Patents by Inventor Shumiao Sun

Shumiao Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11906572
    Abstract: The present application provides a structure and method for online detection of a metal via open circuit, a contact layer is on the substrate, a first metal layer is on the contact layer, a first metal via layer is on the first metal layer, a second metal via layer is on the first metal via layer metal layer, the contact layer comprises a plurality of contacts, the plurality of contacts are connected to the first metal layer, the first metal via layer comprises a plurality of first vias, the plurality of first vias are filled with metal; detecting by means of an E-beam technology. A problem in the process can be found in advance, so as to solve the problem in time and thus stop losses as soon as possible.
    Type: Grant
    Filed: July 11, 2022
    Date of Patent: February 20, 2024
    Assignee: Shanghai Huali Integrated Circuit Corporation
    Inventors: Shumiao Sun, Zhigang Yang, Qing Zhang
  • Publication number: 20230069433
    Abstract: The present application provides a structure and method for online detection of a metal via open circuit, a contact layer is on the substrate, a first metal layer is on the contact layer, a first metal via layer is on the first metal layer, a second metal via layer is on the first metal via layer metal layer, the contact layer comprises a plurality of contacts, the plurality of contacts are connected to the first metal layer, the first metal via layer comprises a plurality of first vias, the plurality of first vias are filled with metal; detecting by means of an E-beam technology. A problem in the process can be found in advance, so as to solve the problem in time and thus stop losses as soon as possible.
    Type: Application
    Filed: July 11, 2022
    Publication date: March 2, 2023
    Applicant: Shanghai Huali Integrated Circuit Corporation
    Inventors: Shumiao Sun, Zhigang Yang, Qing Zhang