Patents by Inventor Shukuyo Yamada

Shukuyo Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10804621
    Abstract: According to one embodiment, a printed wiring board includes a wiring board, a connector part, a connection pad provided between the wiring board and the connector part and connected with the connector part with a solder material and a guide groove provided in the wiring board to be continuous to the connection pad, to guide a portion of the solder material from the connection pad.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: October 13, 2020
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Akira Tanaka, Masaya Hirashima, Satoru Yasui, Shukuyo Yamada, Masashi Watanabe
  • Publication number: 20200044366
    Abstract: According to one embodiment, a printed wiring board includes a wiring board, a connector part, a connection pad provided between the wiring board and the connector part and connected with the connector part with a solder material and a guide groove provided in the wiring board to be continuous to the connection pad, to guide a portion of the solder material from the connection pad.
    Type: Application
    Filed: July 29, 2019
    Publication date: February 6, 2020
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Akira TANAKA, Masaya HIRASHIMA, Satoru YASUI, Shukuyo YAMADA, Masashi WATANABE
  • Patent number: 10531559
    Abstract: According to one embodiment, provided are an electronic device and an electronic component protection substrate in which an electronic component is prevented from entering an irregular state. According to the electronic device of the present embodiment, an electronic component is soldered onto a pattern line of a printed circuit substrate, and a surface of the printed circuit substrate where the electronic component is disposed is formed as a recess such that the thickness of the printed circuit substrate in the recess part is thinned.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: January 7, 2020
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Akira Tanaka, Masaya Hirashima, Satoru Yasui, Shukuyo Yamada
  • Publication number: 20200006873
    Abstract: According to one embodiment, a connector includes a shell including an opening portion into which a plug is removably inserted, and reinforcing terminals which are integrally formed with the shell and are soldered to pads on a wiring substrate. At least the reinforcing terminals adjacent to the opening portion each includes an extending piece which projects from the shell so as to face the wiring substrate, and a leg portion which integrally extends from the extending piece in a direction of opening of the opening portion of the shell and includes a joint piece to be soldered to the pad.
    Type: Application
    Filed: June 28, 2019
    Publication date: January 2, 2020
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Shukuyo YAMADA
  • Patent number: 10348012
    Abstract: According to one embodiment, a connector includes an insulator and a contact terminal in which an end side is pressed into a counter-press-fit portion of the insulator, and the other end side comprises a soldered portion attached to a substrate with soldering. The contact terminal comprises a flux accumulation portion inside the counter-press-fit portion and/or in an extended end portion of the soldered portion.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: July 9, 2019
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Shukuyo Yamada, Masaya Hirashima, Tsuyoshi Kozai
  • Publication number: 20180366849
    Abstract: According to one embodiment, a connector includes an insulator and a contact terminal in which an end side is pressed into a counter-press-fit portion of the insulator, and the other end side comprises a soldered portion attached to a substrate with soldering. The contact terminal comprises a flux accumulation portion inside the counter-press-fit portion and/or in an extended end portion of the soldered portion.
    Type: Application
    Filed: November 27, 2017
    Publication date: December 20, 2018
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Shukuyo Yamada, Masaya Hirashima, Tsuyoshi Kozai
  • Publication number: 20180359849
    Abstract: According to one embodiment, provided are an electronic device and an electronic component protection substrate in which an electronic component is prevented from entering an irregular state. According to the electronic device of the present embodiment, an electronic component is soldered onto a pattern line of a printed circuit substrate, and a surface of the printed circuit substrate where the electronic component is disposed is formed as a recess such that the thickness of the printed circuit substrate in the recess part is thinned.
    Type: Application
    Filed: November 7, 2017
    Publication date: December 13, 2018
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Akira TANAKA, Masaya HIRASHIMA, Satoru YASUI, Shukuyo YAMADA
  • Patent number: 9825385
    Abstract: According to one embodiment, a holder includes a recessed portion and including an opening, and includes a contact exposed from part of a bottom surface of the recessed portion. A lid covers the holder from the recessed portion side, makes a space in the recessed portion airtight in an engaged state in which the opening of the recessed portion is closed, and includes an elastic member pushing down a contained object contained in the recessed portion. And a lock mechanism forms the engaged state between the lid and the holder.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: November 21, 2017
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Akira Tanaka, Masaya Hirashima, Shukuyo Yamada