Abstract: An imprinting method carries out imprinting on a workpiece by clamping UV-curable resin between a nano-imprinting mold and a workpiece and curing the UV-curable resin using UV light. In this method, the workpiece is supported on a setting table provided with through-holes that are disposed in a planar region of the setting table on which the workpiece is set and are connected to a gas pumping/evacuating mechanism. The UV-curable resin is supplied onto the workpiece and the setting table is raised to and stopped at a filling operation position where the mold surface of the nano-imprinting mold and the surface of the workpiece are apart. After this, gas is pumped toward the lower surface of the workpiece from the through-holes and the workpiece is pressed onto the nano-imprinting mold from a center of the workpiece toward a periphery of the workpiece while gradually filling the UV-curable resin between the nano-imprinting mold and the workpiece.

Abstract: A forming apparatus for bending the leads of a semiconductor package including a body portion, and a plurality of leads extending from the sides of the body portion to a predetermined configuration. The forming die includes a series of walls arranged in a predetermined pattern having a seat for the body portion of the semiconductor package and a series of stepped outer wall portions. A plurality of a elongated spaced rigid portions on the outer surface of the wall portion define a series of grooves for receiving the leads of the semiconductor package. A punch adapted for reciprocating movement relative to the forming die engages and presses the leads into the grooves so that the leads conform to the outer wall portions of the die.