Patents by Inventor Shujun Tang

Shujun Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11945902
    Abstract: A two-component polyurethane composition comprising: an aqueous dispersion comprising an emulsion polymer and a specific sulphate and/or sulfonate surfactant, and a water-dispersible polyisocyanate; the emulsion polymer with a weight average molecular weight of 70,000 g/mol or less comprising, by weight based on the weight of the emulsion polymer, greater than 0.25% of structural units of a phosphorous-containing acid monomer and/or salts thereof, greater than 15% of structural units of a hydroxy-functional alkyl (meth)acrylate, structural units of an monoethylenically unsaturated nonionic monomer, and from zero to 10% of structural units of an additional acid monomer and/or salts thereof; and a process of preparing the two-component polyurethane composition.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: April 2, 2024
    Assignees: Dow Global Technologies LLC, Rohm and Haas Company
    Inventors: Daoshu Lin, Baoqing Zheng, Jia Tang, Dong Yun, Shujun Shu, Gary W. Dombrowski
  • Patent number: 11750900
    Abstract: Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: September 5, 2023
    Assignee: Apple Inc.
    Inventors: Scott W. Miller, Brian A. Argyres, Lindsay M. Alanen, Matthew D. Hill, Nicholas D. Smyth, Shujun Tang
  • Patent number: 11681158
    Abstract: A damper arrangement may be used in a camera module that includes a first (e.g., stationary) and a second (e.g., dynamic) component. The second component may hold a lens such that the lens moves together with the second component. The damper arrangement may include an interface member that extends from the first or the second component to at least partially into a viscoelastic material within a volumetric space configured in the first component, the second component, or both. The interface member may include a mounting portion having a thickness and a viscoelastic material section, having a different thickness, that interacts with viscoelastic material to dampen motion of the second component, for example, during operation of a lens actuator to move the second component along an optical axis of the lens. The interface member may be a two-piece interface member, such as a pin soldered into a hole in a plate, for example.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: June 20, 2023
    Assignee: Apple Inc.
    Inventors: Scott W. Miller, Nicholas D. Smyth, Hao Zheng, Shujun Tang, Zachary W. Birnbaum
  • Publication number: 20220401147
    Abstract: An energy-delivery device (10) includes a handle body (12), an antenna assembly (14) extending distally from the handle body (12), and a transmission line (16) configured to be detachably coupled to the antenna assembly (14).
    Type: Application
    Filed: July 3, 2019
    Publication date: December 22, 2022
    Inventors: Shujun Tang, Yong Feng, Peng Hou, Wei Zhang, Zhi Li, Jianfeng Gu
  • Publication number: 20220191356
    Abstract: Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.
    Type: Application
    Filed: March 4, 2022
    Publication date: June 16, 2022
    Applicant: Apple Inc.
    Inventors: Scott W. Miller, Brian A. Argyres, Lindsay M. Alanen, Matthew D. Hill, Nicholas D. Smyth, Shujun Tang
  • Patent number: 11272082
    Abstract: Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: March 8, 2022
    Assignee: Apple Inc.
    Inventors: Scott W. Miller, Brian A. Argyres, Lindsay M. Alanen, Matthew D. Hill, Nicholas D. Smyth, Shujun Tang
  • Publication number: 20210405387
    Abstract: A damper arrangement may be used in a camera module that includes a first (e.g., stationary) and a second (e.g., dynamic) component. The second component may hold a lens such that the lens moves together with the second component. The damper arrangement may include an interface member that extends from the first or the second component to at least partially into a viscoelastic material within a volumetric space configured in the first component, the second component, or both. The interface member may include a mounting portion having a thickness and a viscoelastic material section, having a different thickness, that interacts with viscoelastic material to dampen motion of the second component, for example, during operation of a lens actuator to move the second component along an optical axis of the lens. The interface member may be a two-piece interface member, such as a pin soldered into a hole in a plate, for example.
    Type: Application
    Filed: September 10, 2021
    Publication date: December 30, 2021
    Applicant: Apple Inc.
    Inventors: Scott W. Miller, Nicholas D. Smyth, Hao Zheng, Shujun Tang, Zachary W. Birnbaum
  • Patent number: 11119333
    Abstract: A damper arrangement may be used in a camera module that includes a first (e.g., stationary) and a second (e.g., dynamic) component. The second component may hold a lens such that the lens moves together with the second component. The damper arrangement may include an interface member that extends from the first or the second component to at least partially into a viscoelastic material within a volumetric space configured in the first component, the second component, or both. The interface member may include a mounting portion having a thickness and a viscoelastic material section, having a different thickness, that interacts with viscoelastic material to dampen motion of the second component, for example, during operation of a lens actuator to move the second component along an optical axis of the lens. The interface member may be a two-piece interface member, such as a pin soldered into a hole in a plate, for example.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: September 14, 2021
    Assignee: Apple Inc.
    Inventors: Scott W. Miller, Nicholas D. Smyth, Hao Zheng, Shujun Tang, Zachary W. Birnbaum
  • Publication number: 20210092261
    Abstract: Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.
    Type: Application
    Filed: September 17, 2020
    Publication date: March 25, 2021
    Applicant: Apple Inc.
    Inventors: Scott W. Miller, Brian A. Argyres, Lindsay M. Alanen, Matthew D. Hill, Nicholas D. Smyth, Shujun Tang
  • Publication number: 20200096782
    Abstract: A damper arrangement may be used in a camera module that includes a first (e.g., stationary) and a second (e.g., dynamic) component. The second component may hold a lens such that the lens moves together with the second component. The damper arrangement may include an interface member that extends from the first or the second component to at least partially into a viscoelastic material within a volumetric space configured in the first component, the second component, or both. The interface member may include a mounting portion having a thickness and a viscoelastic material section, having a different thickness, that interacts with viscoelastic material to dampen motion of the second component, for example, during operation of a lens actuator to move the second component along an optical axis of the lens. The interface member may be a two-piece interface member, such as a pin soldered into a hole in a plate, for example.
    Type: Application
    Filed: September 4, 2019
    Publication date: March 26, 2020
    Applicant: Apple Inc.
    Inventors: Scott W. Miller, Nicholas D. Smyth, Hao Zheng, Shujun Tang, Zachary W. Birnhaum
  • Patent number: 8295013
    Abstract: A head stack assembly (HSA) for a disk drive includes an actuator body, at least one actuator arm extending from the actuator body, and a flexible printed circuit (FPC). The FPC includes first and second pluralities of electrically conductive FPC traces, each having a distal portion that terminates at a respective one of a plurality of FPC bond pads. The HSA also includes a head gimbal assembly (HGA) having a laminate flexure with a plurality of electrically conductive flexure bond pads that are bonded to the plurality of FPC bond pads. A width of at least one of the first plurality of FPC traces is greater than a width of at least one of the second plurality of FPC traces. The distal portion of at least one of the first plurality FPC traces includes a first opening therethrough, for example less than 1 mm from its corresponding FPC bond pad.
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: October 23, 2012
    Assignee: Western Digital Technologies, Inc.
    Inventors: Tzong-Shii Pan, Daniel Nguyen, Shujun Tang