Abstract: An exposure method for manufacture of semiconductor devices, includes moving a shutter having an edge so that the edge is related to a predetermined exposure region; projecting an exposure beam to the edge of the shutter and to at least a portion of the exposure region; determining a position of a shadow of the edge of the shutter formed by the exposure beam with respect to a predetermined coordinate system related to movement of a movable chuck; adjusting the shutter in accordance with the determination; placing a substrate on the chuck; moving the chuck so that the substrate is related to the exposure region; and controlling the exposure of the substrate with the exposure beam through the shutter.