Abstract: An optoelectronic assembly includes: (i) a substrate having a cavity, (ii) an optoelectronic device, which is disposed over the cavity and includes an array of multiple emitters configured to emit a predefined number of light beams in response to receiving one or more electrical signals, and (iii) an integrated circuit (IC), which is mounted within the cavity, between the substrate and the optoelectronic device, and is configured to drive the one or more electrical signals to the optoelectronic device.

Abstract: An active biopsy apparatus with a needle passage ablation function. The active biopsy apparatus comprises a radio frequency generator, a biopsy cannula and a biopsy tool, wherein the biopsy cannula is an active device, and is connected to the radio frequency generator by means of a connecting line; and a cannula wall of the biopsy cannula is provided with a radio frequency ablation electrode, and the biopsy tool is movably arranged inside the biopsy cannula. An active biopsy system with a needle passage ablation function, wherein a host system is arranged in a radio frequency generator, and the host system comprises a temperature monitoring module and a radio frequency ablation module. A radio frequency ablation system is compatible with a biopsy tool, such that the passive puncturing biopsy tool becomes part of an active system, and can be used for preventing needle passage bleeding and for needle passage implanting.

Abstract: Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.

Abstract: A damper arrangement may be used in a camera module that includes a first (e.g., stationary) and a second (e.g., dynamic) component. The second component may hold a lens such that the lens moves together with the second component. The damper arrangement may include an interface member that extends from the first or the second component to at least partially into a viscoelastic material within a volumetric space configured in the first component, the second component, or both. The interface member may include a mounting portion having a thickness and a viscoelastic material section, having a different thickness, that interacts with viscoelastic material to dampen motion of the second component, for example, during operation of a lens actuator to move the second component along an optical axis of the lens. The interface member may be a two-piece interface member, such as a pin soldered into a hole in a plate, for example.

Abstract: An energy-delivery device (10) includes a handle body (12), an antenna assembly (14) extending distally from the handle body (12), and a transmission line (16) configured to be detachably coupled to the antenna assembly (14).

Abstract: Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.

Abstract: Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.

Abstract: A damper arrangement may be used in a camera module that includes a first (e.g., stationary) and a second (e.g., dynamic) component. The second component may hold a lens such that the lens moves together with the second component. The damper arrangement may include an interface member that extends from the first or the second component to at least partially into a viscoelastic material within a volumetric space configured in the first component, the second component, or both. The interface member may include a mounting portion having a thickness and a viscoelastic material section, having a different thickness, that interacts with viscoelastic material to dampen motion of the second component, for example, during operation of a lens actuator to move the second component along an optical axis of the lens. The interface member may be a two-piece interface member, such as a pin soldered into a hole in a plate, for example.

Abstract: A damper arrangement may be used in a camera module that includes a first (e.g., stationary) and a second (e.g., dynamic) component. The second component may hold a lens such that the lens moves together with the second component. The damper arrangement may include an interface member that extends from the first or the second component to at least partially into a viscoelastic material within a volumetric space configured in the first component, the second component, or both. The interface member may include a mounting portion having a thickness and a viscoelastic material section, having a different thickness, that interacts with viscoelastic material to dampen motion of the second component, for example, during operation of a lens actuator to move the second component along an optical axis of the lens. The interface member may be a two-piece interface member, such as a pin soldered into a hole in a plate, for example.

Abstract: Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.

Abstract: A damper arrangement may be used in a camera module that includes a first (e.g., stationary) and a second (e.g., dynamic) component. The second component may hold a lens such that the lens moves together with the second component. The damper arrangement may include an interface member that extends from the first or the second component to at least partially into a viscoelastic material within a volumetric space configured in the first component, the second component, or both. The interface member may include a mounting portion having a thickness and a viscoelastic material section, having a different thickness, that interacts with viscoelastic material to dampen motion of the second component, for example, during operation of a lens actuator to move the second component along an optical axis of the lens. The interface member may be a two-piece interface member, such as a pin soldered into a hole in a plate, for example.

Abstract: A head stack assembly (HSA) for a disk drive includes an actuator body, at least one actuator arm extending from the actuator body, and a flexible printed circuit (FPC). The FPC includes first and second pluralities of electrically conductive FPC traces, each having a distal portion that terminates at a respective one of a plurality of FPC bond pads. The HSA also includes a head gimbal assembly (HGA) having a laminate flexure with a plurality of electrically conductive flexure bond pads that are bonded to the plurality of FPC bond pads. A width of at least one of the first plurality of FPC traces is greater than a width of at least one of the second plurality of FPC traces. The distal portion of at least one of the first plurality FPC traces includes a first opening therethrough, for example less than 1 mm from its corresponding FPC bond pad.