Abstract: A pad-temperature regulating device is disclosed, which can improve a responsiveness of a control for a surface temperature of a polishing pad and regulate the surface temperature of the polishing pad without causing defects, such as scratches, on the substrate. The pad-temperature regulating apparatus includes: a heat exchanger disposed above the polishing pad, whose temperature is maintained at a predetermined temperature; a pad-temperature measuring device configured to measure the surface temperature of the polishing pad; a distance sensor configured to measure a separation distance between the polishing pad and the heat exchanger; an elevating mechanism for moving the heat exchanger vertically with respect to the polishing pad; and a controller configured to control operation of the elevating mechanism based on measured values of the pad-temperature measuring device.

Abstract: In one embodiment of the present invention, a cleaning member 90 is attached to the surface of a cleaning member attaching part 10. The cleaning member attaching part 10 has a main body 20, a cleaning liquid introduction part 30 extending inside the main body 20, and a plurality of cleaning liquid supply holes 40 communicating with the cleaning liquid introduction part 30. The cleaning liquid introduction part 30 is configured such that cleaning liquid flows in from a first end part 11 side, and an area proportion of the cleaning liquid supply holes 40 in a second region located on a second end part 12 side opposite to the first end part 11 to a surface of the main body 20 is larger than the area proportion of the cleaning liquid supply holes 40 in a first region located on the first end part 11 side to the surface of the main body 20.

Abstract: A method of manufacturing a plate-shaped solder according to the invention of the present application includes an aggregating step of aggregating a plurality of thread solders and a crimping step of crimping the plurality of aggregated thread solders to one another to form a plate-shaped solder. A manufacturing device of a plate-shaped solder according to the invention of the present application includes an aggregating portion for aggregating a plurality of thread solders and a crimping portion for crimping the plurality of thread solders to one another in the aggregating portion to form a plate-shaped solder.

Abstract: A substrate cleaning device that facilitates control of the amount of liquid supplied to a substrate and reduces adverse influences of the liquid supplied to a bearing part on the substrate is provided. The substrate cleaning device includes: a holding part that has a bearing part configured to rotatably hold a cleaning member for cleaning a substrate; a first supply part that has at least a part provided inside the holding part and supplies a first liquid into the cleaning member through the inside of the holding part; and a second supply part that supplies a second liquid to the bearing part.

Abstract: A polishing apparatus includes a polishing table which supports a polishing pad, a polishing head which polishes a substrate by pressing the substrate against a polishing surface of the polishing pad, a pad temperature measuring device which measures a temperature of the polishing surface, a pad temperature adjusting device which adjusts the temperature of the polishing surface, and a control device which controls the operation of the pad temperature adjusting device based on the temperature of the polishing surface measured by the pad temperature measuring device. The pad temperature adjusting device includes a pad heater which is disposed to be separated upward from the polishing surface, and the pad heater includes a longitudinal portion which extends in a substantially radial direction of the polishing pad and a slit-shaped injection port which is formed in a longitudinal direction of the longitudinal portion and injects a heating fluid toward the polishing surface.

Abstract: The present invention relates to a method and a system of automatically calibrating a radiation thermometer disposed in a polishing apparatus. This method includes: placing a heating device (61), to which a measurement body (68) is attached, below the radiation thermometer (48); and using a controller (40) of the polishing apparatus coupled to the heating device (61) to heat a temperature of the measurement body (68) to a plurality of target temperatures (Ta), to measure the temperatures of the measurement body (68) at each target temperature (Ta) with the radiation thermometer (48), to calculate temperature deviation amounts which are differences between each of the target temperatures (Ta) and temperature output values of the radiation thermometer (48) corresponding to each target temperature (Ta), and to calibrate the radiation thermometer (48) so that all the temperature deviation amounts are within a preset reference range.

Abstract: A cleaning apparatus capable of effectively removing dirt attached to a bottom surface of a heat exchanger, is disclosed. The cleaning apparatus cleans the heat exchanger for regulating a surface temperature of a polishing pad. This cleaning apparatus includes: a moving mechanism configured to move the heat exchanger between a temperature-regulating position in which the heat exchanger can exchange heat with the polishing pad, and a retreat position in which the heat exchanger is separated from a surface of the polishing pad; and a cleaning mechanism configured to clean a bottom surface of the heat exchanger moved to the retreat position The retreat position is located on a side of the polishing pad. The cleaning mechanism includes at least one cleaning nozzle for ejecting a cleaning liquid to the bottom surface of the heat exchanger, or a cleaning tank in which the bottom surface of the heat exchanger can be immersed.

Abstract: Provided is a technique that can optimize a flow volume of a first liquid supplied into a cleaning member. A substrate cleaning apparatus includes: a holding portion having a bearing portion that rotatably holds a cleaning member for cleaning a substrate; a first supply portion that is at least partially arranged inside the holding portion and supplies the first liquid into the cleaning member through the inside of the holding portion; and a second supply portion that supplies a second liquid to the bearing portion. The holding portion is equipped with a discharge portion that has a discharge port for discharging the liquid accumulated inside the holding portion. The discharge portion is equipped with a flow meter that measures a flow volume of the liquid discharged from the discharge port.

Abstract: A device for manufacturing a plate solder according to the present invention includes a reel on which a thread solder is wound; a cutter that cuts the thread solder, provided between the reel and an end part of the thread solder extending from the reel; an aggregating part that aggregates a plurality of cut thread solders such that the plurality of thread solders are in contact with one another; and a roller that rolls the plurality of aggregated thread solders and pressure bonds them to one another to form a plate solder.

Abstract: A pad-temperature regulating device is disclosed, which can improve a responsiveness of a control for a surface temperature of a polishing pad and regulate the surface temperature of the polishing pad without causing defects, such as scratches, on the substrate. The pad-temperature regulating apparatus includes: a heat exchanger disposed above the polishing pad, whose temperature is maintained at a predetermined temperature; a pad-temperature measuring device configured to measure the surface temperature of the polishing pad; a distance sensor configured to measure a separation distance between the polishing pad and the heat exchanger; an elevating mechanism for moving the heat exchanger vertically with respect to the polishing pad; and a controller configured to control operation of the elevating mechanism based on measured values of the pad-temperature measuring device.

Abstract: A system (5) includes a heat exchanging member (11) and a liquid supply unit (30). The liquid supply unit (30) includes a pump device (32) that adjusts the flow amount of a liquid flowing through a heating liquid supply line (HSL), a needle valve (MNV) that is attached to a cooling liquid supply line (CSL), and a control device (40) that controls operations of the pump device (32) and the needle valve (MNV).

Abstract: A cleaning apparatus capable of effectively removing dirt attached to a bottom surface of a heat exchanger, is disclosed. The cleaning apparatus cleans the heat exchanger for regulating a surface temperature of a polishing pad. This cleaning apparatus includes: a moving mechanism configured to move the heat exchanger between a temperature-regulating position in which the heat exchanger can exchange heat with the polishing pad, and a retreat position in which the heat exchanger is separated from a surface of the polishing pad; and a cleaning mechanism configured to clean a bottom surface of the heat exchanger moved to the retreat position The retreat position is located on a side of the polishing pad. The cleaning mechanism includes at least one cleaning nozzle for ejecting a cleaning liquid to the bottom surface of the heat exchanger, or a cleaning tank in which the bottom surface of the heat exchanger can be immersed.

Abstract: In one embodiment of the present invention, a cleaning member 90 is attached to the surface of a cleaning member attaching part 10. The cleaning member attaching part 10 has a main body 20, a cleaning liquid introduction part 30 extending inside the main body 20, and a plurality of cleaning liquid supply holes 40 communicating with the cleaning liquid introduction part 30. The cleaning liquid introduction part 30 is configured such that cleaning liquid flows in from a first end part 11 side, and an area proportion of the cleaning liquid supply holes 40 in a second region located on a second end part 12 side opposite to the first end part 11 to a surface of the main body 20 is larger than the area proportion of the cleaning liquid supply holes 40 in a first region located on the first end part 11 side to the surface of the main body 20.

Abstract: A substrate cleaning device that facilitates control of the amount of liquid supplied to a substrate and reduces adverse influences of the liquid supplied to a bearing part on the substrate is provided. The substrate cleaning device includes: a holding part that has a bearing part configured to rotatably hold a cleaning member for cleaning a substrate; a first supply part that has at least a part provided inside the holding part and supplies a first liquid into the cleaning member through the inside of the holding part; and a second supply part that supplies a second liquid to the bearing part.

Abstract: A method of checking a leakage of fluid from a fluid line includes connecting a leakage checking line to the fluid line between a supply valve and a return valve, regulating a pressure regulator disposed in the leakage checking line such that a pressure of fluid of the leakage checking line becomes the same as a pressure of fluid of the fluid line; closing the supply valve and the return valve and opening an opening/closing valve disposed in the leakage checking line; acquiring a flow rate of the fluid that flows in the leakage checking line by a flowmeter disposed in the leakage checking line; comparing the flow rate of the fluid acquired at the acquiring with a predetermined threshold; and determining that the fluid of the fluid line is leaked, when the flow rate of the fluid acquired at the acquiring is larger than the predetermined threshold.

Abstract: A device for manufacturing a plate solder according to the present invention includes a reel on which a thread solder is wound; a cutter that cuts the thread solder, provided between the reel and an end part of the thread solder extending from the reel; an aggregating part that aggregates a plurality of cut thread solders such that the plurality of thread solders are in contact with one another; and a roller that rolls the plurality of aggregated thread solders and pressure bonds them to one another to form a plate solder.

Abstract: A method of manufacturing a plate-shaped solder according to the invention of the present application includes an aggregating step of aggregating a plurality of thread solders and a crimping step of crimping the plurality of aggregated thread solders to one another to form a plate-shaped solder. A manufacturing device of a plate-shaped solder according to the invention of the present application includes an aggregating portion for aggregating a plurality of thread solders and a crimping portion for crimping the plurality of thread solders to one another in the aggregating portion to form a plate-shaped solder.