Patents by Inventor Shuk Man Wong

Shuk Man Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiple leadframe laminated IC package
    Patent number: 7449771
    Abstract: A method of fabricating an integrated circuit package. The method includes providing a first leadframe and a second leadframe, laminating the second leadframe to a portion of the first leadframe in order to create a multi-layer laminated leadframe, and mounting a semiconductor die on another portion of the first leadframe.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: November 11, 2008
    Assignee: ASAT Ltd.
    Inventors: Chun Ho Fan, Tsui Yee Lin, Kin Pui Kwan, Shui Ming Tse, Wing Him Lau, Shuk Man Wong
  • Multiple leadframe laminated IC package
    Patent number: 6734044
    Abstract: A method of fabricating an integrated circuit package. The method includes providing a first leadframe and a second leadframe, laminating the second leadframe to a portion of the first leadframe in order to create a multi-layer laminated leadframe, and mounting a semiconductor die on another portion of the first leadframe.
    Type: Grant
    Filed: June 10, 2002
    Date of Patent: May 11, 2004
    Assignee: ASAT Ltd.
    Inventors: Chun Ho Fan, Tsui Yee Lin, Kin Pui Kwan, Shui Ming Tse, Wing Him Lau, Shuk Man Wong