Patents by Inventor Shumei Cui

Shumei Cui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11126773
    Abstract: The disclosure provides a design method for paralleled SiC power switching devices based on wiring optimization which belongs to the field of power electronics technology, aiming at the problem that in the existing scheme of paralleled SiC devices, the optimal performance of SiC devices cannot be presented with paralleled multiple SiC devices due to limitations of the unequal switching losses and transient currents. The design method comprises at least three wiring separation slots being arranged in parallel and in sequence on a PCB circuit board; wherein a power half-bridge composed of two SiC devices is arranged in each wiring separation slot, thereby increasing a parasitic inductance between adjacent power half-bridges. The disclosure can improve the current sharing performance of the switching transient current existing in the application of multiple paralleled SiC devices, so that SiC devices can be applied to high-power and high-current power electronic converters stably and reliably.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: September 21, 2021
    Assignee: Harbin Institute of Technology
    Inventors: Qianfan Zhang, Jianzhen Qu, Shumei Cui, Jinxin Wang, Xue Yuan
  • Publication number: 20210133381
    Abstract: The disclosure provides a design method for paralleled SiC power switching devices based on wiring optimization which belongs to the field of power electronics technology, aiming at the problem that in the existing scheme of paralleled SiC devices, the optimal performance of SiC devices cannot be presented with paralleled multiple SiC devices due to limitations of the unequal switching losses and transient currents. The design method comprises at least three wiring separation slots being arranged in parallel and in sequence on a PCB circuit board; wherein a power half-bridge composed of two SiC devices is arranged in each wiring separation slot, thereby increasing a parasitic inductance between adjacent power half-bridges. The disclosure can improve the current sharing performance of the switching transient current existing in the application of multiple paralleled SiC devices, so that SiC devices can be applied to high-power and high-current power electronic converters stably and reliably.
    Type: Application
    Filed: September 18, 2020
    Publication date: May 6, 2021
    Inventors: Qianfan ZHANG, Jianzhen Qu, Shumei Cui, Jinxin Wang, Xue Yuan