Patents by Inventor Shuji Manda
Shuji Manda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11961863Abstract: An imaging element including: a photoelectric conversion layer including a compound semiconductor material; a contact layer disposed to be stacked on the photoelectric conversion layer and including a diffusion region of first electrically-conductive type impurities in a selective region; a first insulating layer provided to be opposed to the photoelectric conversion layer with the contact layer interposed therebetween and having a first opening at a position facing the diffusion region; and a second insulating layer provided to be opposed to the contact layer with the first insulating layer interposed therebetween and having a second opening that communicates with the first opening and is smaller than the first opening.Type: GrantFiled: September 4, 2019Date of Patent: April 16, 2024Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Yuya Kumagai, Shuji Manda, Shunsuke Maruyama, Ryosuke Matsumoto
-
Patent number: 11877083Abstract: A solid-state imaging device according to an embodiment of the present disclosure includes two or more pixels. The pixels each include a photoelectric converter, a charge holding section, and a transfer transistor. The charge holding section holds electric charge transferred from the photoelectric converter. The transfer transistor transfers electric charge from the photoelectric converter to the charge holding section. The pixels each further include a light blocking section that is disposed in a layer between the photoelectric converter and the charge holding section. The light blocking section has an opening which a vertical gate runs through. The pixels each further include a charge blocking section that blocks transfer of electric charge to the transfer transistor via a region between an edge, of the opening, closer to the charge holding section and the vertical gate.Type: GrantFiled: December 2, 2019Date of Patent: January 16, 2024Assignee: Sony Semiconductor Solutions CorporationInventors: Shuji Manda, Atsushi Okuyama, Tomoyuki Hirano
-
Patent number: 11862652Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: GrantFiled: November 21, 2022Date of Patent: January 2, 2024Assignee: SONY GROUP CORPORATIONInventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
-
Publication number: 20230411424Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: ApplicationFiled: August 21, 2023Publication date: December 21, 2023Applicant: Sony Group CorporationInventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
-
Patent number: 11804561Abstract: A light receiving element (1) according to an embodiment of the present disclosure includes: a semiconductor layer including a compound semiconductor material; a first impurity diffusion region (12A) provided on one surface of the semiconductor layer; and a second impurity diffusion region (12B) provided around the first impurity diffusion region (12A). The second impurity diffusion region (12B) has a lower impurity concentration than an impurity concentration of the first impurity diffusion region (12A).Type: GrantFiled: February 21, 2020Date of Patent: October 31, 2023Assignee: Sony Semiconductor Solutions CorporationInventor: Shuji Manda
-
Publication number: 20230223420Abstract: A first light receiving element according to an embodiment of the present disclosure includes a plurality of pixels, a photoelectric converter that is provided as a layer common to the plurality of pixels, and contains a compound semiconductor material, and a first electrode layer that is provided between the plurality of pixels on light incident surface side of the photoelectric converter, and has a light-shielding property.Type: ApplicationFiled: January 18, 2023Publication date: July 13, 2023Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Shuji MANDA, Ryosuke MATSUMOTO, Suguru SAITO, Shigehiro IKEHARA, Tetsuji YAMAGUCHI, Shunsuke MARUYAMA
-
Patent number: 11616093Abstract: A first light receiving element according to an embodiment of the present disclosure includes a plurality of pixels, a photoelectric converter that is provided as a layer common to the plurality of pixels, and contains a compound semiconductor material, and a first electrode layer that is provided between the plurality of pixels on light incident surface side of the photoelectric converter, and has a light-shielding property.Type: GrantFiled: December 12, 2018Date of Patent: March 28, 2023Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Shuji Manda, Ryosuke Matsumoto, Suguru Saito, Shigehiro Ikehara, Tetsuji Yamaguchi, Shunsuke Maruyama
-
Publication number: 20230081078Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: ApplicationFiled: November 21, 2022Publication date: March 16, 2023Applicant: Sony Group CorporationInventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
-
Publication number: 20230022127Abstract: There is provided a light-detecting device. A light-detecting device includes a first substrate including a first electrode, a semiconductor layer, a first insulating film, and a via, and a second substrate that faces the first substrate and is electrically connected to the semiconductor layer through the via. The semiconductor layer includes a compound semiconductor material. The first electrode includes a first portion and the second portion. The first portion of the first electrode is in contact with the semiconductor layer, and the second portion is in contact with both the first insulating film and the via.Type: ApplicationFiled: November 27, 2020Publication date: January 26, 2023Inventors: Ryosuke MATSUMOTO, Shuji MANDA, Shunsuke MARUYAMA
-
Publication number: 20230014646Abstract: There is provided a light detecting device. The light detecting device includes an element substrate including an element region and a peripheral region and a circuit substrate that faces the element substrate and is electrically connected to the semiconductor layer through the first wiring layer. The element region includes a first wiring layer and a semiconductor layer. The semiconductor layer includes a compound semiconductor material, and the peripheral region is outside the element region in a plan view. An outer boundary of the element substrate is different from an outer boundary of the circuit substrate.Type: ApplicationFiled: November 19, 2020Publication date: January 19, 2023Inventors: Ryosuke MATSUMOTO, Shuji MANDA, Shunsuke MARUYAMA, Taizo TAKACHI
-
Patent number: 11557623Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: GrantFiled: January 11, 2021Date of Patent: January 17, 2023Assignee: SONY CORPORATIONInventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
-
Patent number: 11476285Abstract: A light-receiving device includes at least one pixel. The at least one pixel includes a first electrode; a second electrode; and a photoelectric conversion layer between the first electrode and the second electrode. The photoelectric conversion layer is configured to convert incident infrared light into electric charge. The photoelectric conversion layer has a first section and a second section. The first section is closer to the first electrode than the second section, and the second section is closer to the second electrode than the first section. At least one of the first section and the second section have a plurality of surfaces.Type: GrantFiled: November 17, 2017Date of Patent: October 18, 2022Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Shuji Manda, Tomoyuki Hirano
-
Publication number: 20220271070Abstract: There is provided a solid-state imaging device including: a first semiconductor layer including a photoelectric converter and an electric charge accumulation section for each pixel, the electric charge accumulation section in which a signal electric charge generated in the photoelectric converter is accumulated; a pixel separation section that is provided in the first semiconductor layer, and partitions a plurality of the pixels from each other; a second semiconductor layer that is provided with a pixel transistor and is stacked on the first semiconductor layer, the pixel transistor that reads the signal electric charge of the electric charge accumulation section; and a first shared coupling section that is provided between the second semiconductor layer and the first semiconductor layer, and is provided to straddle the pixel separation section and is electrically coupled to a plurality of the electric charge accumulation sections.Type: ApplicationFiled: June 26, 2020Publication date: August 25, 2022Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Keiichi NAKAZAWA, Koichiro ZAITSU, Nobutoshi FUJII, Yohei HIURA, Shigetaka MORI, Shintaro OKAMOTO, Keiji OHSHIMA, Shuji MANDA, Junpei YAMAMOTO, Yui YUGA, Shinichi MIYAKE, Tomoki KAMBE, Ryo OGATA, Tatsuki MIYAJI, Shinji NAKAGAWA, Hirofumi YAMASHITA, Yasushi HAMAMOTO, Naohiko KIMIZUKA
-
Publication number: 20220165896Abstract: A light receiving element (1) according to an embodiment of the present disclosure includes: a semiconductor layer including a compound semiconductor material; a first impurity diffusion region (12A) provided on one surface of the semiconductor layer; and a second impurity diffusion region (12B) provided around the first impurity diffusion region (12A). The second impurity diffusion region (12B) has a lower impurity concentration than an impurity concentration of the first impurity diffusion region (12A).Type: ApplicationFiled: February 21, 2020Publication date: May 26, 2022Inventor: Shuji MANDA
-
Publication number: 20220052092Abstract: According to the present disclosure, there is provided an imaging device including: a first semiconductor layer (180) formed on a semiconductor substrate; a second semiconductor layer (170) formed on the first semiconductor layer (180) and having an opposite conductivity type to the first semiconductor layer (180); a pixel separation portion (150) configured to demarcate a pixel region including the first semiconductor layer (180) and the second semiconductor layer (170); a first electrode (130) connected to the first semiconductor layer (180) from one surface side of the semiconductor substrate; and a metal layer (152) connected to the second semiconductor layer (170) from a light irradiation surface side which is the other surface of the semiconductor substrate and buried in the pixel separation portion (150) in at least a part of the semiconductor substrate in a thickness direction.Type: ApplicationFiled: September 17, 2019Publication date: February 17, 2022Inventors: KOJI FURUMI, SHUJI MANDA, RYOSUKE MATSUMOTO, TOMOYUKI HIRANO
-
Publication number: 20220052098Abstract: An imaging element including: a photoelectric conversion layer including a compound semiconductor material; a contact layer disposed to be stacked on the photoelectric conversion layer and including a diffusion region of first electrically-conductive type impurities in a selective region; a first insulating layer provided to be opposed to the photoelectric conversion layer with the contact layer interposed therebetween and having a first opening at a position facing the diffusion region; and a second insulating layer provided to be opposed to the contact layer with the first insulating layer interposed therebetween and having a second opening that communicates with the first opening and is smaller than the first opening.Type: ApplicationFiled: September 4, 2019Publication date: February 17, 2022Inventors: YUYA KUMAGAI, SHUJI MANDA, SHUNSUKE MARUYAMA, RYOSUKE MATSUMOTO
-
Publication number: 20210400225Abstract: A solid-state imaging device according to an embodiment of the present disclosure includes two or more pixels. The pixels each include a photoelectric converter, a charge holding section, and a transfer transistor. The charge holding section holds electric charge transferred from the photoelectric converter. The transfer transistor transfers electric charge from the photoelectric converter to the charge holding section. The pixels each further include a light blocking section that is disposed in a layer between the photoelectric converter and the charge holding section. The light blocking section has an opening which a vertical gate runs through. The pixels each further include a charge blocking section that blocks transfer of electric charge to the transfer transistor via a region between an edge, of the opening, closer to the charge holding section and the vertical gate.Type: ApplicationFiled: December 2, 2019Publication date: December 23, 2021Inventors: Shuji MANDA, Atsushi OKUYAMA, Tomoyuki HIRANO
-
Patent number: 11127910Abstract: An imaging device according to the disclosure includes: a semiconductor substrate including an effective pixel region in which a plurality of pixels are disposed, and a peripheral region provided around the effective pixel region; an organic photoelectric conversion layer provided on side of the semiconductor substrate on which a light receiving surface is disposed; a first sealing layer provided on the semiconductor substrate; a recess provided in the first sealing layer on the effective pixel region; and a light shielding film provided on the first sealing layer on the peripheral region.Type: GrantFiled: February 15, 2017Date of Patent: September 21, 2021Assignee: SONY CORPORATIONInventors: Masahiro Joei, Shigehiro Ikehara, Shuji Manda
-
Patent number: 11049906Abstract: The present technology relates to an imaging device, a manufacturing device, and a manufacturing method. The imaging device includes an organic photoelectric conversion film, an upper electrode provided in an upper portion of the organic photoelectric conversion film, a lower electrode provided in a lower portion of the organic photoelectric conversion film, and a metal thin film provided between the organic photoelectric conversion film and the upper electrode or between the organic photoelectric conversion film and the lower electrode. The metal thin film is provided between the organic photoelectric conversion film and the upper electrode. The upper electrode is formed of an oxide semiconductor, a metal oxide, and the metal thin film. The present technology can be applied to a vertical spectral imaging device.Type: GrantFiled: January 31, 2020Date of Patent: June 29, 2021Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Masahiro Joei, Shuji Manda
-
Publication number: 20210183924Abstract: A light-receiving device includes at least one pixel. The at least one pixel includes a first electrode; a second electrode; and a photoelectric conversion layer between the first electrode and the second electrode. The photoelectric conversion layer is configured to convert incident infrared light into electric charge. The photoelectric conversion layer has a first section and a second section. The first section is closer to the first electrode than the second section, and the second section is closer to the second electrode than the first section. At least one of the first section and the second section have a plurality of surfaces.Type: ApplicationFiled: November 17, 2017Publication date: June 17, 2021Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Shuji MANDA, Tomoyuki HIRANO