Abstract: An aspect of the present invention relates to composite aggregate particles, which include a fine particle compound (a1) containing at least either an amorphous titanosilicate compound or an aluminosilicate compound, and a plastic powder (a2). The plastic powder (a2) is attached to at least a part of the surface of the fine particle compound (a1). The pore volume and the average particle size D50 of the composite aggregate particles satisfy the following formula: pore volume (ml/g)?0.0010×D50 (?m)+1.60.

Abstract: An embodiment of the present invention relates to an adsorbent which contains a fine particle compound containing an aluminosilicate compound and activated carbon particles, wherein the fine particle compound containing an aluminosilicate compound has a specific surface area of 300 m2/g or more and an average particle size of 10 to 200 ?m and includes particles having a particle size of 10 ?m or less in volume particle size distribution at 10 volume % or less, and the activated carbon particles have a mode diameter of 0.06 to 0.6 mm.

Abstract: To provide a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, and a laminated and a circuit board using the same. In this film, a change ratio of a dielectric constant (?r2) of the film after heating to a dielectric constant (?r1) of the film before the heating satisfies the following formula (I) where the film is heated for 1 hour at a temperature in a range from a temperature being 30° C. lower than a melting point of the film to a temperature being 10° C. higher than the melting point, |?r2??r1|/?r1×100?5??(I) where ?r1 denotes the relative dielectric constant before the heating, ?r2 denotes the relative dielectric constant after the heating. These relative dielectric constants are measured at the same frequency in a range of 1 to 100 GHz.

Abstract: A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad, and the first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.

Abstract: Provided is a circuit board being composed of at least a thermoplastic liquid crystal polymer film and an adhesive layer containing a polyphenylene ether-based resin, the circuit board capable of being formed or shaped at a low temperature, and a method of manufacturing the same. The thermoplastic liquid crystal polymer film constitutes at least one circuit board material selected from the group consisting of an insulating substrate, a circuit layer material and a coverlay. The film is laminated to another circuit board material via the adhesive layer. The glass transition temperature of the adhesive layer is in a range from 200° C. to 300° C.

Abstract: A thermoplastic liquid polymer film and a method of producing the same are provided. The method includes preparing a thermoplastic liquid crystal polymer film that has dielectric constants of not larger than 3.25 both in an MD direction and in a TD direction; and performing drawing of the film while heating the film at a temperature in a range from a temperature (Td-60° C.) that is 60° C. lower than a heat deformation temperature (Td) of the film to a temperature (Td-5° C.) that is 5° C. lower than Td. The temperature of the heating during the drawing of the film may be in a range from a temperature (Td-40° C.) that is 40° C. lower than a heat deformation temperature (Td) of the film subjected to the drawing to a temperature (Td-10° C.) that is 10° C. lower than Td.

Abstract: Provided are N-acyl-?-lactam derivatives represented by the following general formula, from which a photoresist composition capable of controlling an acid diffusion length to be short is obtained; a polymer obtained by polymerizing the N-acyl-?-lactam derivative represented by the following general formula as one of starting materials; and a photoresist composition containing the polymer, where the structural variables are as defined herein.

Abstract: To provide a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, and a laminated and a circuit board using the same. In this film, a change ratio of a dielectric constant (?r2) of the film after heating to a dielectric constant (?r1) of the film before the heating satisfies the following formula (I) where the film is heated for 1 hour at a temperature in a range from a temperature being 30° C. lower than a melting point of the film to a temperature being 10° C. higher than the melting point, |?r2??r1|/?r1×100?5??(I) where ?r1 denotes the relative dielectric constant before the heating, ?r2 denotes the relative dielectric constant after the heating. These relative dielectric constants are measured at the same frequency in a range of 1 to 100 GHz.

Abstract: Disclosed are an N-acyl-?-lactam derivative represented by the following general formula, from which a photoresist composition capable of controlling an acid diffusion length to be short is obtained; a polymer obtained by polymerizing the N-acyl-?-lactam derivative represented by the following general formula as one of starting materials; and a photoresist composition containing the polymer.

Abstract: Provided are N-acyl-?-lactam derivatives represented by the following general formula, from which a photoresist composition capable of controlling an acid diffusion length to be short is obtained; a polymer obtained by polymerizing the N-acyl-?-lactam derivative represented by the following general formula as one of starting materials; and a photoresist composition containing the polymer, where the structural variables are as defined herein.

Abstract: Disclosed are an N-acyl-?-lactam derivative represented by the following general formula, from which a photoresist composition capable of controlling an acid diffusion length to be short is obtained; a polymer obtained by polymerizing the N-acyl-?-lactam derivative represented by the following general formula as one of starting materials; and a photoresist composition containing the polymer.

Abstract: The aqueous dispersion of the present invention is produced by incorporating a block copolymer (II) into an aqueous dispersion (I) of a block copolymer (I) in an aqueous solution containing a basic compound. The block copolymer (I) is composed of a polymer block (A) mainly constituted by a constitutional unit derived from an olefin monomer and a polymer block (B) constituted by a constitutional unit derived from a vinyl monomer (b1) having a carboxyl group, a carboxylic anhydride group or a sulfonic group and a constitutional unit derived from another vinyl monomer (b2) copolymerizable with the vinyl monomer (b1). The content of the basic component is 0.05 equiv or more of the carboxyl group, carboxylic anhydride group or sulfonic group, each contained in the unit derived from the vinyl monomer (b1).