Abstract: An etching method includes etching a silicon substrate with a liquid composition containing an alkaline organic compound, water, and a boron compound with a content in the range of 1% by mass to 14% by mass. The boron compound is at least one of boron sesquioxide, sodium tetraborate, metaboric acid, sodium perborate, sodium borohydride, zinc borate, and ammonium borate.

Abstract: A method of manufacturing a substrate of a liquid ejection head including: forming a plurality of recesses in a silicon wafer; etching the silicon wafer with etchant to form a depression and a plurality of through holes formed from the plurality of the recesses in the depression; and manufacturing a plurality of substrates of the liquid ejection head from the silicon wafer by dividing the silicon wafer on the basis of through holes.

Abstract: The invention provides a process for producing a liquid ejection head having an ejection orifice forming member in which an ejection orifice for ejecting a liquid has been formed, and a substrate having an energy-generating element for generating energy for ejecting a liquid from the ejection orifice on the side of a front surface thereof, the process includes the steps of providing a film having a support, a first layer and a second layer in this order, arranging the film on the substrate in such a manner that the second layer faces the front surface, detaching the support from the film arranged, forming the ejection orifice in the second layer, and removing at least a part of the first layer from the second layer.

Abstract: An etching method includes etching a silicon substrate with a liquid composition containing an alkaline organic compound, water, and a boron compound with a content in the range of 1% by mass to 14% by mass. The boron compound is at least one of boron sesquioxide, sodium tetraborate, metaboric acid, sodium perborate, sodium borohydride, zinc borate, and ammonium borate.

Abstract: A method for manufacturing an inkjet recording head includes preparing a substrate having a mold to become an ink flow passage and an orifice layer covering the mold, and immersing the substrate in a solvent, whereby in immersing the substrate in the solvent, the mold at the substrate immersed in the solvent is irradiated with deep-UV light.

Abstract: An etching chamber includes a chamber body including a flow channel and an opening mounted the substrate to be etched and the opening communicating with the flow channel and a sealing member provided in the periphery of the opening and configured to close a gap between the substrate and the chamber body when the substrate is mounted in the opening, wherein the sealing member includes a first groove provided on an upper surface of the sealing member which comes into abutment with the substrate when the substrate is mounted in the opening, a second groove provided on a sealing member bottom surface on a side opposite from the upper surface of the sealing member, and at least one communicating hole communicating with the first groove and the second groove.

Abstract: A manufacturing method of a liquid discharging head includes: preparing a substrate having an energy-generating element and a resin layer on a first face side; irradiating a laser beam on the substrate so as to pass through the resin layer to form a hole serving as a liquid supply port in the substrate; removing a portion of the resin layer including a region which the laser beam has passed through, thereby forming a portion from which the resin layer has been removed as a channel, and forming a portion in which the resin layer remains as a side wall; and forming a discharge port forming member on a far side from the substrate of the side wall, and to form the channel forming member using the side wall and the discharge port forming member.

Abstract: A method for processing a silicon wafer is provided. The method includes allowing an etchant to flow along a surface of the silicon wafer to form a line in which a plurality of apertures are arranged in a flow direction of the etchant from an upstream side to a downstream side. The apertures arranged in the line include a first aperture formed on the most upstream side and a second aperture formed downstream of the first aperture in the flow direction of the etchant. The first aperture and the second aperture are subjected to different processes after being formed.

Abstract: A method for producing a liquid-discharge-head substrate includes a step of preparing a silicon substrate including, at a front-surface side of the silicon substrate, an energy generating element; a step of forming a first etchant introduction hole on the front-surface side of the silicon substrate; a step of supplying a first etchant into the first etchant introduction hole formed on the front-surface side of the silicon substrate, and supplying a second etchant to a back-surface side of the silicon substrate; a step of stopping the supply of the second etchant; and a step of, after the supply of the second etchant has been stopped, forming a liquid supply port extending through front and back surfaces of the silicon substrate by the supply of the first etchant.

Abstract: Disclosed is a method of including the steps of preparing a substrate having a flow-path-wall member; bonding the flow-path-wall member to a resin layer that is composed of a photo-curing resin and serves as the ejection port member such that spaces serving as the flow paths are provided between the substrate and the photo-curing resin; providing through-holes in the resin layer such that the spaces communicate with the outside air; exposing part of the resin layer to light to form an exposed portion and an unexposed portion; heating the exposed portion of the resin layer; and removing the unexposed portion from the heated resin layer to form the ejection ports, removing the unexposed portion from the heated resin layer to form the ejection ports, thereby forming the ejection port member.

Abstract: Provided is a processing method for an ink jet head substrate, including: forming a barrier layer on a substrate and forming a seed layer on the barrier layer; forming a resist film on the seed layer and patterning the resist film so that the patterned resist film corresponds to a pad portion for electrically connecting an ink jet head to an outside of the ink jet head; forming the pad portion in an opening of the patterned resist film; removing the resist film; subjecting the substrate to anisotropic etching to form an ink supply port; removing the barrier layer and the seed layer; and performing laser processing from a surface of the substrate.

Abstract: Provided is a method of manufacturing a substrate for a liquid discharge head including a first face, energy generating elements which generate the energy to be used to discharge a liquid to a second face opposite to the first face, and liquid supply ports for supplying the liquid to the energy generating elements. The method includes preparing a silicon substrate having, at the first face, an etching mask layer having an opening corresponding to a portion where the liquid supply ports are to be formed, and having first recesses provided within the opening, and second recesses provided in the region of the second face where the liquid supply ports are to be formed, the first recesses and the second recesses being separated from each other by a portion of the substrate; and etching the silicon substrate by crystal anisotropic etching from the opening of the first face to form the liquid supply ports.

Abstract: A process for producing a substrate for a liquid ejection head in which a depressed portion is formed on a second surface that is a surface opposite to a first surface of a silicon substrate having an element formation region on the first surface with a peripheral side region left, the process including the steps of (1) forming an etching mask layer covering the second surface of the silicon substrate; (2) subjecting the etching mask layer and the silicon substrate to laser abrasion processing to form a pattern opening that does not pass through the silicon substrate; and (3) performing a wet etching process to the silicon substrate where the pattern opening is formed from a side of the second surface to form the depressed portion. The depressed portion is formed over a center side region including a position corresponding to the element formation region.

Abstract: A substrate for a liquid ejection head, including: forming a sacrifice layer on a first surface of a silicon substrate in a region in which a liquid supply port is to open, the sacrifice layer containing aluminum which is selectively etched with respect to the silicon substrate; forming an etching mask on a second surface which is a rear surface of the first surface of the silicon substrate, the etching mask having an opening corresponding to the sacrifice layer; a first etching step of etching the silicon substrate by using the etching mask as a mask and by using a first etchant containing 8 mass % or more and less than 15 mass % of tetramethylammonium hydroxide; and after the first etching step, a second etching step of removing the sacrifice layer by using a second etchant containing 15 mass % or more and 25 mass % or less of tetramethylammonium hydroxide.

Abstract: A process for producing an ejection orifice forming member including the steps of forming a laminate including a first negative photosensitive resin layer that contains a first photoacid generator, and a second negative photosensitive resin layer that is formed on the first negative photosensitive resin layer and contains a second photoacid generator; forming a first latent image and a second latent image on the first negative photosensitive resin layer and the second negative photosensitive resin layer, respectively, by collectively subjecting the first negative photosensitive resin layer and the second negative photosensitive resin layer to exposure; performing a heat treatment after the exposure; and forming the ejection orifice by a development treatment. The first photoacid generator in the first latent image has an acid diffusion length greater than the acid diffusion length of the second photoacid generator in the second latent image.

Abstract: A manufacturing method of a liquid discharging head includes: preparing a substrate having an energy-generating element and a resin layer on a first face side; irradiating a laser beam on the substrate so as to pass through the resin layer to form a hole serving as a liquid supply port in the substrate; removing a portion of the resin layer including a region which the laser beam has passed through, thereby forming a portion from which the resin layer has been removed as a channel, and forming a portion in which the resin layer remains as a side wall; and forming a discharge port forming member on a far side from the substrate of the side wall, and to form the channel forming member using the side wall and the discharge port forming member.

Abstract: The invention provides a process for producing a liquid ejection head having an ejection orifice forming member in which an ejection orifice for ejecting a liquid has been formed, and a substrate having an energy-generating element for generating energy for ejecting a liquid from the ejection orifice on the side of a front surface thereof, the process includes the steps of providing a film having a support, a first layer and a second layer in this order, arranging the film on the substrate in such a manner that the second layer faces the front surface, detaching the support from the film arranged, forming the ejection orifice in the second layer, and removing at least a part of the first layer from the second layer.

Abstract: A method of manufacturing a substrate of a liquid ejection head including: forming a plurality of recesses in a silicon wafer; etching the silicon wafer with etchant to form a depression and a plurality of through holes formed from the plurality of the recesses in the depression; and manufacturing a plurality of substrates of the liquid ejection head from the silicon wafer by dividing the silicon wafer on the basis of through holes.

Abstract: A method for processing a silicon wafer is provided, the method including allowing an etchant to flow along a surface of the silicon wafer to form a line in which a plurality of apertures are arranged in a flow direction of the etchant from an upstream side to a downstream side, wherein the apertures arranged in the line includes a first aperture formed on the most upstream side and a second aperture formed downstream of the first aperture in the flow direction of the etchant, and wherein the first aperture and the second aperture are subjected to different processes after being formed.

Abstract: A manufacturing method for a substrate for an ink jet head, including formation of an ink supply port in a silicon substrate, the method includes a step of forming, on one side of the substrate, an etching mask layer having an opening at a position corresponding ink supply port; a step of forming unpenetrated holes through the opening of the etching mask layer in at least two rows in a longitudinal direction of the opening; and a step of forming the ink supply port by crystal anisotropic etching of the substrate in the opening.