Abstract: Miniaturization is facilitated in a semiconductor package provided with pixels. A semiconductor package includes a transparent member, a semiconductor chip, a photosensitive rib, and an interposer. In this semiconductor package, pixels are arranged on a part of a chip plane of the semiconductor chip. The photosensitive rib is a photosensitive resin disposed between a region not corresponding to the pixel in the chip plane of the semiconductor chip and the transparent member. Furthermore, the interposer is electrically connected to the semiconductor chip.

Abstract: A solid-state imaging apparatus is provided that, in a configuration including a mold resin portion formed around an image sensor and cover glass, enables potential burrs of the mold resin on a cover glass surface to be prevented without the need for a dedicated mold, the cover glass having a light blocking effect, and a method for manufacturing the solid-state imaging apparatus and electronic equipment are also provided. The solid-state imaging apparatus includes a substrate, an image sensor provided on the substrate, a transparent member provided on the image sensor via a support portion, and a mold resin portion formed around the image sensor and the transparent member on the substrate, and a front surface, a side surface, or a back surface of the transparent member is provided with a groove portion in a region outside a light receiving area of the image sensor.