Patents by Inventor Shuji Kaneda
Shuji Kaneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11894171Abstract: Provided is an Al-containing hexagonal ferrite magnetic powder which produces an excellent durability-improving effect on a magnetic recording medium, wherein uniform pulverization of the magnetic powder can be easily achieved by dispersion treatment in preparation of a magnetic coating material even in cases where the magnetic powder has a small primary particle size or has a composition which is likely to produce hard secondary particles. The magnetic powder for a magnetic recording medium is an Al-containing hexagonal ferrite magnetic powder having an Al/Fe molar ratio of 0.030 to 0.200, and has a particle size distribution in which the volume ratio of particles having a particle size of 30 ?m or more as measured by a laser diffraction particle size distribution analyzer with a dispersion pressure of 100 kPa is 5.0% or less, and an activation volume Vact of 1800 nm3 or less.Type: GrantFiled: November 14, 2019Date of Patent: February 6, 2024Assignees: DOWA ELECTRONICS MATERIALS CO., LTD., FUJIFILM CORPORATIONInventors: Hirohisa Omoto, Shuji Kaneda, Satoshi Shiki, Hiroyuki Suzuki, Toshio Tada
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Patent number: 11404190Abstract: Provided is a hexagonal ferrite magnetic powder for a magnetic recording medium, containing hexagonal ferrite magnetic particles having aluminum hydroxide adhered on the surface thereof, the hexagonal ferrite magnetic powder having an Al/Fe molar ratio of 0.030 to 0.200, a Co/Fe molar ratio of 0.002 to 0.030, and a Nb/Fe molar ratio of 0.005 to 0.050, and having an Fe site valence AFe of 3.015 to 3.040 as calculated by AFe=(3+2×[Co/Fe]+5×[Nb/Fe])/(1+[Co/Fe]+[Nb/Fe]) wherein [Co/Fe] represents the Co/Fe molar ratio and [Nb/Fe] represents the Nb/Fe molar ratio, and preferably having an activation volume Vact of 1400 to 1800 nm3. This magnetic powder simultaneously achieves an increase in magnetic characteristics including SNR of a magnetic recording medium and a further increase in durability thereof.Type: GrantFiled: December 4, 2019Date of Patent: August 2, 2022Assignees: DOWA ELECTRONICS MATERIALS CO., LTD., FUJIFILM CORPORATIONInventors: Hirohisa Omoto, Shuji Kaneda, Hiroyuki Suzuki, Toshio Tada
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Publication number: 20200185135Abstract: Provided is a hexagonal ferrite magnetic powder for a magnetic recording medium, containing hexagonal ferrite magnetic particles having aluminum hydroxide adhered on the surface thereof, the hexagonal ferrite magnetic powder having an Al/Fe molar ratio of 0.030 to 0.200, a Co/Fe molar ratio of 0.002 to 0.030, and a Nb/Fe molar ratio of 0.005 to 0.050, and having an Fe site valence AFe of 3.015 to 3.040 as calculated by AFe=(3+2×[Co/Fe]+5×[Nb/Fe])/(1+[Co/Fe]+[Nb/Fe]) wherein [Co/Fe] represents the Co/Fe molar ratio and [Nb/Fe] represents the Nb/Fe molar ratio, and preferably having an activation volume Vact of 1400 to 1800 nm3. This magnetic powder simultaneously achieves an increase in magnetic characteristics including SNR of a magnetic recording medium and a further increase in durability thereof.Type: ApplicationFiled: December 4, 2019Publication date: June 11, 2020Inventors: Hirohisa OMOTO, Shuji KANEDA, Hiroyuki SUZUKI, Toshio TADA
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Publication number: 20200161035Abstract: Provided is an Al-containing hexagonal ferrite magnetic powder which produces an excellent durability-improving effect on a magnetic recording medium, wherein uniform pulverization of the magnetic powder can be easily achieved by dispersion treatment in preparation of a magnetic coating material even in cases where the magnetic powder has a small primary particle size or has a composition which is likely to produce hard secondary particles. The magnetic powder for a magnetic recording medium is an Al-containing hexagonal ferrite magnetic powder having an Al/Fe molar ratio of 0.030 to 0.200, and has a particle size distribution in which the volume ratio of particles having a particle size of 30 ?m or more as measured by a laser diffraction particle size distribution analyzer with a dispersion pressure of 100 kPa is 5.0% or less, and an activation volume Vact of 1800 nm3 or less.Type: ApplicationFiled: November 14, 2019Publication date: May 21, 2020Inventors: Hirohisa OMOTO, Shuji KANEDA, Satoshi SHIKI, Hiroyuki SUZUKI, Toshio TADA
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Publication number: 20180077798Abstract: To provide a copper electroconductive film formed on a paper substrate, the copper electroconductive film being considerably improved in weather resistance and electroconductivity. The problem can be achieved by an electroconductive film formed by pressing a sintered electroconductive film formed by sintering copper particles in a coating film containing copper powder on a paper substrate along with the substrate, the electroconductive film having an area ratio of copper occupying on a cross section of the electroconductive film in parallel to a thickness direction thereof of 82.0% or more. The electroconductive film can be produced by pressing, for example, by roll press to from 90 to 190° C., after light sintering.Type: ApplicationFiled: December 16, 2015Publication date: March 15, 2018Inventors: Hidefumi FUJITA, Shuji KANEDA, Daisuke ITOH
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Publication number: 20170362455Abstract: After there is prepared a conductive paste which contains fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, such as benzotriazole, coarse copper particles having an average particle diameter of 0.Type: ApplicationFiled: January 6, 2016Publication date: December 21, 2017Applicant: Dowa Electronics Materials Co., Ltd.Inventors: Hidefumi Fujita, Shuji Kaneda, Yu Murano, Daisuke Itoh
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Patent number: 9732236Abstract: After there is prepared a conductive paste which contains fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, coarse copper particles having an average particle diameter of 0.3 to 20 ?m, a glycol solvent, such as ethylene glycol, and at least one of a polyvinylpyrrolidone (PVP) resin and a polyvinyl butyral (PVB) resin and wherein the total amount of the fine copper particles and the coarse copper particles is 50 to 90% by weight, the weight ratio of the fine copper particles to the coarse copper particles being in the range of from 1:9 to 5:5, the conductive paste thus prepared is applied on a substrate by screen printing to be preliminary-fired by vacuum drying, and then, fired with light irradiation by irradiating with light having a wavelength of 200 to 800 nm at a pulse period of 500 to 2000 ?s and a pulse voltage of 1600 to 3800 V to form a conductive film on the substrate.Type: GrantFiled: December 5, 2014Date of Patent: August 15, 2017Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Shuji Kaneda, Hidefumi Fujita, Daisuke Itoh
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Patent number: 9721694Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.Type: GrantFiled: April 3, 2015Date of Patent: August 1, 2017Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Shuji Kaneda, Kimikazu Motomura, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha
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Publication number: 20160346838Abstract: A copper particle dispersing solution obtained by dispersing fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, such as benzotriazole, and coarse copper particles having an average particle diameter of 0.3 to 20 ?m in a dispersing medium, such as ethylene glycol, so as to cause the total amount of the fine copper particles and coarse copper particles to be 50 to 90% by weight and so as to cause the ratio of the weight of the fine copper particles to the weight of the coarse copper particles to be in the range of from 1:9 to 5:5, is applied on a substrate by screen printing or flexographic printing to be preliminary-fired with vacuum drying, and then, fired with light irradiation by irradiating light having a wavelength of 200 to 800 nm at a pulse period of 100 to 3000 ?m and a pulse voltage of 1600 to 3600 V, to form a conductive film on the substrate.Type: ApplicationFiled: October 31, 2014Publication date: December 1, 2016Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Hidefumi Fujita, Shuji Kaneda, Daisuke Itoh
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Publication number: 20160312043Abstract: After there is prepared a conductive paste which contains fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, coarse copper particles having an average particle diameter of 0.3 to 20 ?m, a glycol solvent, such as ethylene glycol, and at least one of a polyvinylpyrrolidone (PVP) resin and a polyvinyl butyral (PVB) resin and wherein the total amount of the fine copper particles and the coarse copper particles is 50 to 90% by weight, the weight ratio of the fine copper particles to the coarse copper particles being in the range of from 1:9 to 5:5, the conductive paste thus prepared is applied on a substrate by screen printing to be preliminary-fired by vacuum drying, and then, fired with light irradiation by irradiating with light having a wavelength of 200 to 800 nm at a pulse period of 500 to 2000 ?s and a pulse voltage of 1600 to 3800 V to form a conductive film on the substrate.Type: ApplicationFiled: December 5, 2014Publication date: October 27, 2016Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Shuji Kaneda, Hidefumi Fujita, Daisuke Itoh
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Publication number: 20150243400Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.Type: ApplicationFiled: April 3, 2015Publication date: August 27, 2015Applicant: DOWA Electronics Materials Co., Ltd.Inventors: Shuji KANEDA, Kimikazu MOTOMURA, Tatsuya KARIYASU, Yutaka HISAEDA, Kosuke IHA
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Patent number: 9034214Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.Type: GrantFiled: December 25, 2009Date of Patent: May 19, 2015Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Shuji Kaneda, Kimikazu Motomura, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha
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Publication number: 20110253949Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.Type: ApplicationFiled: December 25, 2009Publication date: October 20, 2011Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Shuji Kaneda, Kimikazu Motomura, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha