
  • Publication number: 20170351176
    Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition including a compound (A) whose dissolution rate in an alkali developer decreases by the action of an acid, a resin (B) having a group that decomposes by the action of an alkali developer to increase the solubility in the alkali developer and having at least one of a fluorine atom or a silicon atom, and a resin (C) having a phenolic hydroxyl group, different from the resin (B), an actinic ray-sensitive or radiation-sensitive film and a mask blank, each formed using the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method using the actinic ray-sensitive or radiation-sensitive resin composition, and a method for manufacturing an electronic device.
    Type: Application
    Filed: August 24, 2017
    Publication date: December 7, 2017
    Applicant: FUJIFILM Corporation
    Inventors: Shuhei YAMAGUCHI, Koutarou TAKAHASHI, Toshiaki FUKUHARA, Shuji HIRANO
  • Patent number: 9766547
    Abstract: There is provided a pattern forming method, including: (1) forming a film using an actinic ray-sensitive or radiation-sensitive resin composition, (2) exposing the film with actinic ray or radiation, (3) developing the film exposed by using a developer containing an organic solvent, wherein the actinic ray-sensitive or radiation-sensitive resin composition contains (A) a resin having a repeating unit (R) with a structural moiety capable of decomposing upon irradiation with an actinic ray or radiation to generate an acid, and (B) a solvent, and the developer contains an additive that causes at least one interaction selected from the group consisting of an ionic bond, a hydrogen bond, a chemical bond and a dipole interaction with respect to a polar group contained in the resin (A) after the exposing.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: September 19, 2017
    Assignee: FUJIFILM Corporation
    Inventors: Hiroo Takizawa, Shuji Hirano, Natsumi Yokokawa
  • Patent number: 9760003
    Abstract: Provided is a method of forming a pattern and an actinic-ray- or radiation-sensitive resin composition that excels in the limiting resolving power, roughness characteristics, exposure latitude (EL) and bridge defect performance. The method of forming a pattern includes (1) forming an actinic-ray- or radiation-sensitive resin composition into a film, (2) exposing the film to light, and (3) developing the exposed film with a developer containing an organic solvent. The actinic-ray- or radiation-sensitive resin composition contains (A) a resin containing a repeating unit with a structural moiety that is configured to decompose when exposed to actinic rays or radiation to thereby generate an acid, and (B) a solvent.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: September 12, 2017
    Assignee: FUJIFILM Corporation
    Inventors: Kaoru Iwato, Hidenori Takahashi, Shuji Hirano, Sou Kamimura, Keita Kato
  • Publication number: 20170242338
    Abstract: Provided are an active-light-sensitive or radiation-sensitive resin composition in which the sensitivity is excellent, and an active-light-sensitive or radiation-sensitive film, a pattern forming method, and a method for manufacturing an electronic device, each using the active-light-sensitive or radiation-sensitive resin composition. The active-light-sensitive or radiation-sensitive resin composition contains a resin (Ab) whose polarity is changed by the action of an acid, and a compound that generates an acid upon irradiation with active light or radiation, in which the resin (Ab) includes a metal ion, and the metal type of the metal ion is at least one of metal types belonging to Groups 1 to 10 and 13 to 16 (here, excluding Mg and Cs).
    Type: Application
    Filed: March 1, 2017
    Publication date: August 24, 2017
    Applicant: FUJIFILM Corporation
    Inventor: Shuji HIRANO
  • Publication number: 20170176858
    Abstract: Provided are a pattern forming method in which the resolving power of an isolated space pattern formed is excellent, and a method for manufacturing an electronic device, a resist composition, and a resist film, each using the pattern forming method. The pattern forming method is a pattern forming method including at least a step of forming a resist film using a resist composition, a step of exposing the resist film, and a step of developing the exposed resist film using a developer including an organic solvent to form a pattern, in which the resist composition contains a resin (Ab) including a metal ion.
    Type: Application
    Filed: March 1, 2017
    Publication date: June 22, 2017
    Applicant: FUJIFILM Corporation
    Inventor: Shuji HIRANO
  • Publication number: 20170174801
    Abstract: Provided are a non-chemical amplification type resist composition in which the resolving power in an isolated line pattern or an isolated space pattern is excellent, and a non-chemical amplification type resist film, a pattern forming method, and a method for manufacturing an electronic device. The non-chemical amplification type resist composition contains a resin (Ab) having a metal salt structure.
    Type: Application
    Filed: March 1, 2017
    Publication date: June 22, 2017
    Applicant: FUJIFILM Corporation
    Inventor: Shuji HIRANO
  • Patent number: 9651863
    Abstract: The pattern forming method includes (1) forming a film using an active light sensitive or radiation sensitive resin composition, (2) exposing the film to active light or radiation, and (3) developing the exposed film using a developer including an organic solvent, in which the active light sensitive or radiation sensitive resin composition contains a resin (A) having a group which generates a polar group by being decomposed due to the action of an acid, the resin (A) has a phenolic hydroxyl group and/or a phenolic hydroxyl group protected with a group leaving due to the action of an acid, and the developer including the organic solvent contains an additive which forms at least one interaction of an ionic bond, a hydrogen bond, a chemical bond, and a dipole interaction, with the polar group.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: May 16, 2017
    Assignee: FUJIFILM Corporation
    Inventors: Hiroo Takizawa, Shuji Hirano, Natsumi Yokokawa, Wataru Nihashi
  • Patent number: 9612535
    Abstract: According to one aspect of the present invention, there is provided a pattern forming method comprising, in this order: (1) forming a film by using an electron beam- or extreme ultraviolet-sensitive resin composition containing, in a specific amount, a resin (Aa) having a specific atom or substituent; (2) exposing the film by using an electron beam or extreme ultraviolet ray; and (3) forming a negative pattern by performing development using a developer including an organic solvent after the exposure.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: April 4, 2017
    Assignee: FUJIFILM Corporation
    Inventors: Shuji Hirano, Hiroo Takizawa
  • Patent number: 9551933
    Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising: (A) a resin containing a repeating unit represented by the first specific formula and a repeating unit represented by the second specific formula, wherein the content of the repeating unit represented by the first specific formula is 35 mol % or more based on all repeating units in the resin (A), a resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: January 24, 2017
    Assignee: FUJIFILM Corporation
    Inventors: Hiroo Takizawa, Shuji Hirano, Natsumi Yokokawa, Wataru Nihashi
  • Patent number: 9527809
    Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition containing a compound represented by the following formula (1) or (2), and the formula (1) and (2) are defined as herein, and a resist film comprising the actinic ray-sensitive or radiation-sensitive resin composition, and a pattern forming method comprising a step of exposing the resist film, and a step of developing the exposed film, and a method for manufacturing an electronic device, comprising the pattern forming method, and an electronic device manufactured by the manufacturing method of an electronic device.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: December 27, 2016
    Assignee: FUJIFILM Corporation
    Inventors: Natsumi Yokokawa, Hiroo Takizawa, Shuji Hirano, Wataru Nihashi, Hideaki Tsubaki
  • Patent number: 9470980
    Abstract: A pattern-forming method includes in this order: step (1) of forming a film with an electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition that contains (A) a resin having an acid-decomposable repeating unit and capable of decreasing a solubility of the resin (A) in a developer containing an organic solvent by an action of an acid, (B) a compound capable of generating an acid upon irradiation with an electron beam or extreme ultraviolet radiation, (C) a resin having one or more groups selected from the specific group as defined in the specification and (D) a solvent; step (2) of exposing the film with an electron beam or extreme ultraviolet radiation; and step (4) of developing the film with a developer containing an organic solvent after the exposing to form a negative pattern.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: October 18, 2016
    Assignee: FUJIFILM Corporation
    Inventors: Naoki Inoue, Hiroo Takizawa, Shuji Hirano, Hideaki Tsubaki
  • Patent number: 9423690
    Abstract: There is provided a pattern forming method, including: (a) forming a film by using an electron beam-sensitive or extreme ultraviolet ray-sensitive resin composition containing a resin (A) having a repeating unit represented by Formula (1-0) and a repeating unit represented by Formula (1-2); (b) exposing the film by using an electron beam or extreme ultraviolet ray; and (c) developing the exposed film by using a developer containing an organic solvent to form a negative pattern, wherein a content of the repeating unit represented by Formula (1-0) is 45 mol % or more based on a whole repeating units in the resin (A).
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: August 23, 2016
    Assignee: FUJIFILM Corporation
    Inventors: Hiroo Takizawa, Shuji Hirano, Natsumi Yokokawa, Wataru Nihashi
  • Publication number: 20160147154
    Abstract: There are provided a pattern formation method, including: (1) forming a film using an active light-sensitive or radiation-sensitive resin composition; (2) exposing the film to active light or radiation; and (3) developing the exposed film using a developer including an organic solvent, wherein the active light-sensitive or radiation-sensitive resin composition contains a resin (A) having specific repeating units, and a crosslinking agent (C).
    Type: Application
    Filed: February 1, 2016
    Publication date: May 26, 2016
    Applicant: FUJIFILM Corporation
    Inventors: Hiroo TAKIZAWA, Toru FUJIMORI, Wataru NIHASHI, Shuji HIRANO, Natsumi YOKOKAWA
  • Publication number: 20160147147
    Abstract: There are provided a pattern forming method which satisfies high sensitivity, high resolving power at the time of isolated line pattern formation, a good pattern shape, and high dry etching resistance at the same time, an actinic ray sensitive or radiation sensitive resin composition and a resist film which are provided thereto, a method for manufacturing an electronic device using these, and an electronic device by using a pattern forming method including step (1) of forming a film using the actinic ray sensitive or radiation sensitive resin composition containing a resin (Ab) having a repeating unit represented by the specific General Formula (Ab1), step (2) of exposing the film, and step (4) of performing development using a developer including an organic solvent after exposing and of forming a negative type pattern, in this order.
    Type: Application
    Filed: January 28, 2016
    Publication date: May 26, 2016
    Applicant: FUJIFILM Corporation
    Inventors: Shuji HIRANO, Hiroo TAKIZAWA