Patents by Inventor Shuji Tomimatsu

Shuji Tomimatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230196848
    Abstract: A vehicle communication system includes a relay device that relays communication and a first communication bus and a second communication bus that connect between the relay device and vehicle control ECUs, and the relay device and the vehicle control ECUs perform communication of control data relating to a control operation for a vehicle by using the first communication bus and perform communication of the control data and/or communication of non-control data by using the second communication bus.
    Type: Application
    Filed: December 7, 2022
    Publication date: June 22, 2023
    Inventors: Shuji Tomimatsu, Tomoya Kitano, Tatsuroh Saitoh, Takumi Nomura, Sora Nishigaki
  • Publication number: 20230199490
    Abstract: In order to monitor communication by a frame column performed among electronic controllers, a communication monitoring device determines some or all of fields configuring a frame as an object section, extracts the object section as an attention section from the frame received from an in-vehicle network, and verifies validity of the received frame based on the attention section.
    Type: Application
    Filed: December 6, 2022
    Publication date: June 22, 2023
    Inventors: Takumi Nomura, Tomoya Kitano, Tatsuroh Saitoh, Shuji Tomimatsu, Sora Nishigaki
  • Publication number: 20210287457
    Abstract: A communication control system includes: first/second control unit configured to control vehicle; first relay unit communicatively connected to the first control unit and having input unit to which data signal from diagnostic unit diagnosing state of the vehicle is input; second relay unit communicatively connected to the second control unit; first communication line communicatively connecting the first relay unit and the second relay unit; and second communication line disposed in parallel to the first communication line and communicatively connecting the first/second relay units. The data signal input to the first relay unit includes identification information. The first relay unit controls flow of data so that the data signal input to the first relay unit is transmitted through the second communication line when the data signal input to the first relay unit includes the identification information set to be communicated through the second communication line.
    Type: Application
    Filed: March 3, 2021
    Publication date: September 16, 2021
    Inventors: Satoshi Furuhashi, Nobuaki Takeo, Shuji Tomimatsu, Tatsuro Saito
  • Patent number: 8582586
    Abstract: In an onboard gateway apparatus, when data is received from one network, the received data is stored in the buffer. The buffer includes a first storage area for storing data in the order of priority of an identifier (ID) attached to the data and a second storage area for storing data in the order in which the data is received. A control means stores the received data in one of the first and second storage areas based on the attached identifier, and sends the data to another network in accordance with the priority of the ID of the data. As to data passing through the first storage area, sending in the order of priority is ensured. As to data passing through the second storage area, sending in the order in which the data is received is ensured.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: November 12, 2013
    Assignees: Honda Motor Co., Ltd., Honda Elesys Co., Ltd.
    Inventors: Michitaka Tsuboi, Makoto Ikeda, Yoshiaki Murata, Kazuhisa Yamamoto, Kazuo Hirabayashi, Tetsuya Yashiki, Kazunari Okada, Shuji Tomimatsu, Hiroshi Nishimura
  • Patent number: 8509942
    Abstract: Surface 27 of molten metal within a mold is constantly monitored by camera 25. Camera 25 records the surface from an obliquely upward position of the mold in an area that does not affect the casting process. Various analyzing frames such as analysis band 35, molten metal pattern 37, and injection monitoring part 43, are set with respect to the information recorded by the camera 25. The analysis band 35 includes the surface (molten metal part 31c), and is set to a predetermined width so that the direction of surface change is in the longitudinal direction. The width of the analysis band 35 is set as wide as possible in a range that does not block the discharge part (molten metal part 31a). Inside the analysis band 35, the rate of change of the binary data is calculated by the analyzing part.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: August 13, 2013
    Assignee: Furukawa Electronic Co., Ltd.
    Inventors: Shuji Tomimatsu, Daisuke Nishide
  • Patent number: 8201614
    Abstract: A method of controlling composition of a molten copper or a molten copper alloy during continuous cast, comprising the steps of determining continuously specific resistance of the molten copper or the molten copper alloy; calculating the composition of the molten copper or the molten copper alloy based on relationships between specific resistance of the molten copper or the molten copper alloy and each constituent which are preliminarily comprehended; and controlling the composition of the molten copper or the molten copper alloy based on the calculated composition. It is possible to consider temperature or content of dissolved oxygen to calculate the composition.
    Type: Grant
    Filed: November 28, 2008
    Date of Patent: June 19, 2012
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Hirokazu Yoshida, Tsukasa Takazawa, Shuji Tomimatsu
  • Patent number: 8176966
    Abstract: A process for producing a copper alloy material from a copper alloy of a precipitation reinforced type, which contains a process to perform individually a dissolution of a pure copper and a dissolution of an additional element or a mother alloy containing the same, comprises the steps of: melting an element and/or a mother alloy at a same time, that is selected from a Ni, a Co, an Si, a Ni—Cu mother alloy, a Co—Cu mother alloy, an Si—Cu mother alloy, a Ni—Si—Cu mother alloy, and a Co—Si—Cu mother alloy with combining therebetween, and melting thereof with an assistance of a generation of a heat of mixing, in a case of forming a high density melt containing at least either one of the Ni or the Co, and the Si, as high density thereof; forming the high density melt as a content of the Ni to be 80 mass % at maximum; and forming an alloy molten metal having a predetermined component and concentration, by adding the melt into a pure copper molten metal to be supplied from another melting furnace.
    Type: Grant
    Filed: November 28, 2008
    Date of Patent: May 15, 2012
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Hirokazu Yoshida, Tsukasa Takazawa, Toshio Abe, Shuji Tomimatsu
  • Publication number: 20100329272
    Abstract: In an onboard gateway apparatus, when data is received from one network, the received data is stored in the buffer. The buffer includes a first storage area for storing data in the order of priority of an identifier (ID) attached to the data and a second storage area for storing data in the order in which the data is received. A control means stores the received data in one of the first and second storage areas based on the attached identifier, and sends the data to another network in accordance with the priority of the ID of the data. As to data passing through the first storage area, sending in the order of priority is ensured. As to data passing through the second storage area, sending in the order in which the data is received is ensured.
    Type: Application
    Filed: April 1, 2010
    Publication date: December 30, 2010
    Applicants: HONDA MOTOR CO., LTD., HONDA ELESYS CO., LTD.
    Inventors: Michitaka Tsuboi, Makoto Ikeda, Yoshiaki Murata, Kazuhisa Yamamoto, Kazuo Hirabayashi, Tetsuya Yashiki, Kazunari Okada, Shuji Tomimatsu, Hiroshi Nishimura
  • Publication number: 20100307711
    Abstract: A method of controlling composition of a molten copper or a molten copper alloy during continuous cast, comprising the steps of determining continuously specific resistance of the molten copper or the molten copper alloy; calculating the composition of the molten copper or the molten copper alloy based on relationships between specific resistance of the molten copper or the molten copper alloy and each constituent which are preliminarily comprehended; and controlling the composition of the molten copper or the molten copper alloy based on the calculated composition. It is possible to consider temperature or content of dissolved oxygen to calculate the composition.
    Type: Application
    Filed: November 28, 2008
    Publication date: December 9, 2010
    Inventors: Hirokazu Yoshida, Tsukasa Takazawa, Shuji Tomimatsu
  • Publication number: 20100307712
    Abstract: A process for producing a copper alloy material from a copper alloy of a precipitation reinforced type, which contains a process to perform individually a dissolution of a pure copper and a dissolution of an additional element or a mother alloy containing the same, comprises the steps of: melting an element and/or a mother alloy at a same time, that is selected from a Ni, a Co, an Si, a Ni—Cu mother alloy, a Co—Cu mother alloy, an Si—Cu mother alloy, a Ni—Si—Cu mother alloy, and a Co—Si—Cu mother alloy with combining therebetween, and melting thereof with an assistance of a generation of a heat of mixing, in a case of forming a high density melt containing at least either one of the Ni or the Co, and the Si, as high density thereof; forming the high density melt as a content of the Ni to be 80 mass % at maximum; and forming an alloy molten metal having a predetermined component and concentration, by adding the melt into a pure copper molten metal to be supplied from another melting furnace.
    Type: Application
    Filed: November 28, 2008
    Publication date: December 9, 2010
    Inventors: Hirokazu Yoshida, Tsukasa Takazawa, Toshio Abe, Shuji Tomimatsu
  • Patent number: 7176588
    Abstract: A starter drive device which drives a starter motor by, upon actuation of a starter switch, turning a starter relay ON and OFF via an electronic control device, wherein the electronic control device includes: an interface circuit; a power source control circuit; a calculation device and a delay circuit; a buffer; an addition circuit; a latch circuit; a first pull up circuit; a second pull up circuit; and wherein, if the power source control circuit has detected a drop of voltage of the power source when the starter motor is being driven, along with stopping the calculation device, the buffer disconnects the calculation device from the latch circuit, and controls the starter relay by operating the driver circuit via the latch circuit based upon the signals from the interface circuit and the second pull up circuit.
    Type: Grant
    Filed: September 9, 2005
    Date of Patent: February 13, 2007
    Assignees: Keihin Corporation, Honda Motor Co., Ltd.
    Inventors: Takuya Yahagi, Takashi Hisaki, Shuji Tomimatsu, Satoshi Arai, Shigeki Baba
  • Publication number: 20060082316
    Abstract: A starter drive device which drives a starter motor by, upon actuation of a starter switch, turning a starter relay ON and OFF via an electronic control device, wherein the electronic control device includes: an interface circuit; a power source control circuit; a calculation device and a delay circuit; a buffer; an addition circuit; a latch circuit; a first pull up circuit; a second pull up circuit; and wherein, if the power source control circuit has detected a drop of voltage of the power source when the starter motor is being driven, along with stopping the calculation device, the buffer disconnects the calculation device from the latch circuit, and controls the starter relay by operating the driver circuit via the latch circuit based upon the signals from the interface circuit and the second pull up circuit.
    Type: Application
    Filed: September 9, 2005
    Publication date: April 20, 2006
    Inventors: Takuya Yahagi, Takashi Hisaki, Shuji Tomimatsu, Satoshi Arai, Shigeki Baba