Abstract: The technology of this application relates to a chip package structure, a production method for a chip package structure, and an electronic device. The chip package structure includes a first connection layer having an upper surface and a lower surface that are opposite to each other, a die disposed on the upper surface of the first connection layer, a first conduction structure disposed on an upper surface of the die, a first plastic package layer covering the die and the first conduction structure, and a rewiring layer disposed on the first plastic package layer. At least a part of the first conduction structure is exposed from an upper surface of the first plastic package layer. The rewiring layer is coupled to the first conduction structure. A signal of the die can be directly led out through the first conduction structure and the rewiring layer.

Abstract: A dual-membrane on-line generator for an acid or alkali solution is provided, including an upper electrolytic cell body (3), a middle electrolytic cell body (4) and a lower electrolytic cell body (5) which are clamped by an upper fastening steel plate (1) and a lower fastening steel plate (2), an upper regeneration liquid channel (A), a middle eluent channel (B) and a lower regeneration liquid channel (C) being provided on the middle electrolytic cell body (4).

Abstract: A dual-membrane on-line generator for an acid or alkali solution is provided, including an upper electrolytic cell body (3), a middle electrolytic cell body (4) and a lower electrolytic cell body (5) which are clamped by an upper fastening steel plate (1) and a lower fastening steel plate (2), an upper regeneration liquid channel (A), a middle eluent channel (B) and a lower regeneration liquid channel (C) being provided on the middle electrolytic cell body (4).