Abstract: There is provided a cooling structure whose performance for cooling ring members and brushes is enhanced. In a cooling structure applied to a slip ring device including ring members provided to an input shaft and brushes contacting with these ring members, the input shaft includes a shaft member where an external spline portion is formed, and a cylindrical member that is installed over the external circumference of the shaft member so that an internal spline portion formed on the cylindrical member is meshed with the external spline portion, and that the ring members are fixed to the cylindrical member. The internal spline portion is formed upon a portion of the inner circumferential surface of the cylindrical member that lies on the radially inward side of the ring members.

Abstract: When sub-field magnets 8a and 8b are not provided, the magnetic fluxes that pass through main field magnets 7a and 7b respectively and interlink with stator windings 5 and first rotor windings 6, and the magnetic fluxes that pass through the main field magnets 7a and 7b respectively and short-circuit adjacent main field magnets 7b? and 7a? are generated. The short-circuited magnetic fluxes do not contribute to torque generation, therefore a favorable inner periphery magnetic circuit is not formed, and the torque received between a second rotor 4 and a first rotor 3 becomes small. When sub-field magnets 8a and 8b are provided, on the other hand, the short-circuited magnet fluxes interlink with the first rotor windings 6 by the sub-field magnets 8a and 8b, and an inner periphery magnetic circuit is formed, whereby the motor driving torque received between the second rotor 4 and the first rotor 3 increases.

Abstract: There is provided a slip ring device in which three ring members through are provided so as to be lined up in sequence along an axial line of an input shaft and brushes contact with the ring members respectively, three inner bus bars are provided and are supported by a sleeve portion of the input shaft, and contacting groove portions are provided so as to dent in the radially outwards direction into the inner circumferential surfaces of the ring members and extend along the axial line direction, with one end portions of the inner bus bars being set into these contacting groove portions respectively.

Abstract: An engine is started to meet the driver's benefit in a vehicle control device for executing a control for starting the engine automatically if the engine has not been started for a predetermined period. The vehicle control device 10 stores the date when the engine (internal combustion engine) was last started (internal combustion engine start date). The vehicle control device 10 starts the engine 40 automatically upon movement of the vehicle after five weeks (first period) have elapsed from the internal combustion engine start date.

Abstract: There is provided a cooling structure whose performance for cooling ring members and brushes is enhanced. In a cooling structure applied to a slip ring device including ring members provided to an input shaft and brushes contacting with these ring members, the input shaft includes a shaft member where an external spline portion is formed, and a cylindrical member that is installed over the external circumference of the shaft member so that an internal spline portion formed on the cylindrical member is meshed with the external spline portion, and that the ring members are fixed to the cylindrical member. The internal spline portion is formed upon a portion of the inner circumferential surface of the cylindrical member that lies on the radially inward side of the ring members.

Abstract: A slip ring structure for facilitating an adjusting operation after assembling is provided. A slip ring structure 20 comprises slip rings 30U, 30V and 30W respectively provided to be rotatable about a common axis. The slip ring structure 20 comprises bus bars 40U, 40V and 40W connected to the slip rings 30U, 30V and 30W of the respective phases and extending in the axial direction. In at least one position in the axial direction, one of the bus bars, which has a shorter length in the axial direction, has a greater area in a cross section perpendicular to the axis.

Abstract: A rotating electric machine comprises: a rotating shaft; and a rotor which includes a conductor capable of generating a rotating magnetic field and is provided on a peripheral surface of the rotating shaft so as to be rotatable integrally therewith. The rotating shaft includes: an oil supply passage passing within the rotating shaft; and an oil supply hole which extends from the oil supply passage to the peripheral surface of the rotating shaft and opens opposite to the rotor. The rotor includes an oil passage which is disposed so as to face the peripheral surface of the rotating shaft and which communicates with the oil supply hole.

Abstract: A semiconductor module mounted on a vehicle is disclosed. The semiconductor module includes a semiconductor element, a forced-cooling type cooler, and a heat mass. Heat generated in the semiconductor element is conducted to the cooler. The heat mass is joined onto the semiconductor element, so as to be thermally coupled to the semiconductor element. The heat mass is formed such that the thermal resistance of a part of the heat mass that corresponds to a high temperature part of the semiconductor element in a heat generating state is lower than the thermal resistance of a part of the heat mass that corresponds to a lower temperature part of the semiconductor element.

Abstract: A semiconductor module mounted on a vehicle is disclosed. The semiconductor module includes a semiconductor element, a forced-cooling type cooler, and a heat mass. Heat generated in the semiconductor element is conducted to the cooler. The heat mass is joined onto the semiconductor element, so as to be thermally coupled to the semiconductor element. The heat mass is formed such that the thermal resistance of a part of the heat mass that corresponds to a high temperature part of the semiconductor element in a heat generating state is lower than the thermal resistance of a part of the heat mass that corresponds to a lower temperature part of the semiconductor element.