Abstract: A light-emitting diode substrate, a manufacturing method thereof, and a display device are disclosed. The manufacturing method of the light-emitting diode substrate includes: forming an epitaxial layer group of M light-emitting diode chips on a substrate; transferring N epitaxial layer groups on N substrates onto a transition carrier substrate, the N epitaxial layer groups on the N substrates being densely arranged on the transition carrier substrate; and transferring at least part of N*M light-emitting diode chips corresponding to the N epitaxial layer groups on the transition carrier substrate onto a driving substrate, an area of the transition carrier substrate is greater than or equal to a sum of areas of the N substrates, M is a positive integer greater than or equal to 2, and N is a positive integer greater than or equal to 2.

Abstract: Provided are a device and a method for multi-angle stereoscopic imaging measurement of precipitation particles, including an optical illumination unit used for illuminating a sampling space; a multi-angle imaging unit used for performing multi-angle imaging on the precipitation particles; a data acquisition control unit used for controlling the optical illumination unit and the multi-angle imaging unit; a data processing unit used for processing and displaying image data of the precipitation particles; and a protection unit used for protecting the optical illumination unit, the multi-angle imaging unit and the data acquisition control unit.

Abstract: A frame sealing adhesive of the liquid-crystal phase shifter is disposed between two transparent substrates, the frame sealing adhesive encloses a first cavity, a first part of the metal-trace layer is located inside the first cavity, and a second part of the metal-trace layer is located outside the first cavity. The second part is disposed on first surfaces or second surfaces of the two transparent substrates. If the second part is disposed on the first surfaces of the two transparent substrates, metal cushion layers are provided between the frame sealing adhesive and the first surfaces of the two transparent substrates. If the second part is disposed on the second surfaces of the two transparent substrates, the first part and the second part are electrically connected by metal via holes provided in the transparent substrates, and the frame sealing adhesive contacts the first surfaces of the two transparent substrates.

Abstract: A display panel, a preparation method therefor, and an electronic device. The display panel comprises: a first substrate and a second substrate arranged oppositely; a reflection layer on one side of the first substrate; a color resist layer on the side of the reflection layer away from the first substrate; a pixel electrode layer on the side of the color resist layer away from the first substrate and comprising multiple sub-pixel electrodes arranged at intervals; a common electrode layer on one side of the second substrate; and pixel isolation columns between first and second substrates and defining multiple sub-pixel regions therebetween, are black and white charged microspheres in the sub-pixel regions, there are at least two sub-pixel electrodes in one sub-pixel region, and the area of orthographic projections of the sub-pixel electrodes in one sub-pixel region is less than that of the color resist layer, on the first substrate.

Abstract: A display panel, a method for driving a display panel, and a display apparatus are provided. The display panel includes a first base substrate and a plurality of pixels on one side of the first base substrate. Each pixel includes: a plurality of pixel sub-electrodes independent from each other and configured to form an electric field with an included angle greater than 0 with respect to a direction perpendicular to the first base substrate under control of incompletely same driving signals; a common electrode on a side of the pixel electrode away from the first base substrate; and an electrophoretic liquid layer between the pixel electrode and the common electrode, including a plurality of charged particles therein.

Abstract: An optical path structure, an optical path system, and a transfer method. The optical path structure includes a beam adjustment module configured to adjust a diameter of a laser beam and output a first beam; a beam shaping module configured to perform energy homogenization on the first beam to obtain a second beam; and a beam focusing module configured to focus the second beam and output a target light spot; the target light spot is used for irradiating a device substrate, so that a bonding material in the device substrate changes after being irradiated by the target light spot, and a target device is separated from a carrier substrate; where the bonding material is disposed between the target device and the carrier substrate.

Abstract: A display panel motherboard, a cutting method and a manufacturing method thereof, a display panel, and a display device are provided. The display panel motherboard includes at least three mother substrates, at least one display panel unit, and a cutting region. The at least three mother substrates are stacked with each other, at least a portion of the at least one display panel unit is surrounded by the cutting region, and an organic film layer is not disposed in at least two of the at least three mother substrates in the cutting region.

Abstract: A mass transfer method for micro light-emitting diodes (W) includes: picking up micro light-emitting diodes (W) on an element substrate (200) by using a transfer substrate (300), and transferring the micro light-emitting diodes (W) after pickup to an intermediate carrying substrate (400); and transferring micro light-emitting diodes (W), which are on the intermediate carrying substrate (400) and correspond to all sub-pixels (SPX) on a target substrate (100), into the sub-pixels (SPX) of the target substrate (100) at one time, such that all the sub-pixels (SPX) on the target substrate (100) receives the micro light-emitting diodes (W) at one time.

Abstract: A display panel, a manufacturing method of the display panel, and a display device including the display panel are provided. The display panel includes an insulating substrate; a first circuit at a first side of the insulating substrate; and a second circuit at a second side of the insulating substrate. The first side and the second side of the insulating substrate are opposite to each other in a first direction perpendicular to a display surface, and the first circuit and the second circuit on opposing sides of the insulating substrate are electrically connected by tapered through hole and tapered pad.

Abstract: A display panel motherboard, a cutting method and a manufacturing method thereof, a display panel, and a display device are provided. The display panel motherboard includes at least three mother substrates, at least one display panel unit, and a cutting region. The at least three mother substrates are stacked with each other, at least a portion of the at least one display panel unit is surrounded by the cutting region, and an organic film layer is not disposed in at least two of the at least three mother substrates in the cutting region.

Abstract: The present invention discloses a method, apparatus and system for detecting a fundus image on the basis of machine learning. The method comprises: acquiring a fundus image to be detected; classifying the entire region of the fundus image by using a first classification model to determine whether the fundus image contains a first feature; and if the fundus image does not contain any first feature, classifying a specific region in the fundus image by using at least one second classification model to determine whether the fundus image contains any second feature, wherein the saliency of the first features are greater than that of the second features.

Abstract: A light-emitting diode substrate, a manufacturing method thereof, and a display device are disclosed. The manufacturing method of the light-emitting diode substrate includes: forming an epitaxial layer group of M light-emitting diode chips on a substrate; transferring N epitaxial layer groups on N substrates onto a transition carrier substrate, the N epitaxial layer groups on the N substrates being densely arranged on the transition carrier substrate; and transferring at least part of N*M light-emitting diode chips corresponding to the N epitaxial layer groups on the transition carrier substrate onto a driving substrate, an area of the transition carrier substrate is greater than or equal to a sum of areas of the N substrates, M is a positive integer greater than or equal to 2, and N is a positive integer greater than or equal to 2.

Abstract: Provided are a display panel, a preparation method thereof, and a display apparatus. The display panel includes an array substrate and a color filter substrate aligned and combined into a cell. The color filter substrate includes a first base substrate and a plurality of color resist blocks arranged at intervals on the first base substrate. The array substrate includes a second base substrate and a plurality of pixel electrodes arranged at intervals on the second base substrate. The pixel electrodes are in one-to-one correspondence with the color resist blocks. The display panel includes a bending area and a non-bending area located at least on one side of the bending area. A density of the pixel electrodes in the bending area is less than that in the non-bending area, and a density of the color resist blocks in the bending area is less than that in the non-bending area.

Abstract: Provided are a display panel, a preparation method thereof, and a display apparatus. The display panel includes an array substrate and a color filter substrate aligned and combined into a cell. The color filter substrate includes a first base substrate and a plurality of color resist blocks arranged at intervals on the first base substrate. The array substrate includes a second base substrate and a plurality of pixel electrodes arranged at intervals on the second base substrate. The pixel electrodes are in one-to-one correspondence with the color resist blocks. The display panel includes a bending area and a non-bending area located at least on one side of the bending area. A density of the pixel electrodes in the bending area is less than that in the non-bending area, and a density of the color resist blocks in the bending area is less than that in the non-bending area.

Abstract: Disclosed are a display panel, a manufacturing method of the display panel, and a display device including the display panel. The display panel includes an insulating substrate; a first circuit at a first side of the insulating substrate; and a second circuit at a second side of the insulating substrate. The first side and the second side of the insulating substrate are opposite to each other in a first direction perpendicular to a display surface, and the first circuit and the second circuit are electrically connected via a conductor penetrating the insulating substrate in the first direction.

Abstract: The present invention discloses a method, apparatus and system for detecting a fundus image on the basis of machine learning. The method comprises: acquiring a fundus image to be detected; classifying the entire region of the fundus image by using a first classification model to determine whether the fundus image contains a first feature; and if the fundus image does not contain any first feature, classifying a specific region in the fundus image by using at least one second classification model to determine whether the fundus image contains any second feature, wherein the saliency of the first features are greater than that of the second features.

Abstract: The present disclosure provides a display substrate and a method of manufacturing the same, and a display device. The display substrate includes a base substrate; a driving circuit layer disposed on the base substrate; and a planarization layer disposed on a side of the driving circuit layer away from the base substrate and having a plurality of conductive pads therein, the plurality of conductive pads are respectively electrically coupled to electrodes in the driving circuit layer, and a surface of each of the plurality of conductive pads away from the base substrate is flush with a surface of the planarization layer away from the base substrate.