Patents by Inventor Shuji Kaneda

Shuji Kaneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11894171
    Abstract: Provided is an Al-containing hexagonal ferrite magnetic powder which produces an excellent durability-improving effect on a magnetic recording medium, wherein uniform pulverization of the magnetic powder can be easily achieved by dispersion treatment in preparation of a magnetic coating material even in cases where the magnetic powder has a small primary particle size or has a composition which is likely to produce hard secondary particles. The magnetic powder for a magnetic recording medium is an Al-containing hexagonal ferrite magnetic powder having an Al/Fe molar ratio of 0.030 to 0.200, and has a particle size distribution in which the volume ratio of particles having a particle size of 30 ?m or more as measured by a laser diffraction particle size distribution analyzer with a dispersion pressure of 100 kPa is 5.0% or less, and an activation volume Vact of 1800 nm3 or less.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: February 6, 2024
    Assignees: DOWA ELECTRONICS MATERIALS CO., LTD., FUJIFILM CORPORATION
    Inventors: Hirohisa Omoto, Shuji Kaneda, Satoshi Shiki, Hiroyuki Suzuki, Toshio Tada
  • Patent number: 11404190
    Abstract: Provided is a hexagonal ferrite magnetic powder for a magnetic recording medium, containing hexagonal ferrite magnetic particles having aluminum hydroxide adhered on the surface thereof, the hexagonal ferrite magnetic powder having an Al/Fe molar ratio of 0.030 to 0.200, a Co/Fe molar ratio of 0.002 to 0.030, and a Nb/Fe molar ratio of 0.005 to 0.050, and having an Fe site valence AFe of 3.015 to 3.040 as calculated by AFe=(3+2×[Co/Fe]+5×[Nb/Fe])/(1+[Co/Fe]+[Nb/Fe]) wherein [Co/Fe] represents the Co/Fe molar ratio and [Nb/Fe] represents the Nb/Fe molar ratio, and preferably having an activation volume Vact of 1400 to 1800 nm3. This magnetic powder simultaneously achieves an increase in magnetic characteristics including SNR of a magnetic recording medium and a further increase in durability thereof.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: August 2, 2022
    Assignees: DOWA ELECTRONICS MATERIALS CO., LTD., FUJIFILM CORPORATION
    Inventors: Hirohisa Omoto, Shuji Kaneda, Hiroyuki Suzuki, Toshio Tada
  • Publication number: 20200185135
    Abstract: Provided is a hexagonal ferrite magnetic powder for a magnetic recording medium, containing hexagonal ferrite magnetic particles having aluminum hydroxide adhered on the surface thereof, the hexagonal ferrite magnetic powder having an Al/Fe molar ratio of 0.030 to 0.200, a Co/Fe molar ratio of 0.002 to 0.030, and a Nb/Fe molar ratio of 0.005 to 0.050, and having an Fe site valence AFe of 3.015 to 3.040 as calculated by AFe=(3+2×[Co/Fe]+5×[Nb/Fe])/(1+[Co/Fe]+[Nb/Fe]) wherein [Co/Fe] represents the Co/Fe molar ratio and [Nb/Fe] represents the Nb/Fe molar ratio, and preferably having an activation volume Vact of 1400 to 1800 nm3. This magnetic powder simultaneously achieves an increase in magnetic characteristics including SNR of a magnetic recording medium and a further increase in durability thereof.
    Type: Application
    Filed: December 4, 2019
    Publication date: June 11, 2020
    Inventors: Hirohisa OMOTO, Shuji KANEDA, Hiroyuki SUZUKI, Toshio TADA
  • Publication number: 20200161035
    Abstract: Provided is an Al-containing hexagonal ferrite magnetic powder which produces an excellent durability-improving effect on a magnetic recording medium, wherein uniform pulverization of the magnetic powder can be easily achieved by dispersion treatment in preparation of a magnetic coating material even in cases where the magnetic powder has a small primary particle size or has a composition which is likely to produce hard secondary particles. The magnetic powder for a magnetic recording medium is an Al-containing hexagonal ferrite magnetic powder having an Al/Fe molar ratio of 0.030 to 0.200, and has a particle size distribution in which the volume ratio of particles having a particle size of 30 ?m or more as measured by a laser diffraction particle size distribution analyzer with a dispersion pressure of 100 kPa is 5.0% or less, and an activation volume Vact of 1800 nm3 or less.
    Type: Application
    Filed: November 14, 2019
    Publication date: May 21, 2020
    Inventors: Hirohisa OMOTO, Shuji KANEDA, Satoshi SHIKI, Hiroyuki SUZUKI, Toshio TADA
  • Publication number: 20180077798
    Abstract: To provide a copper electroconductive film formed on a paper substrate, the copper electroconductive film being considerably improved in weather resistance and electroconductivity. The problem can be achieved by an electroconductive film formed by pressing a sintered electroconductive film formed by sintering copper particles in a coating film containing copper powder on a paper substrate along with the substrate, the electroconductive film having an area ratio of copper occupying on a cross section of the electroconductive film in parallel to a thickness direction thereof of 82.0% or more. The electroconductive film can be produced by pressing, for example, by roll press to from 90 to 190° C., after light sintering.
    Type: Application
    Filed: December 16, 2015
    Publication date: March 15, 2018
    Inventors: Hidefumi FUJITA, Shuji KANEDA, Daisuke ITOH
  • Publication number: 20170362455
    Abstract: After there is prepared a conductive paste which contains fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, such as benzotriazole, coarse copper particles having an average particle diameter of 0.
    Type: Application
    Filed: January 6, 2016
    Publication date: December 21, 2017
    Applicant: Dowa Electronics Materials Co., Ltd.
    Inventors: Hidefumi Fujita, Shuji Kaneda, Yu Murano, Daisuke Itoh
  • Patent number: 9732236
    Abstract: After there is prepared a conductive paste which contains fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, coarse copper particles having an average particle diameter of 0.3 to 20 ?m, a glycol solvent, such as ethylene glycol, and at least one of a polyvinylpyrrolidone (PVP) resin and a polyvinyl butyral (PVB) resin and wherein the total amount of the fine copper particles and the coarse copper particles is 50 to 90% by weight, the weight ratio of the fine copper particles to the coarse copper particles being in the range of from 1:9 to 5:5, the conductive paste thus prepared is applied on a substrate by screen printing to be preliminary-fired by vacuum drying, and then, fired with light irradiation by irradiating with light having a wavelength of 200 to 800 nm at a pulse period of 500 to 2000 ?s and a pulse voltage of 1600 to 3800 V to form a conductive film on the substrate.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: August 15, 2017
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Shuji Kaneda, Hidefumi Fujita, Daisuke Itoh
  • Patent number: 9721694
    Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: August 1, 2017
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shuji Kaneda, Kimikazu Motomura, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha
  • Publication number: 20160346838
    Abstract: A copper particle dispersing solution obtained by dispersing fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, such as benzotriazole, and coarse copper particles having an average particle diameter of 0.3 to 20 ?m in a dispersing medium, such as ethylene glycol, so as to cause the total amount of the fine copper particles and coarse copper particles to be 50 to 90% by weight and so as to cause the ratio of the weight of the fine copper particles to the weight of the coarse copper particles to be in the range of from 1:9 to 5:5, is applied on a substrate by screen printing or flexographic printing to be preliminary-fired with vacuum drying, and then, fired with light irradiation by irradiating light having a wavelength of 200 to 800 nm at a pulse period of 100 to 3000 ?m and a pulse voltage of 1600 to 3600 V, to form a conductive film on the substrate.
    Type: Application
    Filed: October 31, 2014
    Publication date: December 1, 2016
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Hidefumi Fujita, Shuji Kaneda, Daisuke Itoh
  • Publication number: 20160312043
    Abstract: After there is prepared a conductive paste which contains fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, coarse copper particles having an average particle diameter of 0.3 to 20 ?m, a glycol solvent, such as ethylene glycol, and at least one of a polyvinylpyrrolidone (PVP) resin and a polyvinyl butyral (PVB) resin and wherein the total amount of the fine copper particles and the coarse copper particles is 50 to 90% by weight, the weight ratio of the fine copper particles to the coarse copper particles being in the range of from 1:9 to 5:5, the conductive paste thus prepared is applied on a substrate by screen printing to be preliminary-fired by vacuum drying, and then, fired with light irradiation by irradiating with light having a wavelength of 200 to 800 nm at a pulse period of 500 to 2000 ?s and a pulse voltage of 1600 to 3800 V to form a conductive film on the substrate.
    Type: Application
    Filed: December 5, 2014
    Publication date: October 27, 2016
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shuji Kaneda, Hidefumi Fujita, Daisuke Itoh
  • Publication number: 20150243400
    Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.
    Type: Application
    Filed: April 3, 2015
    Publication date: August 27, 2015
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Shuji KANEDA, Kimikazu MOTOMURA, Tatsuya KARIYASU, Yutaka HISAEDA, Kosuke IHA
  • Patent number: 9034214
    Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.
    Type: Grant
    Filed: December 25, 2009
    Date of Patent: May 19, 2015
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shuji Kaneda, Kimikazu Motomura, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha
  • Publication number: 20110253949
    Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.
    Type: Application
    Filed: December 25, 2009
    Publication date: October 20, 2011
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shuji Kaneda, Kimikazu Motomura, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha